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Nicholas E Szabo DeceasedSpanish Ranch, CA

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Quincy, CA   

San Jose, CA   

Crescent Mills, CA   

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Resumes

Nicholas Szabo Photo 30

Product Manager And Software Architect

Location:
United States
Industry:
Computer Software
Nicholas Szabo Photo 31

Nicholas Szabo

Publications & IP owners

Us Patents

Alignment Correction Prior To Image Sampling In Inspection Systems

US Patent:
2002007, Jun 20, 2002
Filed:
Jan 31, 2002
Appl. No.:
10/066161
Inventors:
Scott Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent Douglas - San Martin CA, US
Fred Babian - Boulder Creek CA, US
Assignee:
KLA INSTRUMENTS CORPORATION
International Classification:
H04N007/18
US Classification:
348/087000, 348/086000, 348/095000, 382/141000, 382/151000
Abstract:
A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

Alignment Correction Prior To Image Sampling In Inspection Systems

US Patent:
2003006, Apr 3, 2003
Filed:
Dec 9, 2002
Appl. No.:
10/314546
Inventors:
Scott Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent Douglas - San Martin CA, US
Fred Babian - Boulder Creek CA, US
Assignee:
KLA INSTRUMENTS CORPORATION
International Classification:
G06K009/00
US Classification:
348/126000, 382/151000, 348/129000
Abstract:
A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

Alignment Correction Prior To Image Sampling In Inspection Systems

US Patent:
2005025, Nov 17, 2005
Filed:
Jul 13, 2005
Appl. No.:
11/180348
Inventors:
Scott Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent Douglas - San Martin CA, US
Fred Babian - Boulder Creek CA, US
International Classification:
G06K009/00
H04N007/18
US Classification:
382145000, 348087000
Abstract:
A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

Alignment Correction Prio To Image Sampling In Inspection Systems

US Patent:
2008030, Dec 11, 2008
Filed:
Aug 7, 2008
Appl. No.:
12/221806
Inventors:
Scott A. Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt H. Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent E. Douglas - San Martin CA, US
Fred E. Babian - Boulder Creek CA, US
International Classification:
G06K 9/00
US Classification:
382141
Abstract:
A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

Method And Apparatus For Texture Generation

US Patent:
4615013, Sep 30, 1986
Filed:
Aug 2, 1983
Appl. No.:
6/519602
Inventors:
Johnson K. Yan - Milpitas CA
Nicholas S. Szabo - Cupertino CA
Assignee:
The Singer Company - Binghamton NY
International Classification:
G09B 908
US Classification:
364521
Abstract:
A method and an apparatus for texture generation for a digital image generator of an aircraft flight simulator is disclosed in which (a selected two of the three) coordinates of each pixel of an image are inverse transformed to earth coordinates (112-124, in FIG. 11) from which addresses are developed (126, 128 and 130) for accessing a texture table (132 and 134) to retrieve elements from which an appropriate pixel intensity is developed (140). The table stores near (132) and far (134) texture, the far texture elements being interpolated to avoid a checkerboard effect, stores a limited number of texture types, the elements of selected texture types being combined (132 and 134) to develop additional texture types, and stores levels of detail (degrees of filtering) the appropriate levels being accessed (126) to avoid aliasing (scintillation of a scene), adjacent levels being mixed (136 and 138) to provide smooth detail level transition.

Alignment Correction Prior To Image Sampling In Inspection Systems

US Patent:
6141038, Oct 31, 2000
Filed:
Jun 27, 1997
Appl. No.:
8/884466
Inventors:
Scott A. Young - Soquel CA
Roger Kroeze - Tracy CA
Curt H. Chadwick - Los Gatos CA
Nicholas Szabo - Cupertino CA
Kent E. Douglas - San Martin CA
Fred E. Babian - Boulder Creek CA
Assignee:
KLA Instruments Corporation - San Jose CA
International Classification:
H04N 718
US Classification:
348 87
Abstract:
A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, those electronic images are compared to detect any defects that may exist on one of the die.

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