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Paul M Schreier, 46Austin, TX

Paul Schreier Phones & Addresses

Austin, TX   

34 Ripley St, Newton Center, MA 02459   

Newton, MA   

Georgetown, TX   

79 Gainsborough St, Boston, MA 02115   

3529 116Th St, Omaha, NE 68144    402-3339467   

Cambridge, MA   

Lincoln, NE   

2612 N 160Th Ave, Omaha, NE 68116    402-3339467   

Mentions for Paul M Schreier

Paul Schreier resumes & CV records

Resumes

Paul Schreier Photo 27

Paul Schreier

Paul Schreier Photo 28

Technology Marketing Professional

Position:
Product Marketing Manager, MEMS Microphones at Analog Devices
Location:
Boston, Massachusetts
Industry:
Semiconductors
Work:
Analog Devices since Apr 2011
Product Marketing Manager, MEMS Microphones
Texas Instruments Jul 2007 - Apr 2011
Product Marketing Manager
NXP (Philips) Semiconductors Sep 2005 - Jun 2007
Product Marketing Engineer
National Semiconductor May 2002 - Aug 2005
Senior Sales Engineer
National Semiconductor May 2001 - May 2002
Technical Marketing Engineer
Education:
Boston College - Wallace E. Carroll Graduate School of Management 2008 - 2010
MBA, General Management
University of Nebraska Aug 1996 - May 2001
B.S., Business Administration (Finance
University of Nebraska-Lincoln 1996 - 2000
B.S., Computer Engineering
Skills:
Account Management, Business Case, Channel Partners, New Product Roll Out, Product Marketing, Product Development, Semiconductor Industry, Pricing, Positioning, Marketing, Management, Channel, Semiconductors, Product Management, Cross-functional Team Leadership
Interests:
new technology, corporate strategic development, investment management, golf, tennis, squash, biking, running, travel
Paul Schreier Photo 29

Paul Schreier

Publications & IP owners

Us Patents

Microphone With Built-In Speaker Driver

US Patent:
2016018, Jun 23, 2016
Filed:
Dec 22, 2014
Appl. No.:
14/580041
Inventors:
- San Jose CA, US
Paul M. Schreier - Newton MA, US
Kieran P. Harney - Andover MA, US
Joshua C. LeMaire - San Francisco CA, US
Aleksey S. Khenkin - Nashua NH, US
International Classification:
H04R 1/04
H04R 17/00
Abstract:
A microphone package is integrated with a built-in speaker driver. A microphone application-specific integrated circuit (ASIC) and the speaker driver can be directly coupled to an external application processor, eliminating a need for a codec and thus, reducing the size, cost, and/or complexity of a device. In one aspect, the speaker driver and the microphone ASIC are implemented as separate dice mounted on the package substrate. In another aspect, the speaker driver and the microphone ASIC are implemented as stacked die on the package substrate. In yet another aspect, the speaker driver and the microphone ASIC are implemented as a single die on the package substrate.

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