Neil C Delaplane, 5966 Baur Ln, Vicksburg, MI 49097

D461180, Aug 6, 2002

Sep 28, 2001

29/148790

Robert L. Van Egmond - Hillsboro OR
Shawn S. McEuen - Hillsboro OR
Gary L. Bookhardt - Beaverton OR
Marc A. Abrams - Portland OR
Neil C. Delaplane - Tigard OR
Brad T. Combs - Portland OR
Josh Gordon - Portland OR
Ryan Wilday - Portland OR

Intel Corporation - Santa Clara CA

1403

D14240

5568357, Oct 22, 1996

Jun 15, 1994

8/260102

Gary Kochis - Union Town OH
Neil C. Delaplane - Copley OH
William R. Rebh - Medina OH
James M. Cisar - Wadsworth OH
Yung-Fu Chang - Medina OH

Metanetics Corporation - Fort Myers FL

G06F 116
H05K 702

361681

Impacts to the case of a portable electronic unit including a display are dissipated by a plurality of thermoplastic elastomeric damping elements which isolate an internal frame unit, carrying the display and associated electronic components, from contact with the enclosure. Each damping element is provided with corresponding positioning structures within the case to ensure that the frame unit "floats" on protective shock absorbing material to provide three-dimensional support and damping of impacts incident from any direction. Damping elements may take the form of small caps of elastomeric material at spaced positions around the periphery of the frame unit. Electronic connections to the display screen are accomplished using flexible connectors to maintain the mechanical isolation of the display screen from the rest of the unit.

6011696, Jan 4, 2000

May 28, 1998

9/087455

Ravi V. Mahajan - Tempe AZ
Hong Xie - Phoenix AZ
Neil C. Delaplane - Tualatin OR
Gregory A. James - San Jose CA

Intel Corporation - Santa Clara CA

H05K 702

361782

An electronic cartridge comprising a cartridge substrate, a package substrate, an integrated circuit, and an enclosure. The package substrate is mounted to the cartridge substrate. The integrated circuit is mounted to the package substrate. The enclosure encloses the integrated circuit, the package substrate and the cartridge substrate.

6191475, Feb 20, 2001

Nov 26, 1997

8/979502

Harry G. Skinner - Beaverton OR
Neil C. Delaplane - Tualatin OR
Ravi V. Mahajan - Tempe AZ
Robert Starkston - Chandler AZ
Ron Edsall - Beaverton OR

Intel Corporation - Santa Clara CA

H01L 2314
H01L 2334
H01L 2348
H05K 114

257700

A substrate for reducing electromagnetic emissions is provided. The substrate may include a plurality of ground layers, signal layers and power layers. All of the layers other than the ground layer are provided with a ground ring that may extend around the perimeter of the layer. The ground rings are electrically coupled together by ground stitching or vias that are randomly spaced. The random spacing of the ground stitching is based on the operating frequencies of the integrated circuit devices mounted on the substrate. Additional shielding may be provided by providing a cover assembly made of any conductive material that is coupled to the exposed ground rings on the uppermost and lowermost surfaces of the substrate. The cover assembly is coupled to the exposed ground rings in a randomized pattern. The device provides a virtual electrical ground cage in which the internal signal layers are totally enclosed, thereby reducing electromagnetic emissions.

2023001, Jan 19, 2023

Sep 29, 2022

17/956486

- Santa Clara CA, US
Bala Subramanya - Bangalore K, IN
Greeshmaja Govind - Malappuram, IN
Sun Ye E - Bayan Lepas, MY
Boon Ping Koh - Seberang Jaya, MY
Juha Paavola - Hillsboro OR, US
Kerry Stevens - Beaverton OR, US
Neil Delaplane - Tigard OR, US
Quek Liang Wee - Bayan Lepas, MY

H01L 23/552
H01L 25/065
H01L 23/367
H01L 21/48

Electrically conductive compressible gaskets can be employed to ground a heat solution and provide electromagnetic interference (EMI) shielding. A plurality of gaskets may be arranged around the perimeter of an integrated circuit package such as a processor or system on a chip. Each of the gaskets is in contact with a ground plane in the package, and upon contact with a heat sink or cold plate, creates an electrical path that grounds the heat sink or cold plate and thereby minimizes the emission of spurious radio signals. Other embodiments may be described and/or claimed.