Raymond E Wiech DeceasedNovato, CA

4562092, Dec 31, 1985

Oct 30, 1984

6/665507

Raymond E. Wiech - San Diego CA

Fine Particle Technology Corporation - Camarillo CA

H05K 312
B05D 512
B05D 128

427 58

A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips. Microcircuits are formed by disposing on the substrate and interconnecting via buss structures on the substrate various semiconductor dies with encapsulation of some or all of the substrates and components thereon, if desired. In addition, connection from the board to external circuits is available by means of an edge connector.

5271887, Dec 21, 1993

Mar 23, 1993

8/035948

Raymond E. Wiech - San Diego CA

Witec Cayman Patents, Ltd. - Cayman Islands

C04B 3806
C04B 4189

264 61

A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips. Microcircuits are formed by disposing on the substrate and interconnecting via buss structures on the substrate various semiconductor dies with encapsulation of some or all of the substrates and components thereon, if desired. In addition, connection from the board to external circuits is available by means of an edge connector.

4994215, Feb 19, 1991

Jul 5, 1988

7/214796

Raymond E. Wiech - San Diego CA

Fine Particle Technology Corp. - San Diego CA

C04B 3806

264 27

A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips. Microcircuits are formed by disposing on the substrate and interconnecting via buss structures on the substrate various semiconductor dies with encapsulation of some or all of the substrates and components thereon, if desired. In addition, connection from the board to external circuits is available by means of an edge connector.

5234655, Aug 10, 1993

Nov 21, 1990

7/616489

Raymond E. Wiech - San Diego CA

Witec Cayman Patents, Ltd.

C04B 3564

264227

A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips. Microcircuits are formed by disposing on the substrate and interconnecting via buss structures on the substrate various semiconductor dies with encapsulation of some or all of the substrates and components thereon, if desired. In addition, connection from the board to external circuits is available by means of an edge connector.

5262122, Nov 16, 1993

Dec 10, 1991

7/804529

Raymond E. Wiech - San Diego CA

Witec Cayman Patents, Ltd.

B22F 102
B22F 312

419 36

The disclosure relates to a method of binder removal from a green body before sintering or the like wherein the green body is initially heated to a temperature above the melting or flow point of the binder to liquify the binder and, at the elevated temperature, a small portion of the green body is brought into intimate contact with a non-supporting porous body of lower capillarity potential for the liquid binder. The liquid is drawn from all parts of the green body to the region of contact between the porous body and the green body and enters the body of lower capillarity potential preferentially, removing liquid from the green body through the surface of the green body only at said region of contact. The draining is continued with or without further increase in temperature until the green body is opened or becomes permeable.

4404166, Sep 13, 1983

Jan 22, 1981

6/227271

Raymond E. Wiech - San Diego CA

Witec Cayman Patents, Limited - Cayman Islands

B22F 300

419 36

A method and system whereby binder can be removed from a green body much more rapidly than in prior art systems without interfering with the integrity or aesthetics of the final part by providing a binder system having at least two components and preferably a mold release agent, the binder system having differing melting points. Each binder component can have parts with different melting temperature. When the temperature is raised to a point above the intermediate temperature at which the binder system flows, binder will proceed to exude to the surface of the green body wherefrom it can be removed. The binder is removed from the surface of the green body by blowing a non-saturated chemically inert atmosphere over the surface of the green body rapidly whereby the atmosphere at a region near the surface of the green body does not become saturated with the binder vapors. As an alternative, the green body can be placed on a wick with the air being blown rapidly over the surface of the green body as well as the wick itself to volatilize the binder and remove same from both the wick and the green body. As binder is removed from the green body, since only the lower melting point component binder is actually volatilized initially, the melting point of the binder system within the green body gradually increases since more of the higher melting point component binder remains behind.

4445936, May 1, 1984

Dec 21, 1981

6/332637

Raymond E. Wiech - San Diego CA

Witec Cayman Patents, Ltd.

B22F 300

75228

Ductility is controlled by controlling the size of the particles of particulate material and/or the degree of sphericity of the particles, the smaller and/or more spherical the particles, the greater the ductility of the material. The material has preferably spherical pores, preferably hermetic, with a controlled ratio of pore volume to material volume to provide the property of compressibility. The particulate material itself must have the capability of becoming ductile. The ratio of pore volume to total volume of the material is controlled by particle size, sintering profile the property of the material and the initial volume loading of the pre-sintered part (i. e. the ratio of binder to particulate material). Some materials which are not ductile in and of themselves can be formed into ductile and/or compressible materials in accordance with the system of the present invention.

4519447, May 28, 1985

Mar 5, 1984

6/584309

Raymond E. Wiech - San Diego CA

Fine Particle Technology Corporation - Camarillo CA

F28D 1500
H01L 2346

16510433

A system for cooling a substrate via a continuous enclosed path within the substrate that passes closely adjacent heat producing components on or adjacent the substrate. According to a first embodiment, heat, where located on the substrate, is transmitted to a heat sink in the vapor phase by a change in phase of a liquid in the path to a vapor, thereby creating little change in temperature from heat source to heat sink and maintaining the substrate and components at substantially the same substantially constant temperature. According to a second embodiment, heat is removed by a circulating conductive liquid in the continuous enclosed path which takes up heat at the sources and removes the heat at a sink in the path. The conductive liquid is part of a magnetohydrodynamic (MHD) cooling system wherein, at one location in the path, a current is applied to the liquid orthogonal to the path and a magnetic field is applied orthogonal to the path and the current flow to create a force on the conductive liquid along the path.