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Norman B Mcneal, 63828 N Church St, Hazleton, PA 18201

Known as:
Norman Suzanne Mcneal Norman M Mcneal Norman B Mcniel
Related to:
David Joe Mclain 75

Norman Mcneal Phones & Addresses

828 Church St, Hazleton, PA 18201    570-4547732   

404 Allen St, Hazleton, PA 18201    570-4541064   

West Hazleton, PA   

Oceanside, CA   

828 N Church St, Hazleton, PA 18201   

Work

Position: Production Occupations

Education

Degree: Associate degree or higher
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Mentions for Norman B Mcneal

Career records & work history

Lawyers & Attorneys

Norman Mcneal Photo 1

Norman Mcneal - Lawyer

Specialties:
Chapter 7 Bankruptcy, Chapter 13 Bankruptcy, Criminal Defense, DUI & DWI, Family, General Practice, Child Custody, Child Support, Mediation
ISLN:
1001148712
Admitted:
2021

Publications & IP owners

Us Patents

Easily Repairable, Low Cost, High Speed Electromechanical Assembly Of Integrated Circuit Die

US Patent:
4598308, Jul 1, 1986
Filed:
Apr 2, 1984
Appl. No.:
6/596053
Inventors:
Christopher D. James - La Costa CA
Norman E. McNeal - Carlsbad CA
Assignee:
Burroughs Corporation - Detroit MI
International Classification:
H01L 2340
H01L 2350
US Classification:
357 81
Abstract:
An assembly of intercoupled integrated circuit die comprises: a substrate having a plurality of holes which extend through the substrate; each hole is of a size that is suitable to receive an integrated circuit die; a plurality of independent subassemblies are also provided; each subassembly includes an integrated circuit die and a heat sink which is attached to the back of the die and extends beyond it; each subassembly is aligned with a respective hole in the substrate such that the die lies in the hole and the heat sink extends beyond the hole and attaches to the substrate; subassemblies are interconnected by printed conductors on the substrate and discrete wires that are bonded from the front of the die to the conductors; and the die and heat sink have similar thermal expansion coefficients, while the substrate has a substantially different thermal expansion coefficient.

Epoxy-Glass Integrated Circuit Package Having Bonding Pads In A Stepped Cavity

US Patent:
4643935, Feb 17, 1987
Filed:
Jan 21, 1986
Appl. No.:
6/819995
Inventors:
Norman E. McNeal - Carlsbad CA
Richard A. Nagy - Leucadia CA
Ronald A. Norell - Carlsbad CA
Assignee:
Burroughs Corporation - Detroit MI
International Classification:
B32B 310
B32B 2738
US Classification:
428157
Abstract:
An integrated circuit package comprises a plurality of thin flat epoxy-glass layers which are arranged in a stack and are laminated together by prepreg layers that lie between the epoxy-glass layers. This stack has a cavity which is staircase-shaped and extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along the internal epoxy-glass layer and then penetrates through it. Patterned electrical conductors lie on the flat surface of the internal epoxy-glass layer, including wire bonding pads on its exposed flat surface portion.

Possible Relatives

Cynthia Mcneal  David B Mcneal  Dean Mcneal  Dale W Mcneal  Debbie Mcneal  Dana E Mcneal  Debra A Mcneal  Norman W Johnson  Norman T Standfield  Norman C Johnston 

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