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Michael S Yung, 513215 George Cir, Pasadena, CA 91107

Known as:
Michael D Yung Michael S Cheng Mike Yung Drmichael Yung Michael Syung My Ung

Michael Yung Phones & Addresses

3215 George Cir, Pasadena, CA 91107   

515 Madison Ave, Pasadena, CA 91101    626-7929275   

696 Colorado Blvd, Pasadena, CA 91101    626-4495420   

San Marino, CA   

Oak Park, IL   

Los Angeles, CA   

Chicago, IL   

Claremont, CA   

1570 Del Mar Ave, San Marino, CA 91108    626-7929275   

Work

Position: Medical Professional

Education

Degree: Graduate or professional degree

Languages

English • Chinese, Mandarin
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Mentions for Michael S Yung

Career records & work history

Medicine Doctors

Michael Yung Photo 1

Dr. Michael S Yung, Pasadena CA - DDS (Doctor of Dental Surgery)

Specialties:
Dentistry
Address:
696 E Colorado Blvd Suite 224, Pasadena, CA 91101
626-4495420 (Phone)
Languages:
English
Chinese, Mandarin
Michael Yung Photo 2

Michael Orin Yung

Specialties:
Internal Medicine

License Records

Michael Orin Yung Md

Licenses:
License #: 27791 - Active
Category: Medicine
Issued Date: Mar 3, 2014
Effective Date: Mar 3, 2014
Expiration Date: Oct 1, 2018
Type: Physician

Michael Orin Yung Md

Licenses:
License #: 6522 - Expired
Category: Medicine
Issued Date: Jul 1, 2011
Effective Date: Mar 3, 2014
Expiration Date: Jul 1, 2014
Type: Temporary Educational Permit

Resumes & CV records

Resumes

Michael Yung Photo 41

Entertainment Professional

Location:
Greater Los Angeles Area
Industry:
Entertainment
Michael Yung Photo 42

Michael Yung

Location:
United States
Michael Yung Photo 43

President At Klaxon Ent.

Location:
Greater Los Angeles Area
Industry:
Wholesale
Michael Yung Photo 44

Owner At Michael S. Yung Dds

Location:
Greater Los Angeles Area
Industry:
Health, Wellness and Fitness
Michael Yung Photo 45

Michael Yung

Location:
United States

Publications & IP owners

Us Patents

Optical Bond-Wire Interconnections And A Method For Fabrication Thereof

US Patent:
6655853, Dec 2, 2003
Filed:
Aug 25, 2000
Appl. No.:
09/648689
Inventors:
Daniel Yap - Thousand Oaks CA
Michael Yung - Los Angeles CA
Assignee:
HRL Laboratories, LLC - Malibu CA
Hughes Electronics Corporation - El Segundo CA
International Classification:
G02B 636
US Classification:
385 88, 385 14, 385 49, 438617
Abstract:
Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.

Optical Bond-Wire Interconnections And A Method For Fabrication Thereof

US Patent:
7207728, Apr 24, 2007
Filed:
Aug 26, 2003
Appl. No.:
10/649075
Inventors:
Daniel Yap - Thousand Oaks CA, US
Michael Yung - Los Angeles CA, US
Assignee:
HRL Laboratories, LLC - Malibu CA
Hughes Electronic Corporation - El Segundo CA
International Classification:
G02B 6/36
US Classification:
385 88
Abstract:
Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.

Optical Bond-Wire Interconnections And A Method For Fabrication Thereof

US Patent:
7309171, Dec 18, 2007
Filed:
Mar 19, 2007
Appl. No.:
11/725771
Inventors:
Daniel Yap - Thousand Oaks CA, US
Michael Yung - Los Angeles CA, US
Assignee:
HRL Laboratories, LLC - Malibu CA
International Classification:
G02B 6/36
US Classification:
385 88, 385 14, 385 47
Abstract:
Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.

Ppm Receiving System And Method Using Time-Interleaved Integrators

US Patent:
7349471, Mar 25, 2008
Filed:
Nov 19, 2003
Appl. No.:
10/707076
Inventors:
Albert Cosand - Agoura Hills CA, US
Donald A. Hitko - Malibu CA, US
Michael Yung - Los Angeles CA, US
Assignee:
The Boeing Company - Chicago IL
International Classification:
H03K 7/04
H03K 7/06
H03K 9/04
H03K 9/06
US Classification:
375239, 375346, 375259
Abstract:
A communication receiver () includes a data receiver () that receives a pulse-position modulated signal (). A clock circuit () separates a reference clock signal () into multiple coordinating clock signals A, B, and C. Multiple time integrators () are gated to generate multiple time-integrated signals in response to the pulse-position modulated signal () and the coordinating clock signals A, B, and C. A combiner () forms a demodulated signal from the time-integrated signals IntA, IntB, and IntC.

Non-Foster Impedance Power Amplifier

US Patent:
8374561, Feb 12, 2013
Filed:
Apr 27, 2010
Appl. No.:
12/768563
Inventors:
Michael W. Yung - Los Angeles CA, US
Donald A. Hitko - Grover Beach CA, US
Assignee:
HRL Laboratories, LLC - Malibu CA
International Classification:
H04B 1/04
US Classification:
455129, 455120, 343860
Abstract:
A non-Foster impedance power amplifier has a current amplifying device coupled in either an emitter-follower or source-follower configuration with a reactive load such as an antenna load. A negative impedance circuit is provided upstream of a gate or base or other control element of said current amplifying device.

Differential Negative Impedance Converters And Inverters With Variable Or Tunable Conversion Ratios

US Patent:
2012025, Oct 11, 2012
Filed:
Apr 6, 2012
Appl. No.:
13/441730
Inventors:
Donald A. Hitko - Grover Beach CA, US
Carson R. White - Agoura Hills CA, US
Michael W. Yung - Los Angeles CA, US
David S. Matthews - Oxnard CA, US
Susan L. Morton - Pittsford NY, US
Jason W. May - Santa Monica CA, US
Joseph S. Colburn - Malibu CA, US
Assignee:
HRL LABORATORIES, LLC - Malibu CA
International Classification:
H03H 11/44
US Classification:
333216
Abstract:
A differential circuit topology that produces a tunable floating negative inductance, negative capacitance, negative resistance/conductance, or a combination of the three. These circuits are commonly referred to as “non-Foster circuits.” The disclosed embodiments of the circuits comprises two differential pairs of transistors that are cross-coupled, a load immittance, multiple current sources, two Common-Mode FeedBack (CMFB) networks, at least one tunable (variable) resistance, and two terminals across which the desired immittance is present. The disclosed embodiments of the circuits may be configured as either a Negative Impedance Inverter (NII) or a Negative Impedance Converter (NIC) and as either Open-Circuit-Stable (OCS) and Short-Circuit-Stable (SCS).

Wide Bandwidth Automatic Tuning Circuit

US Patent:
2013000, Jan 10, 2013
Filed:
Jul 6, 2011
Appl. No.:
13/177479
Inventors:
Carson R. White - Agoura Hills CA, US
Joseph S. Colburn - Malibu CA, US
Michael W. Yung - Los Angeles CA, US
Donald A. Hitko - Grover Beach CA, US
Assignee:
HRL LABORATORIES, LLC - Malibu CA
International Classification:
H03H 7/40
H03H 7/38
US Classification:
333 173, 333 32
Abstract:
An automatic tuning circuit for matching an antenna to a radio receiver. The automatic tuning circuit includes a tunable non-Foster circuit for coupling the receiver and the antenna; and sensing and feedback circuits for sensing the combined capacitance of the tunable non-Foster circuit and the antenna and for tuning the tunable non-Foster circuit to automatically minimize the combined capacitance of the tunable non-Foster circuit and the antenna.

Wide Bandwidth Automatic Tuning Circuit

US Patent:
2013000, Jan 10, 2013
Filed:
May 15, 2012
Appl. No.:
13/472396
Inventors:
Carson R. White - Agoura Hills CA, US
Joseph S. Colburn - Malibu CA, US
Michael W. Yung - Los Angeles CA, US
Donald A. Hitko - Grover Beach CA, US
Assignee:
HRL LABORATORIES, LLC - Malibu CA
International Classification:
H03H 7/40
H01Q 1/50
US Classification:
333 173, 343861, 333 32
Abstract:
An automatic tuning circuit for matching an antenna to a radio receiver. The automatic tuning circuit includes a tunable non-Foster circuit for coupling the receiver and the antenna; and sensing and feedback circuits for sensing the combined capacitance of the tunable non-Foster circuit and the antenna and for tuning the tunable non-Foster circuit to automatically minimize the combined capacitance of the tunable non-Foster circuit and the antenna.

Possible Relatives

Daniel Yung  Aaron S Yung  Derek C Yung  Eddie Yung  Elaine B Yung  Elizabeth Y Yung  Eva H Yung  Michael C Last  Michael C Johnson  Michael F Stamps 

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