Paul W Bless, 787632 New Second St, Melrose Park, PA 19027
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Dielectric Pastes And Tapes, And Metal Substrates Coated Therewith
US Patent:
5998036, Dec 7, 1999
Filed:
Feb 9, 1998
Appl. No.:
9/020394
Inventors:
Sidney J. Stein - Bryn Mawr PA
Richard L. Wahlers - Churchville PA
Paul W. Bless - Melrose Park PA
Charles Barclay - Lightwater, Surrey, GB
Richard B. Tait - Early, Reading, Berks, GB
Richard L. Wahlers - Churchville PA
Paul W. Bless - Melrose Park PA
Charles Barclay - Lightwater, Surrey, GB
Richard B. Tait - Early, Reading, Berks, GB
International Classification:
B32B 1700
US Classification:
428433
Abstract:
The present invention relates to dielectric materials which may be used in the manufacture of, e. g. , low profile heaters. Such dielectric materials comprise at least about 50% of a glass composition having about 35-50% SiO. sub. 2, about 30-40% of an alkaline earth metal oxide selected from the group consisting of CaO, MgO, and SrO, about 13--22% Al. sub. 2 O. sub. 3, and about 0-10% B. sub. 2 O. sub. 3, the percentages being weight percentages based on the weight of the total glass composition. Certain dielectric compositions of the disclosure have a linear thermal expansion coefficient in the range of about 6. 0 to 9. 0 ppm/. degree. C.
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