BackgroundCheck.run
Search For

Ping Huang, 53Naperville, IL

Related to:
Hua Huang 59 Lisa Huang Liying H Xinda Yinmei Huang 49

Ping Huang Phones & Addresses

Naperville, IL   

Beaverton, OR   

Eden Prairie, MN   

Minneapolis, MN   

Osseo, MN   

Akron, OH   

Get Report
Control this profile

Mentions for Ping Huang

Ping Huang resumes & CV records

Resumes

Ping Huang Photo 37

Principal Design Engineer

Location:
Milpitas, CA
Industry:
Semiconductors
Work:
Intersil
Principal Design Engineer Piconetics Jan 2001 - May 2006
Member of Technical Staff Staff Design Engineer Jun 1993 - Jan 2001
Staff Design Engineer
Education:
Oklahoma State University 1991 - 1993
Masters, Electrical Engineering Chongqing University 1984 - 1989
Doctorates, Doctor of Philosophy, Electrical Engineering
Ping Huang Photo 38

Senior Member Of Technical Staff

Location:
Portland, OR
Industry:
Medical Devices
Work:
Te Connectivity Apr 2016 - Sep 2018
Principal Engineer Cabot Microelectronics Apr 2016 - Sep 2018
Senior Member of Technical Staff Cabot Microelectronics/Nexplanar Apr 2007 - Apr 2016
Senior Product Develop Engineer Ev3 Sep 2005 - Apr 2007
Senior R and D Engineer Cmc Materials Sep 2005 - Apr 2007
Senior Member of Technical Staff
Education:
The University of Akron 1999 - 2004
Doctorates, Doctor of Philosophy, Philosophy
Skills:
Research and Development, Design of Experiments, Materials Science, Characterization, Product Development
Ping Huang Photo 39

Ping Huang

Ping Huang Photo 40

Ping Huang

Ping Huang Photo 41

Ping Huang

Ping Huang Photo 42

Student

Location:
Beaverton, OR
Ping Huang Photo 43

Ping Huang

Ping Huang Photo 44

Ping Huang

Location:
United States

Publications & IP owners

Wikipedia

Ping Huang Photo 47

Huang Yg Ping

Huang Yong Ping(born 1954) is a contemporary French visual artist of Chinese origin. Huang's work combines many media and cultural influence, but is particularly strongly influence by...

Us Patents

Balloon Catheter Formed Of Random Copolymerized Nylons

US Patent:
7645498, Jan 12, 2010
Filed:
Oct 10, 2006
Appl. No.:
11/545441
Inventors:
Lixiao Wang - Long Lake MN, US
Ping Huang - Plymouth MN, US
Assignee:
ev3 Inc. - Plymouth MN
International Classification:
B29D 22/00
B29D 23/00
B32B 1/08
US Classification:
428 357, 428 352, 4284744, 4284755, 604 961, 604104, 606194
Abstract:
A catheter having a balloon comprised of a polymer material comprising first monomer units of an alkyl amide having 2 to 6 carbon atoms and second monomer units of an alkyl amide having 7 to 12 carbon atoms. The first and second monomer units are copolymerized with each other in a random fashion to form a random copolyamide polymer.

Method Of Fabricating A Polishing Pad With An End-Point Detection Region For Eddy Current End-Point Detection

US Patent:
8439994, May 14, 2013
Filed:
Sep 30, 2010
Appl. No.:
12/895529
Inventors:
William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Ping Huang - Eden Prairie MN, US
Richard Frentzel - Murrieta CA, US
Alexander William Simpson - Hillsboro OR, US
Assignee:
NexPlanar Corporation - Hillsboro OR
International Classification:
B24D 11/00
B24D 3/00
B24D 18/00
US Classification:
51293, 451537
Abstract:
Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described.

Polishing Pad For Eddy Current End-Point Detection

US Patent:
8628384, Jan 14, 2014
Filed:
Sep 30, 2010
Appl. No.:
12/895465
Inventors:
William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Ping Huang - Eden Prairie MN, US
Richard Frentzel - Murrieta CA, US
Alexander William Simpson - Hillsboro OR, US
Assignee:
NexPlanar Corporation - Hillsboro OR
International Classification:
B24D 3/28
US Classification:
451526, 451528, 451921, 451 6, 451287
Abstract:
Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Homogeneous Polishing Pad For Eddy Current End-Point Detection

US Patent:
2012008, Apr 5, 2012
Filed:
Sep 30, 2010
Appl. No.:
12/895479
Inventors:
William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Ping Huang - Eden Prairie MN, US
Richard Frentzel - Murrieta CA, US
Alexander William Simpson - Hillsboro OR, US
International Classification:
B24D 11/00
B24D 3/20
B24D 18/00
US Classification:
451526, 51293, 51296
Abstract:
Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Polishing Pad With Multi-Modal Distribution Of Pore Diameters

US Patent:
2012009, Apr 19, 2012
Filed:
Dec 27, 2010
Appl. No.:
12/979123
Inventors:
Ping Huang - Eden Prairie MN, US
Diane Scott - Portland OR, US
James P. LaCasse - Portland OR, US
William C. Allison - Beaverton OR, US
International Classification:
B24B 37/04
B29C 44/04
US Classification:
451527, 264 451, 264 453
Abstract:
Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.

Polishing Pad With Homogeneous Body Having Discrete Protrusions Thereon

US Patent:
2012030, Nov 29, 2012
Filed:
May 23, 2011
Appl. No.:
13/113655
Inventors:
Rajeev Bajaj - Fremont CA, US
Ping Huang - Eden Prairie MN, US
Robert Kerprich - Portland OR, US
William C. Allison - Beaverton OR, US
Richard Frentzel - Murrieta CA, US
Diane Scott - Portland OR, US
International Classification:
B24D 11/00
B29C 44/12
B29C 39/12
US Classification:
451527, 264255, 264 453
Abstract:
Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.

Polishing Pad With Polishing Surface Layer Having An Aperture Or Opening Above A Transparent Foundation Layer

US Patent:
2013032, Dec 5, 2013
Filed:
Jun 4, 2012
Appl. No.:
13/488149
Inventors:
Paul Andre Lefevre - Portland OR, US
William C. Allison - Beaverton OR, US
James P. LaCasse - Portland OR, US
Diane Scott - Portland OR, US
Alexander William Simpson - Hillsboro OR, US
Ping Huang - Beaverton OR, US
Leslie M. Charns - Portland OR, US
International Classification:
B24D 11/00
B24D 18/00
US Classification:
451529, 451527, 51298, 51296
Abstract:
Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.

Chemical Mechanical Planarization Pads Via Vat-Based Production

US Patent:
2020035, Nov 12, 2020
Filed:
May 7, 2020
Appl. No.:
16/868965
Inventors:
- Aurora IL, US
Lin FU - Rancho Palos Verdes CA, US
William Michael SPITZIG - Lake Oswego OR, US
Chen-Chih TSAI - Naperville IL, US
Ping HUANG - Beaverton OR, US
Justin STEWART - Aurora IL, US
Carlos BARROS - West Chicago IL, US
International Classification:
B24B 37/24
B24B 37/26
B24B 37/22
Abstract:
A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.

Possible Relatives

Cynthia M Huang  David T Huang  Dawei Huang  Dayong Huang  Da Huang  Daijie D Huang  Daisy Huang  Ping Lam  Ping T Meng  Ping P Lau 

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.