Paul G Dufresne, 59973 Ithan Ln, Langhorne, PA 19047

6372113, Apr 16, 2002

Sep 13, 1999

09/394675

Charles B. Yates - Princeton NJ
George Gaskill - Manahawkin NJ
Ajesh Shah - West Windsor NJ
Adam M. Wolski - Edgewater NJ
Paul DuFresne - Langhorne PA

Yates Foil USA, Inc. - Bordentown NJ

C25D 338

205111, 205296, 205297, 428607, 428612, 428675, 428687, 428935

Treated copper foil produced by electrodepositing on a matte surface of a base copper foil a âcorrectiveâ copper layer having a surface roughness different from the surface roughness of the matte surface of the base foil and which has a peak count greater than the peak count of the matte surface of the base foil. In the electrodeposition there are used a unique electrolyte composition and plating conditions effective to control the micro-throwing process of the plating process so that the surface roughness of the corrective is substantially constant from one batch of base foil to another.

5447619, Sep 5, 1995

Nov 24, 1993

8/156824

Adam M. Wolski - Edgewater Park NJ
Paul Dufresne - Langhorne PA
Kurt Ac - Hamilton NJ
Michel Mathieu - Robbinsville NJ

Circuit Foil USA, Inc. - Bordentown NJ

C25D 104
C25D 706
B21C 3700

205 50

A surface of copper foil is protected from oxidation and tarnishing by electrodepositing on the surface a protective layer containing metallic zinc and one or more compound of tri-valent chromium, which protection layer is easily removable by dissolution in a dilute aqueous alkaline solution and which preferably has a zinc to chromium weight ratio of 1:1 or greater. An electrodeposited copper foil especially suited for multilayer printed circuit boards has such a protective layer electrodeposited on the matte side thereof and an electrodeposited copper bonding treatment on the shiny side thereof.

6224991, May 1, 2001

Sep 13, 1999

9/394682

Charles B. Yates - Princeton NJ
George Gaskill - Manahawkin NJ
Ajesh Shah - West Windsor NJ
Adam M. Wolski - Edgewater NJ
Paul DuFresne - Langhorne PA

Yates Foil USA, Inc. - Bordentown NJ

B32B 1520
C25D 312
C25D 510
C25D 706

428607

Treated copper foil for use in the manufacture of copper-clad laminates for printed circuit boards, wherein a continuous, very thin cobalt barrier layer, which is substantially non-ferromagnetic, is electrodeposited on a copper bonding treatment electrodeposited on a bonding side of a base copper foil; and a process and electrolyte for producing such treated foil, wherein the electrolyte contains a low concentration of cobalt and certain addition agents.

5989727, Nov 23, 1999

Mar 4, 1998

9/034264

Charles B. Yates - Princeton NJ
Adam Wolski - Edgewater NJ
George Gaskill - Manahawkin NJ
Keith Bodendorf - Westhampton NJ
Paul Dufresne - Langhorne PA

Circuit Foil U.S.A., Inc. - Bordentown NJ

B32B 1508
B32B 1520
C25D 706

428607

Treated electrolytic copper foil wherein the shiny side of the raw foil is modified and smoothed by an electrodeposited copper gilding layer, a copper-clad laminate produced with such foil, and an electrical circuit produced from such a laminate. The preferred foil has the surface of the shiny side of the raw foil modified by an electrodeposited copper gilding layer, a copper dendritic layer electrodeposited on the gilding layer, and a second copper gilding layer electrodeposited on the first dendritic layer, while a copper dendritic layer is electrodeposited on the surface of the matte side of the foil, and a copper gilding is electrodeposited on the latter dendritic layer.

6270645, Aug 7, 2001

Sep 26, 1997

8/938156

Charles B. Yates - Princeton NJ
Adam Wolski - Edgewater NJ
George Gaskill - Manahawkin NJ
Keith Bodendorf - Westhampton NJ
Paul Dufresne - Langhorne PA

Circuit Foil USA, Inc. - Bordentown NJ

C25D 104
C25D 510

205 77

A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of from about 40 to about 100 A/ft. sup. 2, a plating time of greater than 30 seconds, and the electrolyte is a copper sulfate-sulfuric acid solution containing arsenic, chloride ions and 2 imidazalidinethione. The raw foil is transferred to a station for applying the treatment directly from a rotating drum cathode machine on which it is produced, at the same speed at which the raw foil is produced, and then to a barrier layer station, a stainproofing station and a chemical adhesion promoter station, after which it is dried and coiled.