Ying Cao Ma, 613973 Soutirage Ln, San Jose, CA 95135

2021000, Jan 7, 2021

Jul 7, 2019

16/504271

Dong Li - San Ramon CA, US
Ying Ma - Pleasanton CA, US
Ge Yi - San Ramon CA, US
Zongrong Liu - Pleasanton CA, US

H01L 23/00
H01L 21/56
H01L 21/683

A piece of chip-to-wafer and chip-to-chip bonding equipment, which has innovative designs enabling chip(s) from either a diamagnetic carrier or a diced wafer to expose the chip back side surface for pickup, is invented. The designs either use a levitation technology, or air dynamic, or a novel mechanical design to fulfill the chip front surfaces touchless requirement to avoid the chip surface contamination. The invented chip bonder is particularly useful for bonding applications which require using chips with zero tolerance of particle and/or contamination on the chip front surfaces or bonding surfaces.

2020038, Dec 3, 2020

May 31, 2019

16/428860

Dong Li - San Ramon CA, US
Ying Ma - Pleasanton CA, US
Ge Yi - San Ramon CA, US
Zongrong Liu - Pleasanton CA, US

H03H 9/02
H03H 9/17

An acoustic wave device system with its piezoelectric layer originating from a single crystal piezoelectric wafer/substrate is invented along with sets of detailed process steps to fabricate such a device using wafer-to-wafer and/or die-to-wafer bonding technologies. The proposed device system is particularly good to make bulk acoustic wave (BAW) devices. Methods allowing the single crystal piezoelectric wafer/substrate to be re-used are also given. The proposed methods include detailed process steps to allow heterogeneous integration of electrical chips into the system in a very cost efficient manner. The invention provides a practical and low-cost approach to fabricate the radio frequency (RF) front end chip incorporating RF filters and electronic components integrated into a small footprint which is particularly useful for mobile device and RF stations.

2020037, Nov 26, 2020

Mar 2, 2020

16/806656

- Santa Clara CA, US
Lin ZHANG - San Jose CA, US
Jiyong HUANG - Rockwall TX, US
Joseph C. WERNER - Santa Clara CA, US
Stanley WU - San Ramon CA, US
Mahesh Adinath KANAWADE - Santa Clara CA, US
Yikai CHEN - San Jose CA, US
Yixing LIN - Saratoga CA, US
Ying MA - Castro Valley CA, US

C23C 16/44
C01F 17/265

Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.

2019004, Feb 7, 2019

Jul 26, 2018

16/046105

- Santa Clara CA, US
Ali SALEHPOUR - Saratoga CA, US
Stanley WU - San Ramon CA, US
Ying MA - Castro Valley CA, US

H01L 21/677
H01L 21/67

A method and apparatus for monitoring substrate lift pin operation is disclosed and includes a support pedestal for a vacuum chamber, the support pedestal comprising a body having a plurality of openings formed between two major sides of the body, and a substrate support device disposed in each of the plurality of openings, each of the support devices comprising a housing disposed in the body, the housing having a bore formed therethrough, and a support pin disposed in the bore, wherein the body includes a monitoring device positioned proximal to the support pins of each of the substrate support devices.

2017030, Oct 26, 2017

Apr 21, 2017

15/494186

- Santa Clara CA, US
Ying MA - Castro Valley CA, US
DongQing LI - Fremont CA, US

C23C 16/50
H01J 37/32
H01J 37/32
C23C 16/455
C23C 16/455
C23C 16/455
C23C 16/44
H01L 21/02
B08B 7/00

A method and apparatus for a deposition chamber is provided and includes a twin chamber that includes a first remote plasma system coupled and dedicated to a first processing region, a second remote plasma system coupled and dedicated to a second processing region, and a third remote plasma system shared by the first processing region and the second processing region.

2015027, Oct 1, 2015

Mar 26, 2015

14/670231

- San Leandro CA, US
Ying Ma - Castro Valley CA, US
Prem Krish - Foster City CA, US

F03B 1/02
F03B 11/00

A system including a hydraulic turbine system, including a first hydraulic turbine, including a first hydraulic body with a first runner chamber, a first runner within the first runner chamber, a first primary nozzle fluidly coupled to the first runner chamber, a first auxiliary nozzle fluidly coupled to the first runner chamber and configured to equalize pressure in the first runner chamber, and a first valve fluidly coupled to the first auxiliary nozzle and configured to control a fluid flow into the first runner chamber.

2015011, Apr 30, 2015

Oct 27, 2014

14/525081

- San Leandro CA, US
John Sienkiewicz - San Mateo CA, US
Prem Krish - Foster City CA, US
Ying Ma - San Leandro CA, US
Mark Richter - Orinda CA, US
Felix Winkler - Berkeley CA, US

B01D 53/14
B01D 53/18

423210, 422187, 422113

A system includes a solvent gas processing system having a high pressure reaction vessel configured to remove an acid gas from an untreated feed gas using a solvent in a lean solvent fluid stream. The system includes a high pressure reaction vessel is configured to output a treated clean gas and a first flow of a high pressure fluid stream via a first flow path. The system includes a turbine having a main nozzle, an auxiliary nozzle, and an outlet. The main nozzle is configured to receive a second flow of the high pressure fluid stream from the first flow path via a main flow path. The system includes an auxiliary nozzle valve disposed along an auxiliary flow path. The auxiliary nozzle valve is configured to control a third flow of the high pressure fluid stream into the auxiliary nozzle of the turbine.