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Michael G Stamp, 56Port Orchard, WA

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Port Orchard, WA   

Bremerton, WA   

Phoenix, AZ   

Woodbine, MD   

Tacoma, WA   

Gig Harbor, WA   

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Michael Stamp Photo 1

Michael Stamp - Lawyer

Specialties:
Business Litigation, Employment Law, Unfair Business Practices, Government Contracts, Class Action, Defective and Dangerous Products
ISLN:
916505101
Admitted:
2001
University:
University of Minnesota, B.S., 1997
Law School:
University of Pennsylvania, J.D., 2001

Michael Stamp resumes & CV records

Resumes

Michael Stamp Photo 41

Michael Henry Stamp

Michael Stamp Photo 42

Michael Stamp

Publications & IP owners

Us Patents

Bubbler For Substrate Processing

US Patent:
7077388, Jul 18, 2006
Filed:
Jul 17, 2003
Appl. No.:
10/622127
Inventors:
Michael R. Stamp - Chandler AZ, US
Frederick J. AmRhein - Fountain Hills AZ, US
Arnold J. Dale - Mesa AZ, US
Joseph C. Pottebaum - Chandler AZ, US
Brian J. Ebert - Phoenix AZ, US
Assignee:
ASM America, Inc. - Phoenix AZ
International Classification:
B01F 3/04
US Classification:
2611211, 261135, 261DIG 65, 118726
Abstract:
A vaporization chamber for a substrate processing system includes a main body, a cover member and a transition member. The main body is made of aluminum and defines a first inner surface, which defines, at least in part, a cavity. The cover member is also made of aluminum. The cover member defines a second inner surface, which also defines, at least in part, the cavity. The cover member includes a carrier gas cover inlet, a liquid source cover inlet, a source cover outlet which extends from a first outer surface through the cover member to the second inner surface. The transition member is made of stainless steel and has a transition outer surface and a transition inner surface. The transition inner surface is aluminum cladded. The cover member includes a carrier gas cover inlet, a liquid source cover inlet, a source cover outlet which extend from a first outer surface through the cover member to second inner surface. The transition inner surface and the cover outer surface are welded together.

Bubbler For Substrate Processing

US Patent:
7370848, May 13, 2008
Filed:
Jun 30, 2006
Appl. No.:
11/428267
Inventors:
Michael R. Stamp - Chandler AZ, US
Frederick J. AmRhein - Fountain Hills AZ, US
Arnold J. Dale - Mesa AZ, US
Joseph C. Pottebaum - Chandler AZ, US
Brian J. Ebert - Phoenix AZ, US
Assignee:
ASM America, Inc. - Phoenix AZ
International Classification:
B01F 3/04
US Classification:
2611211, 261135, 261DIG 65, 118726
Abstract:
A vaporization chamber for a substrate processing system includes a main body, a cover member and a transition member. The main body is made of aluminum and defines a first inner surface, which defines, at least in part, a cavity. The cover member is also made of aluminum. The cover member defines a second inner surface, which also defines, at least in part, the cavity. The cover member includes a carrier gas cover inlet, a liquid source cover inlet, a source cover outlet which extends from a first outer surface through the cover member to the second inner surface. The transition member is made of stainless steel and has a transition outer surface and a transition inner surface. The transition inner surface is aluminum cladded. The cover member including a carrier gas cover inlet, a liquid source cover inlet, a source cover outlet which extend from a first outer surface through the cover member to second inner surface. The transition inner surface and the cover outer surface are welded together.

Method Of Loading A Wafer Onto A Wafer Holder To Reduce Thermal Shock

US Patent:
2003019, Oct 9, 2003
Filed:
Apr 5, 2002
Appl. No.:
10/118073
Inventors:
Tony Keeton - Harmony Mesa AZ, US
Michael Stamp - Chandler AZ, US
Mark Hawkins - Gilbert AZ, US
International Classification:
H01L021/31
H01L021/26
H01L021/42
H01L021/477
H01L021/469
H01L021/324
US Classification:
438/795000
Abstract:
One or more of three different measures are taken to preheat a wafer before it is loaded into direct contact with a wafer holder, in order to provide optimal throughput while reducing the risk of thermal shock to the wafer. The first measure is to move the wafer holder to a raised position prior to inserting the wafer into the reaction chamber and holding the wafer above the wafer holder. The second measure is to provide an increased flow rate of a heat-conductive gas (such as Hpurge gas) through the chamber prior to inserting the wafer therein. The third measure is to provide a power bias to radiative heat elements (e.g., heat lamps) above the reaction chamber.

Low/High Temperature Substrate Holder To Reduce Edge Rolloff And Backside Damage

US Patent:
2005009, May 5, 2005
Filed:
Oct 29, 2003
Appl. No.:
10/697401
Inventors:
Tony Keeton - Mesa AZ, US
Matthew Goodman - Chandler AZ, US
Michael Stamp - Chandler AZ, US
International Classification:
C23F001/00
US Classification:
156345510
Abstract:
A substrate holder for processing a semiconductor substrate that minimizes substrate non-uniformities as well as backside damage. The substrate holder includes one or more support elements, such as a plurality of veins configured in an annular ring to support an outer edge of a substrate. The veins are configured to support a substrate of a particular size in a support plane defined by the top surfaces of the veins. The substrate holder also has one or more annular grooves formed in the top surface of the holder. In a preferred embodiment, the substrate holder also has a raised annular ring positioned radially inward of the grooves and the support elements. The top surface of the raised annular ring is no higher that the top surfaces of the veins.

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