Norbert T Emanuel, 96Diamond Springs, CA

5177591, Jan 5, 1993

Aug 20, 1991

7/747733

Norbert T. Emanuel - Los Altos CA

H01L 2350
H01L 2354

257674

A lead frame interconnection assembly and method of fabricating the assembly having multi-layered alignment bars. First and third layers of the alignment bars are strips of water soluble tape attached at opposite sides of the conductive fingers. The strips of tape are perpendicular to the conductive fingers and parallel to each other. The strips of tape sandwich a center layer that is made of a flowable, water soluble material. Preferably, the alignment bar acts as a dam bar to stop the flow of encapsulant material during the formation of a package. After the alignment bar has served the intended function, the bar may be dissolved without adversely affecting the structural integrity of the conductive fingers.

5231755, Aug 3, 1993

Dec 30, 1992

7/998546

Norbert T. Emanuel - Los Altos CA

Emanuel Technology, Inc. - Sunnyvale CA

H01R 4300

29827

A method of fabricating a lead frame inner connection assembly includes forming a lead frame having conductive fingers with inner lead ends connected to an electronic component, such as an integrated circuit die. Fluid-soluble alignment bars are deposited and cured within the areas between the conductive fingers. Preferably, the alignment bars are water soluble and are deposited using silk screen techniques. In a subsequent step of encapsulating the electronic component and inner lead ends, the alignment bars function as dams to prevent the flow of material beyond the desired extent of the encapsulation. At the ends of the alignment bars opposite to the electronic component a molded carrier ring may be formed, with the alignment bars again acting as dams to limit the flow of material. Conductive material can be contained within fluid-soluble material, thereby providing some degree of electrical connection between adjacent conductive fingers via the alignment bars.