Ray D Rust, 846909 Valley Ridge Ct, Raleigh, NC 27615

4820376, Apr 11, 1989

Nov 5, 1987

7/116988

William R. Lambert - Mendham NJ
Ray D. Rust - Berkeley Heights NJ

American Telephone and Telegraph Company AT&T Bell Laboratories - Murray Hill NJ

H01R 4300

156643

Disclosed is a method of fabricating conductive polymer interconnect (CPI) material which employs chains of electrically conductive particles within an elastomeric matrix. Contact resistance is improved by removing a thin layer is elastomeric material which remains after normal processing. The surface layer is removed by plasma etching so that the conductive particles protrude at both surfaces. The protruding particles can be plated to replace any conductive material removed by the etch.

6035805, Mar 14, 2000

Nov 23, 1998

9/199176

Ray Dean Rust - Midlothian VA

Depositech, Inc. - La Jolla CA

H05H 100

118723VE

A method and apparatus for vacuum depositing a coating onto a substrate are provided. The method includes the steps of: introducing an evaporant into a magnetically defined deposition region of a vacuum process chamber, ionizing the evaporant to form a plasma; generating a "magnetic bottle" magnetic field configuration to define the deposition region and to confine the plasma to the deposition region, further increasing the percentage ionization of the plasma to form a highly ionized media; creating a static dc electric field that is generally perpendicular to the magnetic field in the deposition region and parallel to the plane of the substrate; and then moving the substrate through the highly ionized media with the plane of the substrate and its direction of motion generally parallel to the magnetic field lines. The method of the invention is particularly suited to deposition of any atomistic evaporant onto intermediate-sized substrates.

4812217, Mar 14, 1989

Apr 27, 1987

7/042508

Carroll H. George - Norwood NY
Ray D. Rust - Berkeley Heights NJ

American Telephone and Telegraph Company, AT&T Bell Laboratories - Murray Hill NJ

C23C 1400

20419212

A process and apparatus for cleaning then coating articles such as circuit board panels with a metallic coating encompasses an enclosed evacuated chamber having a controlled low pressure gaseous process environment. The articles to be cleaned, then coated with a metallic deposit are continuously fed into the enclosed chamber through an air lock mechanism that permits the evacuated chamber to remain at its predetermined pressure and gaseous composition. Included within the chamber are a plurality of transport paths or panel carrying tracks. The articles to be cleaned, then coated are continuously transported along the various tracks while being coated. The plurality of tracks are positioned to be substantially parallel with each other so that articles on each track follow paths similar in direction and substantially equidistant from one another. A plurality of bidirectional coating sources are sequentially positioned on both sides of each article transport track so that both sides of the panels are coated.

4915805, Apr 10, 1990

Nov 21, 1988

7/273766

Ray D. Rust - Berkeley Heights NJ

AT&T Bell Laboratories - Murray Hill NJ

C23C 1434

20419212

A hollow cathode type inverted cylindrical magnetron apparatus construction comprises two separate units each having a rectangular C shape cross section. The two C shaped units are positioned together to form a hollow rectangular parallelpiped like cavity and articles to be sputtered are passed through this cavity. Bolted construction of simple elements having simple geometry are used to produce a very inexpensive structure which is easily serviceable. This magnetron construction uses permanent magnets all having the same north south pole orientation located behind the target material and surrounded on three sides by magnetic permeable material to confine the magnetic flux path. Hence the lines of force tend to be parallel to the substrate surface of the article very near to that surface and heating of the substrate is minimized. Cooling is provided by coolant carrying tubes interspersed between the magnets and the target material.

4277321, Jul 7, 1981

Jan 17, 1980

6/113117

Charles J. Bartlett - Madison NJ
Ronald J. Rhodes - South Plainfield NJ
Ray D. Rust - Berkeley Heights NJ

Bell Telephone Laboratories, Incorporated - Murray Hill NJ

C23C 1500

204192E

Multilayer printed wiring boards are conventionally laminated using epoxy adhesives. When the boards are drilled, a residual smear often remains within the drilled holes. This smear prevents proper through plating of the holes and the layers are left without some of the intended interconnections. In the past, the residual smear was removed by wet etching. A technique is described using plasma etching with the conductive surface layers of the drilled boards as the electrodes to generate the plasma. The plasma forms directly within the holes and effectively removes the smear. A dielectric material in contact or close proximity to the perimeter of each board provides uniformity of treatment over the panels.

4230553, Oct 28, 1980

Apr 23, 1979

6/032339

Charles J. Bartlett - Madison NJ
Ronald J. Rhodes - South Plainfield NJ
Ray D. Rust - Berkeley Heights NJ

Bell Telephone Laboratories, Incorporated - Murray Hill NJ

C23C 1500

204192E

Multilayer printed wiring boards are conventionally laminated using epoxy adhesives. When the boards are drilled, a residual smear often remains within the drilled holes. This smear prevents proper through plating of the holes and the layers are left without some of the intended interconnections. In the past, the residual smear was removed by wet etching. A technique is described using plasma etching with the conductive surface layers of the drilled boards as the electrodes to generate the plasma. The plasma forms directly within the holes and effectively removes the smear. A dielectric material in contact or close proximity to the perimeter of each board provides uniformity of treatment over the panels.

5855686, Jan 5, 1999

May 9, 1997

8/854191

Ray Dean Rust - Midlothian VA

Depositech, Inc. - La Jolla CA

H05H 100

118723VE

A method and apparatus for vacuum depositing a coating onto a substrate are provided. The method includes the steps of: introducing an evaporant into a magnetically defined deposition region of a vacuum process chamber, ionizing the evaporant to form a plasma; generating a "magnetic bottle" magnetic field configuration to define the deposition region and to confine the plasma to the deposition region, further increasing the percentage ionization of the plasma to form a highly ionized media; creating a static dc electric field that is generally perpendicular to the magnetic field in the deposition region and parallel to the plane of the substrate; and then moving the substrate through the highly ionized media with the plane of the substrate and its direction of motion generally parallel to the magnetic field lines. The method of the invention is particularly suited to deposition of any atomistic evaporant onto intermediate-sized substrates.

5670415, Sep 23, 1997

May 24, 1994

8/248406

Ray Dean Rust - Midlothian VA

DeposiTech, Inc. - La Jolla CA

H01L 2120

437106

A method and apparatus for vacuum depositing a coating onto a substrate are provided. The method includes the steps of: introducing an evaporant into a magnetically defined deposition region of a vacuum process chamber, ionizing the evaporant to form a plasma; generating a "magnetic bottle" magnetic field configuration to define the deposition region and to confine the plasma to the deposition region, further increasing the percentage ionization of the plasma to form a highly ionized media; creating a static dc electric field that is generally perpendicular to the magnetic field in the deposition region and parallel to the plane of the substrate; and then moving the substrate through the highly ionized media with the plane of the substrate and its direction of motion generally parallel to the magnetic field lines. The method of the invention is particularly suited to deposition of any atomistic evaporant onto intermediate-sized substrates.