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Richard J FaubertPhoenix, AZ

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Phoenix, AZ   

McMinnville, OR   

41 Loch Eden Shores Rd, Meredith, NH 03253    603-2798277   

14242 S Canyon Dr, Phoenix, AZ 85048   

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Degree: Graduate or professional degree

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Richard Faubert

Location:
Phoenix, Arizona
Industry:
Electrical/Electronic Manufacturing

Publications & IP owners

Us Patents

Method For Selective Removal Of Copper

US Patent:
6387807, May 14, 2002
Filed:
Jan 30, 2001
Appl. No.:
09/772722
Inventors:
Richard Faubert - Phoenix AZ
John A. Adams - Escondido CA
Assignee:
SpeedFam-IPEC Corporation - Chandler AZ
International Classification:
H01L 2144
US Classification:
438687
Abstract:
A method for polishing a copper pattern on a workpiece is disclosed. The invention provides for selective micro-polishing of local regions of divergence of the profile of the copper pattern, to a predetermined state wherein the profile more closely approximates the profile of surrounding surfaces. Thereafter, the entire workpiece surface is polished in accordance with a predetermined polish profile. In the case of semiconductor wafers, local regions of a copper layer at the periphery of the wafer often have a thickness which is outside the thickness range for which a chemical mechanical polishing (CMP) tool can effectively polish the copper layer in accordance with a predetermined polish profile. According to one aspect of the present invention, local regions at the periphery of the wafer are first selectively polished to a predetermined state, after which a CMP tool can polish the entire wafer in accordance with a predetermined polish profile to achieve a desired surface configuration, whether planar or curved.

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