Richard R Grzybowski, 88Corning, NY

6601679, Aug 5, 2003

Sep 5, 2001

09/946997

David Crenella - Berlin CT
Michael P. Gozzo - Groton CT
Richard R. Grzybowski - Corning NY
Jeffrey M. Izard - Bolton CT
Robert G. Morgan - Bolton CT
Chester J. Slabinski - New Hartford CT

Otis Elevator Company - Farmington CT

B66B 134

187395, 187247, 187391

Elevator system hall fixtures such as lanterns, hall call button switches and lights, gongs, and floor position indicators are connected to a controller via wireless transceivers. The controller can be a system, group, and/or car controller. A low power wireless system connects all fixtures on one hallway, with a higher power wireless system connecting each hallway with the appropriate controller.

7480432, Jan 20, 2009

Feb 28, 2006

11/365391

Richard R Grzybowski - Corning NY, US
Stephan Lvovich Logunov - Corning NY, US
James Scott Sutherland - Corning NY, US
Alexander M. Streltsov - Corning NY, US

Corning Incorporated - Corning NY

G02B 6/42

385 52

Glass-based micropositioning systems and methods are disclosed. The micropositioning systems and methods utilize microbumps () formed in a glass substrate ( or ). The microbumps are formed by subjecting a portion of the glass substrate to localized heating, which results in local rapid expansion of glass where the heat was applied. The height and shape of the microbumps depend on the type of glass substrate and the amount and form of heat delivered to the substrate. The microbumps allow for active or passive micropositioning of optical elements, including planar waveguides and optical fibers. Optical assemblies formed using microbump micropositioners are also disclosed.

7505650, Mar 17, 2009

Mar 28, 2008

12/079804

Richard Robert Grzybowski - Corning NY, US
Stephan Lvovich Logunov - Corning NY, US
Alexander Mikhailovich Streltsov - Corning NY, US

Corning Incorporated - Corning NY

G02B 6/42
G02B 6/32
C03B 29/02

385 33, 385 88, 65106

Microlenses are formed on a substrate having a first absorption within an operational wavelength range, and a second absorption outside the operational wavelength range, wherein the second absorption is greater than the first absorption. One or more waveguides are coupled with a processing light beam having a wavelength outside the operational wavelength range, and the processing light beam is directed through the waveguides to the substrate to locally heat and expand the substrate so as to form microlenses on the substrate surface. The processing light beam is terminated to stop heating of the substrate and fix the microlenses.

7802927, Sep 28, 2010

Apr 30, 2009

12/432799

Seldon David Benjamin - Painted Post NY, US
Richard Robert Grzybowski - Corning NY, US
Christopher Paul Lewallen - Hudson NC, US
James Phillip Luther - Hickory NC, US
Wolfgang Gottfried Tobias Schweiker - Weyarn, DE
James Scott Sutherland - Corning NY, US

Corning Cable Systems LLC - Hickory NC

G02B 6/36

385 88, 385 52, 385 53, 385 31, 385 32, 385 92

A bent optical fiber coupler () that employs at least one optical fiber () is disclosed. The coupler includes a curved optical fiber guide channel () having a strong curve. The optical fiber(s) held within the optical fiber guide channel have a bend corresponding to the guide channel curve. The fiber end portions are optionally disposed within a straight fiber guide () at a coupler input/output end, which is preferably configured to have a standard connector geometry. Use of nanostructured fibers for the at least one optical fiber allows for strong bends having tight radii of curvature without imparting significant attenuation. Coupler assemblies that include the coupler optically coupled to at least one opto-electronic device () are also disclosed.

7949211, May 24, 2011

Feb 26, 2010

12/714021

Richard Robert Grzybowski - Corning NY, US
James Scott Sutherland - Corning NY, US

Corning Incorporated - Corning NY

G02B 6/12

385 14

A modular active board subassembly for coupling a waveguide array to an electrical component on a printed wiring board may include a substrate board with a sidewall extending around at least a portion of an attachment surface of the substrate board and forming a component cavity on the attachment surface. A transceiver may be disposed in the component cavity proximate an inboard edge of the substrate board. The transceiver may be electrically coupled to conductors on the attachment surface and electrically coupled to electrical contacts on an upper surface of the sidewall. A waveguide may be positioned in the component cavity and extend from the outboard edge of the substrate to the transceiver. The waveguide may be coupled to the transceiver.

8135024, Mar 13, 2012

Apr 10, 2006

11/402091

Francois G Abel - Rueschlikon, CH
Alan F Benner - Poughkeepsie NY, US
Richard R Grzybowski - Corning NY, US
Ilias Iliadis - Rueschlikon, CH
Rajaram Krishnamurthy - Adliswil, CH
Ronald P Luijten - Horgen, CH
Cyriel Minkenberg - Adliswil, CH

Corning Incorporated - Corning NY

H04L 12/56

370412, 370389, 370413

A method and system for reducing arbitration latency employs speculative transmission (STX) without prior arbitration in combination with routing fabric scheduled arbitration. Packets are sent from source locations to a routing fabric through scheduled arbitration, and also through speculative arbitration, to non-contentiously allocate outputs that were not previously reserved in the routing fabric to the speculatively transmitted packets.

8291729, Oct 23, 2012

Jul 15, 2008

12/669365

Richard R Grzybowski - Corning NY, US
Alexander Mikhailovich Streltsov - Corning NY, US
James Scott Sutherland - Corning NY, US

Corning Incorporated - Corning NY

C03B 23/00
C03B 23/20
C03B 23/203

65 335, 65 36, 65102, 65 63, 65 64

Disclosed is a method for fabricating glass bump standoff structures of precise height, the method comprising providing oversized glass bumps on a glass substrate, providing a heat source to heat the bumps, positioning a substrate to be aligned on the oversized bumps, and reducing the height of the oversized bumps by a combination of manipulations comprising (1) softening the bumps by heating the bumps and (2) applying pressure to the substrate to be aligned.

8397537, Mar 19, 2013

Jul 16, 2007

12/669381

Richard R Grzybowski - Corning NY, US
Alexander Mikhailovich Streltsov - Corning NY, US
James Scott Sutherland - Corning NY, US

Corning Incorporated - Corning NY

C03B 23/02
B23K 26/02
B23K 26/00

65106, 65 2912, 65 2918, 21912162, 21912166, 21912183

A method of forming, on the surface of a glass material, a raised feature having a height within a target range, comprising () providing a glass material having a surface, () providing the glass material locally, at a location at or below the surface, with an amount of energy causing local expansion of the glass material so as to raise a feature on the surface at the location, () detecting the height of the raised feature or the height over time of the raised feature, () () if the height is below or approaching a value below the target range, providing the glass material at the location with energy in a greater amount, or () if the height is above or approaching a value above the target range, providing the glass material at the location with energy in a lesser amount, and () repeating steps () and () as needed to bring the height within the target range. Methods and devices for automating this process are also disclosed.