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Robert P DuvaBelleville, NJ
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Us Patents
Process For The Electrodeposition Of Palladium
US Patent:
4401527, Aug 30, 1983
Filed:
Aug 20, 1981
Appl. No.:
6/294668
Inventors:
Robert Duva - Paramus NJ
Linda J. Mayer - Denville NJ
Linda J. Mayer - Denville NJ
Assignee:
Occidental Chemical Corporation - Warren MI
International Classification:
C25D 350
US Classification:
204 47
Abstract:
A process for the electrodeposition of palladium in which palladium is electrodeposited from an aqueous plating bath which contains a bath soluble palladium compound, an electrolyte compound and a nitrite compound in an amount sufficient to provide an excess of free nitrite ions relative to the palladium ions. In a preferred embodiment, the bath also contains a buffering agent to maintain the bath pH at from about 6. 5 to 7. 5. The electrodeposition is carried out using an insoluble anode, while maintaining the excess of free nitrite ions in the bath relative to the palladium ions. In this manner, the plating efficiency of the bath is maintained at a substantially constant, high level for extended periods of plating at current densities in excess of 10 amps per square decimeter.
Electroless Plating Process
US Patent:
5178918, Jan 12, 1993
Filed:
Sep 13, 1991
Appl. No.:
7/759504
Inventors:
Robert Duva - Paramus NJ
George Ondecker - West Caldwell NJ
George Ondecker - West Caldwell NJ
International Classification:
C23C 2600
US Classification:
4274431
Abstract:
Deposition of gold without the use of electric current is described. The system produces thick gold films without the use of strong reducing agents. Discontinuous land areas on high reliability printed wiring boards or ceramic circuits can be readily coated with gold to any desired thickness. Long lead glass-to-metal seals can be uniformly plated without distortion of the leads.
Gold Alloy Electroplating Bath And Process
US Patent:
4470886, Sep 11, 1984
Filed:
Jan 4, 1983
Appl. No.:
6/454503
Inventors:
Robert Duva - Paramus NJ
Daniel R. Marx - Montclair NJ
Daniel R. Marx - Montclair NJ
Assignee:
OMI International Corporation - Warren MI
International Classification:
C25D 362
US Classification:
204 43G
Abstract:
Improved electroplating ternary gold alloy plating baths wherein the gold ingredient is an alkali metal auricyanide, the gold metal being in the plus three oxidation state, and the alloying metals are both cobalt and molybdenum. The electroplating baths also contain citric acid. A wetting agent or surfactant as well as a stress reducer-brightener are also advantageously utilized in the bath. The ternary alloys may be deposited on various electronic and decorative substrates, and the deposits were characterized by unique physical and mechanical properties. Most importantly, there is a substantial improvement in wear resistance. The method of utilizing such improved electroplating baths on various substrates is also described and claimed.
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