Raymond A Prew Deceased14 Anthony Rd, Scituate, RI 02825
Raymond Prew Phones & Addresses
14 Anthony Rd, Foster, RI 02825 401-6475652
Rumford, RI
Johnston, RI
9455 108Th Ave, Vero Beach, FL 32967 561-3883735
Greenville, RI
Sebastian, FL
Mentions for Raymond A Prew
Publications & IP owners
Us Patents
High Speed, High Density Interconnection Device
US Patent:
6899550, May 31, 2005
Filed:
Feb 25, 2004
Appl. No.:
10/786248
Inventors:
Michael N. Perugini - Monroe CT, US
Gary D. Eastman - North Kingstown RI, US
Alfred J. Langon - Cranston RI, US
Raymond A. Prew - Foster RI, US
Erol D. Saydam - Foster RI, US
Gary D. Eastman - North Kingstown RI, US
Alfred J. Langon - Cranston RI, US
Raymond A. Prew - Foster RI, US
Erol D. Saydam - Foster RI, US
Assignee:
Advanced Interconnections Corporation - West Warwick RI
International Classification:
H01R012/00
US Classification:
439 74, 439608, 174255
Abstract:
An intercoupling component for receiving an array of contacts includes a non-conductive substrate having a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of contacts. Contacts are disposed within the holes and a cavities, which may be open to air or filled with some other dielectric material, are disposed in the substrate between adjacent contacts.
High Speed, High Density Interconnection Device
US Patent:
7021945, Apr 4, 2006
Filed:
Apr 8, 2004
Appl. No.:
10/820296
Inventors:
Michael N. Perugini - Monroe CT, US
Gary D. Eastman - North Kingstown RI, US
Alfred J. Langon - Cranston RI, US
Raymond A. Prew - Foster RI, US
Erol D. Saydam - Foster RI, US
Gary D. Eastman - North Kingstown RI, US
Alfred J. Langon - Cranston RI, US
Raymond A. Prew - Foster RI, US
Erol D. Saydam - Foster RI, US
Assignee:
Advanced Interconnection Corporation - West Warwick RI
International Classification:
H01R 12/00
US Classification:
439 74, 439 92, 439 95
Abstract:
An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
High Speed, High Density Interconnection Device
US Patent:
8109770, Feb 7, 2012
Filed:
Apr 4, 2006
Appl. No.:
11/397334
Inventors:
Michael N. Perugini - Monroe CT, US
Gary D. Eastman - North Kingstown RI, US
Alfred J. Langon - Cranston RI, US
Raymond A. Prew - Foster RI, US
Erol D. Saydam - Foster RI, US
Gary D. Eastman - North Kingstown RI, US
Alfred J. Langon - Cranston RI, US
Raymond A. Prew - Foster RI, US
Erol D. Saydam - Foster RI, US
Assignee:
Advanced Interconnections Corp. - West Warwick RI
International Classification:
H01R 12/00
US Classification:
439 74, 43960712
Abstract:
An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
High Speed, High Density Interconnection Device
US Patent:
2003023, Dec 25, 2003
Filed:
Jun 24, 2002
Appl. No.:
10/178957
Inventors:
Michael Perugini - Monroe CT, US
Gary Eastman - North Kingstown RI, US
Alfred Langon - Cranston RI, US
Raymond Prew - Foster RI, US
Erol Saydam - Foster RI, US
Gary Eastman - North Kingstown RI, US
Alfred Langon - Cranston RI, US
Raymond Prew - Foster RI, US
Erol Saydam - Foster RI, US
International Classification:
H01R013/648
US Classification:
439/607000
Abstract:
An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
Stapler For An Improved Flexible Pusher Retracting Member
US Patent:
4187971, Feb 12, 1980
Filed:
Jun 29, 1978
Appl. No.:
5/920195
Inventors:
Raymond A. Prew - Foster RI
Assignee:
Textron Inc. - Providence RI
International Classification:
B25C 516
US Classification:
227125
Abstract:
A stapler of the type having a top cover member and lever member mounted for pivotal movement between an operative position disposed in closing relation with the open top of the magazine chamber of a magazine member and a staple stick loading position displaced approximately 180. degree. , a staple stick pusher mounted slidable on a mounting rod within the magazine chamber and a flexible elongated pusher retracting member molded of plastic material having one end portion abutting the pusher apertured to receive the rod therethrough and the opposite end formed with a disk-shaped head insertable through an elongated slot in the top cover member so as to move within a space defined by the top cover member and the lever member.
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