Robert Edward Belke, 403572 Charlwood Dr, Rochester, MI 48306

6381837, May 7, 2002

Sep 4, 1998

09/148061

Jay DeAvis Baker - W. Bloomfield MI
Edward McLeskey - Waterford MI
Delin Li - Canton MI
Cuong Van Pham - Belleville MI
Robert Edward Belke - West Bloomfield MI
Vivek Amir Jairazbhoy - Farmington Hills MI
Thomas B Krautheim - Belleville MI
Mohan R. Paruchuri - Canton MI
Lakhi Nandlal Goenka - Ann Arbor MI
Jun Ming Hu - Canton MI

Visteon Global Technologies, Inc. - Dearborn MI

H05K 334

29840, 29832, 29834, 29831, 29846, 174261

A method for producing an electronic circuit assembly (e. g. , a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.

6403893, Jun 11, 2002

Mar 20, 2001

09/907971

Achyuta Achari - Canton MI
Andrew Zachary Glovatsky - Plymouth MI
Robert Edward Belke - West Bloomfield MI
Brenda Joyce Nation - Troy MI
Delin Li - Canton MI
Lakhi N. Goenka - Ann Arbor MI
Robert Joseph Gordon - Livonia MI
Thomas Bernd Krautheim - Belleville MI

Visteon Global Technologies, Inc. - Dearborn MI

H05K 114

174255, 174261, 29847, 216 15, 430311

A method for making a multi-layer electronic circuit board having electroplated apertures which may be selectively and electrically isolated from an electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material.

6490786, Dec 10, 2002

Apr 17, 2001

09/836658

Robert Edward Belke - West Bloomfield MI
Charles Alan Still - Clinton MI
Robert Joseph Gordon - Livonia MI

Visteon Global Technologies, Inc. - Dearborn MI

H05K 336

29830, 29825, 29831

A method for producing a circuit assembly having a polymeric member upon which conductors, such as conductors , may be easily and selectively interconnected to another circuit assembly device, and/or apparatus.

6501031, Dec 31, 2002

Sep 6, 2000

09/655809

Andrew Z. Glovatsky - Livonia MI
Jay D. Baker - Dearborn MI
Robert Edward Belke - West Bloomfield MI
Myron Lemecha - Dearborn Heights MI
Richard Keith McMillan - Dearborn MI
Thomas B. Krautheim - Belleville MI

Visteon Global Tech., Inc. - Dearborn MI

H05K 111

174262, 29846, 29832, 29852, 29856

A multi-layer electronic circuit board design having a core member a pair of dielectric layers disposed thereon, and a first circuit portion which is coupled to the dielectric layer and core member using a layer of adhesive material Circuit board design further having selectively formed âblindâ apertures, vias or cavities formed through the first circuit portion dielectric layer and adhesive layer thereby exposing core member.

6547117, Apr 15, 2003

Jul 12, 2001

09/904346

Andrew Zachary Glovatsky - Plymouth MI
Robert Edward Belke - West Bloomfield MI
Jay DeAvis Baker - Dearborn MI
Joseph Mario Giachino - Farmington Hills MI
Lakhi Nandlal Goenka - Ann Arbor MI
Myron Lemecha - Dearborn MI

Visteon Global Technologies, Inc. - Dearborn MI

B60R 700

224539, 224926

A container holder for receiving and securing a container is provided. In a preferred embodiment, the container holder comprises a base surface, at least one moldline structure unit, and a sensor. The sensor detects the presence of the container in the holder and induces deformation in the moldline structure unit such that the container is secured in the holder.

6571820, Jun 3, 2003

Jul 12, 2001

09/904231

Andrew Zachary Glovatsky - Plymouth MI
Robert Edward Belke - West Bloomfield MI
Jay DeAvis Baker - Dearborn MI
Joseph Mario Giachino - Farmington Hills MI
Lakhi Nandlal Goenka - Ann Arbor MI
Myron Lemecha - Dearborn MI

Visteon Global Technologies, Inc. - Dearborn MI

F61K 100

137353, 251294

A vent assembly that can be concealed when in a closed configuration is provided in one embodiment, the vent assembly comprises a base member and a guide member secured to a mounting surface of a duct or other passageway. A flexible rod is fixedly attached to the base member and slideably disposed within a channel defined by the guide member. A panel is disposed on or around the flexible rod and between the base and guide members. An actuator is able to deform the rod such that the panel moves away from the terminal opening of the duct, thereby opening the vent. A fluid distribution system incorporating vent assemblies in accordance with the present invention is also provided.

6584682, Jul 1, 2003

Mar 20, 2001

09/812345

Robert Edward Belke - West Bloomfield MI
Thomas Bernd Krautheim - Belleville MI
Vivek Amir Jairazbhoy - Farmington Hills MI
Delin Li - San Jose CA

Visteon Global Tech., Inc. - Dearborn MI

H05K 320

29831, 29846, 29852

A method for making multi-layer electronic circuit boards having aperture which may be selectively connected to an electrical ground potential.

6613239, Sep 2, 2003

Apr 17, 2001

09/836644

Andrew Z. Glovatsky - Plymouth MI
Robert E. Belke - West Bloomfield MI
Delin Li - San Jose CA
Lakhi N. Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Marc A. Straub - Dearborn Heights MI
Richard K. McMillan - Dearborn MI
Ram S. Raghava - Ann Arbor MI
Thomas B. Krautheim - Belleville MI
Michael A. Howey - Canton MI
Vivek A. Jairazbhoy - Farmington Hills MI

Visteon Global Tech., Inc. - Dearborn MI

B44C 122

216 13, 216 17, 216 41, 174250, 29846

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically grounded or isolated from an electrical ground plane.