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Morten Michael JensenPhoenix, AZ

Known as:
Morten M Jensen
Related to:
Julian J Horvath 40

Morten Jensen Phones & Addresses

Phoenix, AZ   

4440 Westminster Pl, Columbus, IN 47201   

Cave Creek, AZ   

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Resumes

Morten Jensen Photo 35

Chief Engineer, Steen Solutions Llc

Position:
Engineering Design Manager at STEEN Solutions LLC
Location:
Phoenix, Arizona Area
Industry:
Design
Work:
STEEN Solutions LLC since Sep 2007
Engineering Design Manager
Education:
University of Phoenix 2002 - 2004
MBA, Technology Management Danmarks Tekniske Universitet 1994 - 1999
MSc, Engineering Design and Analysis
Interests:
Bringing Technology to Life, Consulting, Product Development, Process Development, Engineering Design, Engineering Analysis
Morten Jensen Photo 36

Chief Engineer, Steen Solutions Llc

Location:
Phoenix, Arizona Area
Industry:
Design
Morten Jensen Photo 37

Morten Jensen

Location:
Phoenix, Arizona Area
Industry:
Semiconductors

Publications & IP owners

Us Patents

Canister

US Patent:
D686462, Jul 23, 2013
Filed:
Feb 16, 2012
Appl. No.:
29/413550
Inventors:
Scott D. McPherson - Paradise Valley AZ, US
Ben Dameron - Coronado CA, US
Morten Jensen - Mesa AZ, US
Assignee:
iSpray, LLC - Paradise Valley AZ
International Classification:
0706
US Classification:
D 7589

Thermal Switch For Rapid Thermal Coupling And Decoupling Of Devices Under Test

US Patent:
2020037, Nov 26, 2020
Filed:
May 20, 2019
Appl. No.:
16/417408
Inventors:
- Santa Clara CA, US
James Hastings - Chandler AZ, US
Morten Jensen - Mesa AZ, US
Todd Coons - Gilbert AZ, US
Assignee:
INTEL CORPORATION - Santa Clara CA
International Classification:
G01R 31/28
Abstract:
An apparatus for testing integrated circuits (ICs), comprising a first thermal contact structure having a first surface to interface with a heat source, the first surface is opposite a second surface. A second thermal contact structure is above the first thermal contact structure and separated therefrom. The second thermal contact structure has a third surface to interface with a cold mass. The third surface is opposite a fourth surface, and the fourth surface is opposite the second surface. A variable-resistance thermal interface (VRTI) structure is between the first and second thermal contact structures. The VRTI structure has a maximal thermal conductivity associated with a first state, and a minimal thermal conductivity associated with a second state.

Placing Integrated Circuit Devices Using Perturbation

US Patent:
2015018, Jul 2, 2015
Filed:
Dec 27, 2013
Appl. No.:
14/141718
Inventors:
Paul J. Diglio - Chandler AZ, US
Nader N. Abazarnia - Chandler AZ, US
Christopher R. Schroeder - Gilbert AZ, US
Rene J. Sanchez - Chandler AZ, US
Morten S. Jensen - Mesa AZ, US
International Classification:
G01R 31/28
G01R 1/04
Abstract:
Placing integrated circuit devices using a perturbation is described. In one example, a testing platform has a circuit board. A socket is on the board for receiving and connecting to an integrated circuit package. The socket has an array of pins to engage connection bumps on a surface of the package and a biasing feature to guide the package into alignment with the pins of the socket. A perturbation source induces movement of the package into alignment with the pins of the socket.

Fluid Delivery System For Thermal Test Equipment

US Patent:
2015012, May 7, 2015
Filed:
Nov 6, 2013
Appl. No.:
14/073719
Inventors:
Morten S. Jensen - Mesa AZ, US
Todd R. Coons - Gilbert AZ, US
Roland S. Muwanga - Calgary, CA
International Classification:
F28D 15/00
G01R 31/28
US Classification:
165168, 2988802
Abstract:
Embodiments of the present disclosure are directed towards systems and apparatuses for delivery of thermal transfer fluid to and/or from a thermal head of thermal test equipment and for driving the thermal head and associated techniques. In one embodiment, a fluid delivery assembly includes a chamber assembly having an inlet channel and outlet channel for a thermal transfer fluid, and a piston assembly having an inlet channel and outlet channel for the thermal transfer fluid, the inlet channel of the piston assembly configured to route the thermal transfer fluid from the inlet channel of the chamber assembly and the outlet channel of the piston assembly configured to route the thermal transfer fluid to the outlet channel of the chamber assembly and a thermal head coupled with the piston assembly and configured to thermally couple with a device under test (DUT). Other embodiments may be described and/or claimed.

Isbn (Books And Publications)

Varige Goder I Et Komplett System Av Konsumettersprselsfunksjoner: En Modell Estimert Med Norske Kvartalsdata

Author:
Morten Jensen
ISBN #:
8253719620

Kvartalsmodellen Kvarts: Modellbeskrivelse Og Teknisk Dokumentasjon

Author:
Morten Jensen
ISBN #:
8253721390

Possible Relatives

Cynthia E Jensen  David G Jensen  D K Jensen  Davin A Jensen  Dawne M Jensen  Dayne R Jensen  Dean H Jensen  Morten L Petersen  Morten Nilsen  Morten L Hansen 

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