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Paul D Scheller, 61Bonita Springs, FL

Paul Scheller Phones & Addresses

Bonita Springs, FL   

Grand Blanc, MI   

Clarkston, MI   

Charlevoix, MI   

16512 Horseshoe Ct, Linden, MI 48451    810-4584621   

Flushing, MI   

Fenton, MI   

Davison, MI   

Genesee, MI   

Crestview, FL   

Mentions for Paul D Scheller

Paul Scheller resumes & CV records

Resumes

Paul Scheller Photo 30

Design Systems Engineer

Location:
394 University Ave, Palo Alto, CA 94301
Industry:
Automotive
Work:
General Motors
Design Systems Engineer - Embedded Controls
Harman International Jun 2012 - Jul 2017
Senior Technical Program Manager
Magna International Dec 2006 - Jun 2012
Program Manager
Delphi Aug 1985 - Nov 2006
Various
Aug 1985 - Nov 2006
Design Systems Engineer
Education:
Michigan State University 1981 - 1985
Bachelor of Science In Mechanical Engineering, Bachelors, Mechanical Engineering
Lutheran High School West, Detroit, Mi 1981
Skills:
Automotive, Ppap, Root Cause Analysis, Lean Manufacturing, Fmea, Program Management, Apqp, Continuous Improvement, Manufacturing, Engineering Management, Manufacturing Engineering, Dfmea, Spc, Six Sigma, Supplier Quality, Ts16949, Electronics, Engineering, Automotive Engineering, Kaizen, Design For Manufacturing, Components, Iso/Ts 16949, Supplier, Manufacturing Operations Management, Value Stream Mapping
Paul Scheller Photo 31

Paul Scheller

Publications & IP owners

Us Patents

Electronic Device With An Enhanced Attachment To Surface Mount Lamps

US Patent:
6421249, Jul 16, 2002
Filed:
Oct 18, 2000
Appl. No.:
09/690390
Inventors:
Donald Milton Trombley - Flushing MI
David Brian Houser - Davison MI
Paul Dennis Scheller - Flushing MI
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H05K 710
US Classification:
361767, 361761, 361771, 439230, 362362, 362365
Abstract:
An electronic device having an enhanced attachment to a surface mount lamp ( ) includes a circuit board ( ), at least two conductive pads ( ), at least two adhesive pads ( ), and the surface mount lamp ( ). The conductive pads ( ) and the adhesive pads ( ) are integrally formed within the circuit board ( ). Preferably, each section of the circuit board ( ) allotted for one surface mount lamp ( ) has two conductive pads ( ) and two adhesive pads arranged in a grid-like pattern such that similar pads are in opposing corners of the grid. The surface mount lamp ( ) has two electrical leads ( ), each protruding from opposing corners of a base ( ) of the surface mount lamp ( ). These electrical leads ( ) are soldered to the conductive pads ( ) in the circuit board ( ). The unobscured opposing corners ( ) of the plastic base ( ) are partially melted and adhered to the adhesive pads ( ) in the circuit board ( ).

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