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Robert C Kosberg, 59Volo, IL

Robert Kosberg Phones & Addresses

Grayslake, IL   

Tallahassee, FL   

Garrison, MN   

Tinley Park, IL   

Arlington Heights, IL   

Orland Park, IL   

32947 N Battershall Rd, Grayslake, IL 60030    309-6317689   

Work

Position: Sales Occupations

Education

Degree: Associate degree or higher

Mentions for Robert C Kosberg

Publications & IP owners

Us Patents

Switch Assembly For Operating A Device In Different Operational Modes

US Patent:
6737592, May 18, 2004
Filed:
Mar 14, 2003
Appl. No.:
10/389406
Inventors:
Andy Anh Hoang - Lake in the Hills IL
John Mathew - Barrington IL
Jeffrey C. Pflug - Winfield IL
Robert Kosberg - Wildwood IL
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01H 300
US Classification:
200 1B, 200 5 R, 200339
Abstract:
A switch assembly ( ) comprising of a base portion ( ), a flexible pad ( ), a paddle ( ), and at least one button ( ). The flexible pad ( ) has a first dome ( ) and a second dome ( ). The paddle ( ) is slidably attached to the base portion ( ) and has a first end portion ( ) and a second end portion ( ). The first end portion ( ) of the paddle ( ) is positioned adjacent to the first dome ( ) of the flexible pad ( ). The second end portion ( ) of the paddle ( ) is positioned adjacent to the second dome ( ) of the flexible pad ( ). The button ( ) is slidably attached to the base portion ( ) and is capable of contacting the paddle ( ). The first dome ( ) of the flexible pad ( ) is capable of collapsing when a user applies a first force (F ) to the button ( ). The second dome ( ) of the flexible pad ( ) is capable of collapsing when the user applies a second force (F ) to the button ( ), the second force (F ) being greater in value than the first force (F ). The switch assembly ( ) may further include a white light emitting diode ( ) for providing a colored light for the switch assembly ( ) through the use of the flexible pad ( ).

High Pressure Sensor

US Patent:
6928880, Aug 16, 2005
Filed:
Nov 3, 2003
Appl. No.:
10/700170
Inventors:
Philip Kang - Northbrook IL, US
Robert C. Kosberg - Wildwood IL, US
Daniel J. Bratek - Palatine IL, US
Eleanor B. Dayrit - Schaumburg IL, US
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
G01L007/00
US Classification:
73756, 73431
Abstract:
A high pressure sensor mounting configuration () includes a cylindrical pressure sensor cavity (), an internally threaded collet (), and a housing (). The cylindrical pressure sensor cavity includes a convex conical open end and a first bearing surface (). The internally threaded collet includes a second bearing surface () that bears on the first bearing surface when the internally threaded collet is threaded onto a pressure port (), causing the convex conical open end () to bear on a concave conical mating surface of the pressure port. The housing captures the collet on the pressure sensor cavity.

Jointless Pressure Sensor Port

US Patent:
8365605, Feb 5, 2013
Filed:
Feb 12, 2009
Appl. No.:
12/369747
Inventors:
Yanling Kang - Northbrook IL, US
Daniel J. Bratek - Arlington Heights IL, US
Robert Kosberg - Wildwood IL, US
Assignee:
Continental Automotive Systems, Inc. - Auburn Hills MI
International Classification:
G01L 13/02
G01L 15/00
US Classification:
73716, 73700, 73753
Abstract:
Methods and systems for measuring pressure through a jointless pressure sensor port are disclosed, including permitting a substance to pass into a jointless pressure sensor port comprising an aperture, a channel, and a diaphragm having a larger area than the area of the aperture, allowing the substance to come into contact with the diaphragm resulting in a mechanical stress on the diaphragm, and measuring the mechanical stress to generate a signal indicative of the substance pressure.

High Pressure Sensor With Knurl Press-Fit Assembly

US Patent:
2005009, May 12, 2005
Filed:
Nov 6, 2003
Appl. No.:
10/702346
Inventors:
Daniel Bratek - Palatine IL, US
Philip Kang - Northbrook IL, US
Robert Kosberg - Wildwood IL, US
James Nowicki - Chicago IL, US
International Classification:
B23P011/00
US Classification:
029505000, 029890090
Abstract:
A method of assembling a high pressure sensor with knurl press-fit includes a first step of providing a pressure port having a material with a first hardness and a housing having a material with a second hardness less than the first hardness. The pressure port has a mounting boss and the housing has a receptacle for receiving the mounting boss. A next step includes configuring the mounting boss of the pressure port with knurls thereon. A next step includes pressing the mounting boss of the pressure port into the receptacle of the housing along a direction of the axis such that the knurls deform the receptacle of the housing to conform about the knurls to define a semi-rigid mount.

Jointless Pressure Sensor Port

US Patent:
2013013, Jun 6, 2013
Filed:
Mar 20, 2012
Appl. No.:
13/424831
Inventors:
Yanling Kang - Northbrook IL, US
Daniel J. Bratek - Arlington Heights IL, US
Robert C. Kosberg - Wildwood IL, US
Assignee:
CONTINENTAL AUTOMOTIVE SYSTEMS, INC. - Auburn Hills MI
International Classification:
G01L 7/02
US Classification:
73716, 73715, 419 10, 419 5
Abstract:
A jointless pressure sensor port which includes a body portion, a flange portion integrally formed with the body portion, and a cylindrical portion integrally formed with and extending away from the flange portion. The port also includes an aperture having a first area, where the aperture is formed as part of the cylindrical portion. A channel is located along an axis and has at least one channel region. The channel at least partially extends through the cylindrical portion, the flange portion, and the body portion. A diaphragm includes a second area which is larger than the first area, the diaphragm also has a top surface and a bottom surface. A pressure sensor is disposed on the top surface, and the diaphragm is substantially perpendicular to the axis of the channel. The body portion, flange portion, and cylindrical portion form a jointless and seamless pressure sensor part.

Electrical Device Having Atmospheric Isolation

US Patent:
6053049, Apr 25, 2000
Filed:
May 30, 1997
Appl. No.:
8/865956
Inventors:
Chiu Chik Chen - Lincolnwood IL
Christopher J. Hoyle - Evanston IL
Robert C. Kosberg - Wildwood IL
Keith A. Meny - Wheeling IL
Lawrence R. Poglitsch - Mt. Prospect IL
James Nowicki - Chicago IL
Assignee:
Motorola Inc. - Schaumburg IL
International Classification:
G01L 700
US Classification:
73756
Abstract:
An electrical device (10) includes a package body (12) having a device mounting region (14) and an electrical connection region (16). A cavity (18) resides in the package body (12) intermediate to the device mounting region (14) and to the electrical connection region (16). A leadframe (20) is positioned within the package body (12) and includes a plurality of individual leads (34) traversing the cavity (18). An electronic component (24) is electrically attached to the individual leads (34) within the cavity (18). In addition to accommodating the attachment of the electronic component (24), the cavity (18) is configured to permit access to the individual leads (34) by a bonding tool (40).

Stress-Isolated Absolute Pressure Sensor

US Patent:
2017017, Jun 22, 2017
Filed:
Jul 13, 2016
Appl. No.:
15/209185
Inventors:
- Auburn Hills MI, US
Jen-Huang Albert Chiou - Libertyville IL, US
Robert C. Kosberg - Grayslake IL, US
Daniel Roy Empen - Lake Villa IL, US
International Classification:
G01L 19/14
G01L 9/00
G01L 9/06
Abstract:
Suspending a microelectromechanical system (MEMS) pressure sensing element inside a cavity using spring-like corrugations or serpentine crenellations, reduces thermally-mismatched mechanical stress on the sensing element. Overlaying the spring-like structures and the sensing element with a gel further reduces thermally-mismatched stress and vibrational dynamic stress.

3D Stacked Piezoresistive Pressure Sensor

US Patent:
2016032, Nov 3, 2016
Filed:
Mar 28, 2016
Appl. No.:
15/082336
Inventors:
- Auburn Hills MI, US
Robert C. Kosberg - Grayslake IL, US
Shiuh-Hui Steven Chen - Lake Zurich IL, US
International Classification:
G01L 9/00
Abstract:
In a microelectromechanical system (MEMS) pressure sensor, thin and fragile bond wires that are used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC) for the input and output signals between these two chips are replaced by stacking the ASIC on the MEMS pressure sensing element and connecting each other using conductive vias formed in the ASIC. Gel used to protect the bond wires, ASIC and MEMS pressure sensing element can be eliminated if bond wires are no longer used. Stacking the ASIC on the MEMS pressure sensing element and connecting them using conductive vias enables a reduction in the size and cost of a housing in which the devices are placed and protected.

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