Work:
Northrop Grumman Corporation
Staff Hardware Process Engineer
Northrop Grumman Corporation
Jul 2014 - Jun 2016
Superconducting Microelectronics Process Engineer
Applied Materials
Jul 1, 2010 - Jun 30, 2014
Process Engineer - Metal Depostion Products
Intel Corporation
Mar 2010 - Mar 2010
Process Td Engineer
University of Illinois at Urbana-Champaign
Jan 2004 - May 2009
Research Assistant - Department of Physics
University of Illinois at Urbana-Champaign
Jan 2005 - Jan 2009
Teaching Assistant
Jan 2005 - Jan 2009
Nahs
Education:
University of Illinois at Urbana - Champaign 2003 - 2009
Doctorates, Doctor of Philosophy, Physics
University of Illinois at Urbana - Champaign 2008 - 2009
Northeastern University 2001 - 2003
Master of Science, Masters, Physics
University of Massachusetts Amherst 1995 - 1999
Bachelors, Bachelor of Science, Physics, Chemistry
Skills:
Semiconductors, Thin Films, Cvd, Pvd, Design of Experiments, Spc, Nanotechnology, Metrology, Labview, Matlab, Failure Analysis, Data Analysis, Jmp, Statistics, Nanofabrication, Plasma Etch, Superconductors, Xps, Rf, Microwave, Dmaic, Device Physics, Fib, Tem, Aes, Process Integration, Defect Reduction, Quantum Computing, Microwave Systems, Rf Plasma, Sem/Edx, Rga, Ald, Plasma, Xrd, Oes, Capability Maturity Model Integration, Engineering Design, Materials Science, Project Management, Capital Equipment, Continuous Improvement, Process Engineering, Functional Management, Cryogenic Systems, Interfaces
Interests:
Applied Materials (Company)
Gardening
Technology
Travelling
Home Improvement
Certifications:
Cmmi Associate
Program Management Foundations
Requirements Elicitation and Analysis
Cmmi Institute