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Nathan R Brown, 52472 Highway 285 E, Greenbrier, AR 72058

Known as:
Nathan R Brwon
Related to:
Kevin R Adkison 54 Paul W Brown 54 Amanda B Patton 68 Samantha Burris 55 Jennifer Rupp 51

Nathan Brown Phones & Addresses

Hutto, TX   

Gardendale, AL   

Pottsville, AR   

Russellville, AR   

London, AR   

Harned, KY   

Hollister, MO   

Fultondale, AL   

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Mentions for Nathan R Brown

Career records & work history

Lawyers & Attorneys

Nathan Brown Photo 1

Nathan Ira Brown - Lawyer

Licenses:
Virginia - Authorized to practice law 2003
Nathan Brown Photo 2

Nathan Brown - Lawyer

ISLN:
1001138996
Admitted:
2017
Nathan Brown Photo 3

Nathan Brown - Lawyer

Office:
Ferrell & Brown, PLLC
ISLN:
924618268
Admitted:
2013
Nathan Brown Photo 4

Nathan Brown - Lawyer

Office:
The Legal Aid Society
ISLN:
1001179572
Admitted:
2021
Nathan Brown Photo 5

Nathan Brown - Lawyer

ISLN:
1000629206
Admitted:
2009

Medicine Doctors

Nathan Brown

Specialties:
Oral & Maxillofacial Surgery
Work:
Northlake Oral Facial Surgery
4600 Hwy 22 STE 4, Mandeville, LA 70471
985-6248877 (phone) 985-6418896 (fax)
Education:
Medical School
University of Alabama School of Medicine
Graduated: 2005
Procedures:
Periodontics
Conditions:
Abdominal Hernia, Appendicitis, Breast Disorders, Cholelethiasis or Cholecystitis, Gingival and Periodontal Diseases, Inguinal Hernia, Malignant Neoplasm of Female Breast, Tempromandibular Joint Disorders (TMJ), Ventral Hernia
Languages:
English
Description:
Dr. Brown graduated from the University of Alabama School of Medicine in 2005. He works in Mandeville, LA and specializes in Oral & Maxillofacial Surgery. Dr. Brown is affiliated with Saint Tammany Parish Hospital.

License Records

Nathan C Brown

Licenses:
License #: 7025854 - Expired
Category: EMS Licensing
Type: None

Nathan Alan Brown Rt

Licenses:
License #: 4070 - Expired
Category: Radiography
Issued Date: Dec 2, 2010
Effective Date: Dec 6, 2012
Expiration Date: Dec 1, 2012
Type: Medical Radiographer

Nathan Brown resumes & CV records

Resumes

Nathan Brown Photo 58

Nathan Brown - Pelham, AL

Work:
sales associate Feb 2015 to Feb 2015 Healthmed Incorporated - Alabaster, AL May 2012 to Dec 2014
Health Promotion and Sales All-County and All-Area 2004 to 2005
He was the team captain Good Hope High School
Student Government from Parliamentarian
Education:
University of Montevallo - Montevallo, AL 2008 to 2012
Bachelor of Science in Communication and Public Relations
Nathan Brown Photo 59

Nathan Brown - Austin, TX

Work:
Manitex Inc. Jun 2012 to 2000
Mechanical Assembly Technician Nuclear Concepts Inc - Austin, TX 2008 to 2012
Senior Sales/Warehouse Manager/Electrician D and L Electric - Houston, TX 2006 to 2008
Electrician RKI - Houston, TX 2004 to 2005
CNC Operator Brinks Inc - Houston, TX 1997 to 2003
Route Coordinator/ Dispatcher
Military:
Rank: E% Apr 1993 to Apr 2002
Branch: Texas Army National GuardL.i.location.original
Skills:
computer skills, great customer relations, attention to detail, multi-tasking, problem solver, working with electrical, and manual labor

Publications & IP owners

Us Patents

Differential Pressure Application Apparatus For Use In Polishing Layers Of Semiconductor Device Structures And Methods

US Patent:
6863771, Mar 8, 2005
Filed:
Jul 25, 2001
Appl. No.:
09/912982
Inventors:
Nathan R. Brown - Cedar Park TX, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
B24B001/00
US Classification:
15634514, 451 41
Abstract:
An apparatus for applying different amounts of pressure to different locations of a backside of a semiconductor device structure during polishing thereof. The apparatus is configured to be associated with a wafer carrier of a polishing apparatus and includes pressurization structures configured to be biased against the backside of the semiconductor device structure during polishing thereof. The pressurization structures are independently movable with respect to one another. The amount of force or pressure applied by each pressurization structure to the backside of the semiconductor device structure is controlled by at least one corresponding actuator. The actuator may magnetically facilitate movement of the corresponding pressurization structure toward or away from the backside of the semiconductor device structure. The actuator may alternatively comprise a positive or negative pressure source. Systems including the pressure application apparatus, as well as differential pressure application methods and polishing methods are also disclosed.

Chemical Mechanical Polish (Cmp) Conditioning-Disk Holder

US Patent:
6887138, May 3, 2005
Filed:
Jun 20, 2003
Appl. No.:
10/601248
Inventors:
Brian E. Bottema - Austin TX, US
Larry J. Bustos - Kyle TX, US
Martin W. Cain - Maxwell TX, US
Nathan R. Brown - Cedar Park TX, US
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
B24B033/00
US Classification:
451 72, 451443, 451444
Abstract:
A chemical mechanical polishing (CMP) tool holds a conditioning disk that is used to remove impurities from a polishing disk used to planarize surfaces, such as a semiconductor surface. The tool uses an elastic disk that is positioned between a clamp and a gimbal hub that pivotally overlies a gimbal plate. The elastic disk is a polymer material, such as for example polytetrafluoroethylene (PTFE). The elastic disk has a central opening and is radially solid around the central opening. Alignment holes and drive mechanism holes pierce the elastic disk which functions to rotate the tool with minimal friction and provides a liquid seal from CMP fluids. Access holes in the gimbal plate permit easy installation and removal of the individual components. The PTFE disk is strong and durable enough to withstand high torque and provide lengthy operation without maintenance.

Polishing Systems For Use With Semiconductor Substrates Including Differential Pressure Application Apparatus

US Patent:
6899607, May 31, 2005
Filed:
Nov 17, 2003
Appl. No.:
10/715248
Inventors:
Nathan R. Brown - Cedar Park TX, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
B24B007/20
US Classification:
451288, 451285
Abstract:
An apparatus for applying different amounts of pressure to different locations of a backside of a semiconductor device structure during polishing thereof. The apparatus is configured to be associated with a wafer carrier of a polishing apparatus and includes pressurization structures configured to be biased against the backside of the semiconductor device structure during polishing thereof. The pressurization structures are independently movable with respect to one another. The amount of force or pressure applied by each pressurization structure to the backside of the semiconductor device structure is controlled by at least one corresponding actuator. The actuator may magnetically facilitate movement of the corresponding pressurization structure toward or away from the backside of the semiconductor device structure. The actuator may alternatively comprise a positive or negative pressure source. Systems including the pressure application apparatus, as well as differential pressure application methods and polishing methods are also disclosed.

Systems Including Differential Pressure Application Apparatus

US Patent:
7059937, Jun 13, 2006
Filed:
May 12, 2005
Appl. No.:
11/128144
Inventors:
Nathan R. Brown - Cedar Park TX, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
B24B 7/20
US Classification:
451 8, 451288, 451388
Abstract:
A differential pressure application apparatus is configured to apply different amounts of pressure to different locations of a substrate, such as a semiconductor device structure. The apparatus may be used during polishing or planarization processes. The apparatus includes pressurization structures that may be moved independently from one another. An actuator may control the amount of force or pressure applied by each pressurization structure to the surface of the substrate. Systems including the pressure application apparatus, as well as differential pressure application methods and polishing methods are also disclosed.

Polishing Carrier Head With A Modified Pressure Profile

US Patent:
7074118, Jul 11, 2006
Filed:
Nov 1, 2005
Appl. No.:
11/264185
Inventors:
Brian E. Bottema - Austin TX, US
Keven A. Cline - Austin TX, US
Alex P. Pamatat - Grenoble, FR
Nathan R. Brown - Cedar Park TX, US
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
B24B 5/00
US Classification:
451285, 451288, 451398
Abstract:
A polishing carrier head including a retaining ring for defining an area of a polishing pocket region used to polish a predetermined object, is provided. The polishing carrier head may further include a perforated plate positioned lateral to the retaining ring, the perforated plate having a plurality of perforations for permitting fluid flow. The polishing carrier head may further include a flexible membrane having a first region overlying a portion of the retaining ring and the perforated plate and a second region in which a first portion of the flexible membrane overlies a second portion of the flexible membrane to form one or more bellows. The polishing carrier head may further include an edge support ring in contact with the first region of the flexible membrane for clamping the first region of the flexible membrane to the perforated plate.

Systems Including Differential Pressure Application Apparatus

US Patent:
7285037, Oct 23, 2007
Filed:
Apr 25, 2006
Appl. No.:
11/412157
Inventors:
Nathan R. Brown - Cedar Park TX, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
B24B 7/20
B24B 7/24
B24B 49/02
US Classification:
451 8, 451288, 451388
Abstract:
A differential pressure application apparatus is configured to apply different amounts of pressure to different locations of a substrate, such as a semiconductor device structure. The apparatus may be used during polishing or planarization processes. The apparatus includes physically discrete pressurization structures that may be moved independently from one another. An actuator may control the amount of force or pressure applied by each pressurization structure to the surface of the substrate. Systems including the pressure application apparatus, as well as differential pressure application methods and polishing methods are also disclosed.

Differential Pressure Application Apparatus For Use In Polishing Layers Of Semiconductor Device Structures And Methods

US Patent:
7935216, May 3, 2011
Filed:
Feb 28, 2005
Appl. No.:
11/068666
Inventors:
Nathan R. Brown - Cedar Park TX, US
Assignee:
Round Rock Research, LLC - Mt. Kisco NY
International Classification:
B24B 1/00
US Classification:
15634513, 451 41, 15634512
Abstract:
An apparatus for applying different amounts of pressure to different locations of a semiconductor device structure or other substrate during polishing thereof. The apparatus is configured to be associated with a wafer carrier of a polishing apparatus and includes pressurization structures configured to individually apply pressure to a major surface of the semiconductor device structure during polishing thereof. Systems including the pressure application apparatus, as well as differential pressure application methods and polishing methods are also disclosed.

Methods For Polishing Semiconductor Device Structures By Differentially Applying Pressure To Substrates That Carry The Semiconductor Device Structures

US Patent:
7947190, May 24, 2011
Filed:
Nov 17, 2003
Appl. No.:
10/715267
Inventors:
Nathan R. Brown - Cedar Park TX, US
Assignee:
Round Rock Research, LLC - Mt. Kisco NY
International Classification:
C23F 1/00
US Classification:
216 88, 216 38, 15634512, 451 28
Abstract:
An apparatus for applying different amounts of pressure to different locations of a backside of a semiconductor device structure during polishing thereof. The apparatus is configured to be associated with a wafer carrier of a polishing apparatus and includes pressurization structures configured to be biased against the backside of the semiconductor device structure during polishing thereof. The pressurization structures are independently movable with respect to one another. The amount of force or pressure applied by each pressurization structure to the backside of the semiconductor device structure is controlled by at least one corresponding actuator. The actuator may magnetically facilitate movement of the corresponding pressurization structure toward or away from the backside of the semiconductor device structure. The actuator may alternatively comprise a positive or negative pressure source. Systems including the pressure application apparatus, as well as differential pressure application methods and polishing methods are also disclosed.

Isbn (Books And Publications)

Comparative Politics: A Global Introduction

Author:
Nathan J. Brown
ISBN #:
0072867981

Peasant Politics In Modern Egypt: The Struggle Against The State

Author:
Nathan J. Brown
ISBN #:
0300045387

Palestinian Politics After The Oslo Accords: Resuming Arab Palenstine

Author:
Nathan J. Brown
ISBN #:
0520237625

Palestinian Politics After The Oslo Accords - Resuming Arab Palestine

Author:
Nathan J. Brown
ISBN #:
0520241150

The Rule Of Law In The Arab World: Courts In Egypt And The Gulf

Author:
Nathan J. Brown
ISBN #:
0521030684

The Rule Of Law In The Arab World: Courts In Egypt And The Gulf

Author:
Nathan J. Brown
ISBN #:
0521590264

Constitutions In A Nonconstitutional World: Arab Basic Laws And The Prospects For Accountable Government

Author:
Nathan J. Brown
ISBN #:
0791451577

Constitutions In A Nonconstitutional World: Arab Basic Laws And The Prospects For Accountable Government

Author:
Nathan J. Brown
ISBN #:
0791451585

Possible Relatives

Cynthia B Brown  David Brown  A C Brown  Cyril W Brown  Cyrus J Brown  D Brown  Davin M Brown  Nathan Johnson  Nathan R Stamps  Nathan Johnston 

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