Peter Viera Bratin, 736741 169Th St, Flushing, NY 11365

6673226, Jan 6, 2004

Dec 20, 2002

10/325334

Alex Kogan - Carlstadt NJ
Eugene Shalyt - Washington Township NJ
Peter Bratin - Flushing NY
Michael Pavlov - Fairlawn NJ
Michael James Perpich - Hackensack NJ

ECI Technology - East Rutherford NJ

G01N 2726

205 81, 205101, 2057785, 205789, 436101, 436125

The concentration of chloride ion in an acid copper electroplating bath is determined from the effect that chloride exerts on the copper electrodeposition rate in the presence of organic additives. A cyclic voltammetric stripping (CVS) rate parameter is measured, before and after standard addition of a plating bath sample, in an acid copper electrodeposition solution containing little or no chloride and at least one organic additive. Cross contamination and waste disposal issues associated with the reagents and reaction products involved in chloride titration analyses are avoided. The method may also be applied to analysis of other halides (bromide and iodide) and other solutions.

6709561, Mar 23, 2004

Nov 6, 2002

10/288989

Michael Pavlov - Fairlawn NJ
Gene Chalyt - Washington Township NJ
Peter Bratin - Flushing NY
Alex Kogan - Carlstadt NJ
Michael James Perpich - Hackensack NJ

ECI Technology, Inc. - East Rutherford NJ

C25D 2112

205 81, 205775, 2057805, 205787, 2057935, 205794

The concentration of a reducing agent in an electroless bath for plating a first metal is determined from the effect of the reducing agent on the electrodeposition rate of a second metal. For electroless cobalt and nickel baths, a sample of the electroless plating bath is added to an acid copper plating solution and the copper electrodeposition rate is measured by cyclic voltammetric stripping (CVS) analysis. Separate analyses for hypophosphite and dimethylamineborane in baths employing both reducing agents are attained via selective decomposition of the dimethylamineborane in acidic solution.

6733656, May 11, 2004

Apr 3, 2002

10/115539

Gene Chalyt - Washington Township NJ
Peter Bratin - Flushing NY
Michael Pavlov - Fairlawn NJ
Alex Kogan - Carlstadt NJ
Michael James Perpich - Hackensack NJ

ECI Technology Inc. - East Rutherford NJ

G01N 2748

205775, 205 81, 204434

In the present invention, the test reference electrode used for voltammetric analysis of a plating bath is calibrated relative to the zero-current point between metal plating and stripping at a rotating platinum disk electrode in the plating bath supporting electrolyte. This calibration is readily performed during the normal course of cyclic voltammetric stripping (CVS) or cyclic pulse voltammetric stripping (CPVS) plating bath analysis the need for additional instrumentation or removal of the test reference electrode from the analysis equipment. Automatic calibration of the reference electrode enabled by the present invention, saves labor, time and expense, and minimizes errors in the plating bath analysis.

6749739, Jun 15, 2004

Oct 7, 2002

10/266006

Gene Chalyt - Washington Township NJ
Peter Bratin - Flushing NY
Michael Pavlov - Fairlawn NJ
Alex Kogan - Carlstadt NJ
Michael James Perpich - Hackensack NJ

ECI Technology, Inc. - East Rutherford NJ

G01N 2726

2057885, 205 81, 205787, 204434

Relative concentrations of active suppressor additive species and suppressor breakdown contaminants in an acid copper electroplating bath are determined by cyclic voltammetric stripping (CVS) dilution titration analysis using two negative electrode potential limits. The analysis results for the more negative potential limit provide a measure of the suppressor additive concentration alone since the suppressor breakdowvn contaminants are not effective at suppressing the copper deposition rate at the more negative potentials. The analysis results for the less negative potential limit provide a measure of the combined concentrations of the suppressor additive and the suppressor breakdown contaminants. Comparison of the results for the two analyses yields a measure of the concentration of the suppressor breakdown contaminants relative to the suppressor additive concentration.

6890758, May 10, 2005

Jun 13, 2003

10/461652

Eugene Shalyt - Washington Township NJ, US
Michael Pavlov - Fairlawn NJ, US
Peter Bratin - Flushing NY, US
Alex Kogan - Carlstadt NJ, US
Michael James Perpich - Hackensack NJ, US

ECI Technology, Inc. - East Rutherford NJ

G01N031/16

436163, 436 51, 436111, 436112, 436124, 436125, 436128, 436150

The concentration of citrate complexing agent in an electroless cobalt or nickel plating bath is determined by titrating a sample of the electroless plating bath containing a small concentration of free fluoride ion with a standard lanthanum nitrate solution. During the titration, La ion first reacts preferentially with the citrate complexing agent and then with fluoride ion, which reduces the free fluoride ion concentration. The endpoint for the titration is indicated by a substantial decrease in the free fluoride ion concentration, which is detected via a fluoride ion specific electrode (ISE). The method can be used for analysis of other complexing agents.

7186326, Mar 6, 2007

May 27, 2004

10/856619

Eugene Shalyt - Washington Township NJ, US
Michael Pavlov - Fairlawn NJ, US
Peter Bratin - Flushing NY, US
Alex Kogan - Carlstadt NJ, US
Michael James Perpich - Hackensack NJ, US

C25D 21/14
G01N 27/26

205 81, 205101, 205787

Suppressor and anti-suppressor additives in an acid copper sulfate plating bath are analyzed by the cyclic voltammetric stripping (CVS) method without cleaning or rinsing the cell between the two analyses. The suppressor analysis is performed first and the suppressor concentration in the resulting measurement solution is adjusted to a predetermined value corresponding to full suppression. This fully-suppressed solution is then used as the background electrolyte for the anti-suppressor analysis. This integrated analysis approach provides results comparable to those obtained with cell cleaning and rinsing between the analyses but significantly reduces the analysis time, consumption of expensive chemicals, and quantity of hazardous waste generated.

7291253, Nov 6, 2007

May 4, 2004

10/838803

Michael Pavlov - Fairlawn NJ, US
Eugene Shalyt - Washington Township NJ, US
Peter Bratin - Flushing NY, US

ECI Technology, Inc. - Totowa NJ

C25D 21/00

205 81, 2057935, 205794, 2057865, 205787

The 3-mercaptopropylsulfonic acid (MPSA) breakdown product of the bis(sodiumsulfopropyl)disulfide (SPS) additive used in acid copper plating baths accelerates copper electrodeposition and can be detected by cyclic voltammetric stripping (CVS) analysis. In the presence of oxygen, MPSA decomposes rapidly in acid copper sulfate baths so that the CVS stripping peak area (A) decreases on successive cycles. The slope of a plot of Avs. CVS cycle number (or time) or logarithm of the CVS cycle number (or time) provides a measure of the initial MPSA concentration.

7879222, Feb 1, 2011

Aug 27, 2007

11/895836

Eugene Shalyt - Washington Township NJ, US
Michael Pavlov - Fairlawn NJ, US
Peter Bratin - Flushing NY, US

ECI Technology, Inc. - Totowa NJ

G01N 27/26

205775, 205 81, 204434

An additive breakdown product in an acid copper plating bath sample is detected by performing a voltammetric analysis for the leveler additive in two measurement solutions comprising different volume fractions of the copper plating bath sample in a background electrolyte. When the plating bath sample contains a substantial concentration of the additive breakdown product, the analyses for the first and second measurement solutions indicate different concentrations for the leveler additive in the plating bath sample. A comparison of the leveler additive concentrations indicated by the two analyses provides a measure of the concentration of the additive breakdown product.