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Qi Xiang Zhu, 594317 Union St UNIT 3E, Flushing, NY 11355

Known as:
Qi X Zhu Qixiang Zhu Zhu X Qi
Related to:
Sammy M Zhu 25

Qi Zhu Phones & Addresses

4317 Union St APT 3E, Flushing, NY 11355   

Alpharetta, GA   

Queens, NY   

Columbia, SC   

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Mentions for Qi Xiang Zhu

Qi Zhu resumes & CV records

Resumes

Qi Zhu Photo 33

Investment Banking Associate

Location:
14425 28Th Ave, Flushing, NY 11354
Industry:
Financial Services
Work:
Morgan Stanley
Investment Banking Associate Morgan Stanley Jun 1, 2016 - Aug 1, 2016
Investment Banking Summer Associate Ricardo Apr 2012 - Jun 2015
Associate Ricardo Jul 2010 - Dec 2011
Senior Consultant Ricardo Jul 2008 - Jun 2010
Consultant General Motors Jan 1, 2007 - Jun 1, 2008
Product Marketing Specialist, Vehicle Sales, Service and Marketing
Education:
Nyu Stern School of Business 2015 - 2017
Master of Business Administration, Masters Shanghai Jiao Tong University 2005 - 2008
Masters, Engineering, Mechanical Engineering Shanghai Jiao Tong University 2001 - 2005
Bachelors, Engineering, Mechanical Engineering
Skills:
Strategy, Management, Cross Functional Team Leadership, Automotive, Leadership, Management Consulting, Consulting, Financial Modeling, Mergers and Acquisitions, Microsoft Excel
Certifications:
Cfa Level Ii Candidate
Qi Zhu Photo 34

Qi Zhu

Qi Zhu Photo 35

Qi Zhu

Qi Zhu Photo 36

Qi Zhu

Location:
Greater New York City Area
Industry:
Information Technology and Services
Qi Zhu Photo 37

Qi Zhu - Brooklyn, NY

Work:
Citywide Media - Long Island City, NY Sep 2012 to Mar 2013
Graphic Designer Visual Resources Collection, Art Department, Queens College - Flushing, NY 2009 to 2013
Assistant to the Curator The Knight News - Kew Gardens, NY Mar 2012 to May 2012
Graphic Design Volunteer Cool Culture - Queens, NY Jun 2011 to Mar 2012
Volunteer Position for Cool Culture
Education:
Queens College, City University of New York - Flushing, NY May 2013
Bachelor of Science in Graphic Design
Qi Zhu Photo 38

Qi Zhu - Brooklyn, NY

Work:
Executive Offices of New York City - New York, NY Apr 2011 to Mar 2012
Office Manager/Executive Coordinator LinChing Trading Inc - Brooklyn, NY Feb 2011 to Apr 2011
Showroom Administrative Assistant Baruch College - New York, NY Mar 2010 to Dec 2010
Student Academic Consulting Center Sigma Alpha Delta National Honor Society, Baruch Collge - New York, NY Jan 2010 to Dec 2010
Project Manager
Education:
Zicklin School of Business, Baruch College - New York, NY 2008 to 2011
Bachelor of Business Administration in Accountancy
Skills:
Knowledge of Microsoft Office Suite, QuickBooks Pro and Adobe Photoshop
Qi Zhu Photo 39

Qi Zhu - Jersey City, NJ

Work:
SAP Labs - Palo Alto, CA Aug 2012 to Dec 2012
Quality Assurance ZhiLian ZhaoPin Mar 2011 to Jun 2011
Recruiting Assistant
Education:
Beijing Normal University 2010
Bachelor of Science in Information Management and Information Systems Stevens Institute of Technology - Hoboken, NJ
Master of Science in Information Systems
Skills:
SQL, HTML

Publications & IP owners

Us Patents

Multi-Axis Compliance Spring

US Patent:
7011530, Mar 14, 2006
Filed:
May 23, 2003
Appl. No.:
10/443957
Inventors:
Suresh K. Sitaraman - Atlanta GA, US
Lunyu Ma - Atlanta GA, US
Qi Zhu - Atlanta GA, US
International Classification:
H01R 12/00
US Classification:
439 66
Abstract:
A multi-axis compliance spring includes at least an anchor portion attached to a surface of a substrate and a free portion detached from the substrate. The free portion includes at least one first section having at least one curvature originating from an internal stress in the free portion and a second section having at least one second curvature defined in a plane of the substrate prior to being detached from the free portion of the substrate.

Compliant Off-Chip Interconnects

US Patent:
2002011, Aug 29, 2002
Filed:
Feb 25, 2002
Appl. No.:
10/083782
Inventors:
Qi Zhu - Atlanta GA, US
Lunya Ma - Atlanta GA, US
Suresh Sitaraman - Atlanta GA, US
International Classification:
H05K007/00
US Classification:
361/728000
Abstract:
Electronic packages having compliant off-chip interconnects and methods of fabricating compliant off-chip interconnects are disclosed. A representative electronic package includes a substrate and a free-standing compliant off-chip interconnect. The free-standing compliant off-chip interconnect includes a first free-standing arcuate structure that is substantially parallel to the substrate. In addition, the method of fabricating free-standing arcuate structure compliant off-chip interconnects includes: depositing an arcuate structure compliant off-chip interconnect material; and forming the free-standing arcuate structure compliant off-chip interconnect.

Possible Relatives

Dawei I Zhu  Dehua Zhu  Di Zhu  Dian C Zhu  Diana Zhu  Dong Zhu  Dongming Zhu  Qi Lee  Qi Li  Qi D Lin 

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