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Nina D Morozova, 721503 Dorgali Dr, Sarasota, FL 34238

Known as:
Nina D Morozov Nina D Norozova Nina M Morozov Nina D Morozona
Related to:
Valentin N Morozov 85

Nina Morozova Phones & Addresses

1503 Dorgali Dr, Sarasota, FL 34238   

5860 Girona Pl, Sarasota, FL 34238    941-9239007   

377 Chilton Ct, San Jose, CA 95111   

Boulder, CO   

Santa Clara, CA   

Zephyr Cove, NV   

Campbell, CA   

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Nina Morozova resumes & CV records

Resumes

Nina Morozova Photo 18

Principal

Location:
Sarasota, FL
Industry:
Staffing And Recruiting
Work:
Mri Jun 2004 - May 2008
Account Executive and Project Coordinator The Talent Everest Jun 2004 - May 2008
Principal Jdsu 1999 - 2004
Staff Engineer and Program Manager Gemfire Corporation 1998 - 1999
Packaging Manager Lightwave Microsystems 1996 - 1998
Engineer Nsf Center For Advanced Microelectronics and Optoelectronics University of Colorado 1994 - 1996
Research Associate Pfizer Valleylab 1992 - 1994
Consultant
Education:
Bauman Moscow State Technical University
Doctorates, Doctor of Philosophy, Electrical Engineering
Skills:
Start Ups, Manufacturing, Electronics, Semiconductors, Mechanical Engineering, Medical Devices, Optics, Engineering Management, Process Improvement, Lean Manufacturing, Project Management, Electrical Engineering, Product Management, Embedded Systems, Six Sigma, Program Management, Systems Engineering, R&D, Energy, Product Development, Patents, Engineering, Cross Functional Team Leadership, Testing, Business Development, Product Marketing, Telecommunications, Process Simulation, Integration, Wireless, Strategy, Research and Development
Nina Morozova Photo 19

Nina Morozova

Publications & IP owners

Us Patents

Multi-Channel Laser Pump Source For Optical Amplifiers

US Patent:
7235150, Jun 26, 2007
Filed:
Jul 23, 2004
Appl. No.:
10/898537
Inventors:
William K. Bischel - Menlo Park CA, US
David K. Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
Simon J. Field - Palo Alto CA, US
Markus P. Hehlen - Los Gatos CA, US
Richard B. Tompane - Los Altos CA, US
Andrew T. Ryan - Sunnyvale CA, US
C. Geoffrey Fanning - Hillsboro OR, US
Jim W. Li - Fremont CA, US
Nina D. Morozova - San Jose CA, US
Assignee:
Gemfire Corporation - Fremont CA
International Classification:
B32B 37/10
US Classification:
156212, 156300, 156299, 156298, 156297
Abstract:
An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Multi-Channel Laser Pump Source For Optical Amplifiers

US Patent:
7653109, Jan 26, 2010
Filed:
Jun 25, 2007
Appl. No.:
11/768150
Inventors:
William K. Bischel - Menlo Park CA, US
David K. Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
Simon J. Field - Palo Alto CA, US
Markus P. Hehlen - Los Gatos CA, US
Richard B. Tompane - Los Altos CA, US
Andrew T. Ryan - Sunnyvale CA, US
C. Geoffrey Fanning - Hillsboro OR, US
Jim W. Li - Fremont CA, US
Nina D. Morozova - San Jose CA, US
Assignee:
Gemfire Corporation - Fremont CA
International Classification:
H01S 5/00
US Classification:
372 5012, 156212
Abstract:
An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Multi-Channel Laser Pump Source For Optical Amplifiers

US Patent:
2002011, Aug 15, 2002
Filed:
Feb 14, 2001
Appl. No.:
09/784687
Inventors:
William Bischel - Menlo Park CA, US
David Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
Simon Field - Palo Alto CA, US
Markus Hehlen - Los Gatos CA, US
Richard Tompane - Los Altos CA, US
Andrew Ryan - Sunnyvale CA, US
C. Fanning - Hillsboro OR, US
Jim Li - Fremont CA, US
Nina Morozova - San Jose CA, US
International Classification:
G02B006/30
US Classification:
385/049000, 385/089000, 385/027000, 372/070000
Abstract:
An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Packaging And Alignment Methods For Optical Components, And Optical Apparatus Employing Same

US Patent:
2002011, Aug 15, 2002
Filed:
Feb 14, 2001
Appl. No.:
09/784945
Inventors:
David Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
William Bischel - Menlo Park CA, US
Jim Li - Fremont CA, US
Nina Morozova - San Jose CA, US
International Classification:
G02B006/36
US Classification:
385/089000
Abstract:
Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.

Packaging And Alignment Methods For Optical Components, And Optical Apparatus Employing Same

US Patent:
2003013, Jul 17, 2003
Filed:
Jan 3, 2003
Appl. No.:
10/336293
Inventors:
David Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
William Bischel - Menlo Park CA, US
Jim Li - Fremont CA, US
Nina Morozova - San Jose CA, US
International Classification:
G02B006/38
G02B006/36
US Classification:
385/065000, 385/089000
Abstract:
Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.

Laser Package

US Patent:
2003016, Aug 28, 2003
Filed:
Dec 20, 2002
Appl. No.:
10/326197
Inventors:
Edmund Wolak - Palo Alto CA, US
Nina Morozova - San Jose CA, US
Jay Skidmore - San Jose CA, US
Ning Fan - Victoria, CA
Jo Major - Cupertino CA, US
Robert Lang - Alamo CA, US
Garnet Luick - Victoria, CA
Donald Hargreaves - San Jose CA, US
Vincent Wong - San Jose CA, US
Richard Duesterberg - Mountain View CA, US
Assignee:
JDS Uniphase Corporation - San Jose CA
International Classification:
H01S005/00
H01S003/08
US Classification:
372/108000, 372/043000
Abstract:
The invention provides a laser package having a single-mode laser diode for emitting light; a single-mode optical fiber comprising an uncoated microlens formed on an input end of said single-mode optical fiber, the microlens optically coupled to the laser diode for receiving the light, the microlens being constructed so as to reduce a level of back reflection into the laser diode so as not to disturb an operation of the laser diode, wherein a center axis of the single-mode optical fiber is co-planar with an optical axis of the laser diode; and a grating formed in the single-mode optical fiber for providing feedback to the laser diode to stabilize the emitted light from the laser diode. The single-mode optical fiber can include a length of polarization maintaining fiber between the grating and the single-mode laser diode.

Multi-Channel Laser Pump Source For Optical Amplifiers

US Patent:
2004010, Jun 3, 2004
Filed:
Jul 9, 2003
Appl. No.:
10/616008
Inventors:
William Bischel - Menlo Park CA, US
David Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
Simon Field - Palo Alto CA, US
Markus Hehlen - Los Gatos CA, US
Richard Tompane - Los Altos CA, US
Andrew Ryan - Sunnyvale CA, US
C. Fanning - Hillsboro OR, US
Jim Li - Fremont CA, US
Nina Morozova - San Jose CA, US
Assignee:
Gemfire Corporation
International Classification:
G02B006/12
US Classification:
385/014000
Abstract:
An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Optical Fiber Pigtail Assembly

US Patent:
2005007, Apr 7, 2005
Filed:
Dec 4, 2003
Appl. No.:
10/727735
Inventors:
Richard Duesterberg - Mountain View CA, US
Edmund Wolak - Palo Alto CA, US
Marc Gunten - Los Altos CA, US
Nina Morozova - San Jose CA, US
Donald Hargreaves - Sidney, CA
Prasad Yalamanchili - Santa Clara CA, US
Hilary Clarke - Milpitas CA, US
Jay Skidmore - San Jose CA, US
Lei Xu - Milpitas CA, US
Christopher Hart - West Melbourne FL, US
William Bardy - Palm Bay FL, US
Jeffrey Zack - Melbourne FL, US
Kuochou Tai - Fremont CA, US
Assignee:
JDS Uniphase Corporation - San Jose CA
International Classification:
G02B006/22
US Classification:
385128000, 385094000
Abstract:
A fiber tail assembly (FTA) with a micro-lens formed in the fiber tip is used to couple the laser light out of the package and along the fiber. The FTA is soldered at two points where metallized bands are deposited on the fiber pigtail, one at a fiber mount near the diode where it can be soldered into alignment with the laser diode, and two at the snout which forms a feed through the housing and seal for the package. Typically, the FTA is metallized along its entire length within the package. In this invention the two-metallized bands are separated by a region that is unmetallized.

Isbn (Books And Publications)

Vrata

Author:
Nina Morozova
ISBN #:
5732003681

Literaturnye Predaniia Xviii Stoletiia: Sbornik Anekdotov O Russkikh Pisateliakh Xviii Veka

Author:
Nina Morozova
ISBN #:
5853410091

Possible Relatives

Galina Morozova  Olga Morozova  Nina D Johnson  Nina B Stancil  Nina R Johnston  Nina R Stanfield  Nina B White  Nina G Jones  Nina Stanley  Nina R Whitehead 

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