Robert B Prater, 87539 Oxford Ct, Carson City, NV 89703

7374648, May 20, 2008

Jun 28, 2004

10/880172

Len Hom - Dublin CA, US
John D. Mize - Spokane Valley WA, US
Robert M. Prater - Los Altos CA, US
David K. Chan - San Francisco CA, US
Gilbert Amador - Dublin CA, US
Peter J. Kang - San Jose CA, US

Honeywell International Inc. - Morristown NJ

C23C 14/35
C23C 16/00

20429806, 20429811, 20429808, 2041921, 20419212, 118723 I, 118723 IR, 15634548

The invention includes a coil support assembly having an insulator interfacing a surface of a shield disposed within a processing chamber. The insulator has an extension which extends through the shield. A second insulator is disposed between the shield and a coil and contacts a protrusion extending from the coil. A fastener is disposed through the first insulator and extends through the second insulator and into the protrusion. The fastener is electrically isolated from the shield by the first insulator. The invention includes coil assemblies containing the described coil support configuration. The invention further includes a method of supporting a coil within a processing chamber having a shield disposed therein. Insulators are inserted to extend from an outer side of the shield through a thickness of the shield. A coil is mounted within the chamber by inserting fasteners through each insulator into bosses which-protrude outwardly from the coil body.

2006021, Sep 28, 2006

Mar 22, 2005

11/086022

Eal Lee - Milpitas CA, US
Nicole Truong - Milpitas CA, US
Robert Prater - Los Altos CA, US
Norm Sand - Apokane WA, US

C23C 14/00

204298010

A coil assembly for utilization in a vapor deposition system is described herein that includes at least one subject coil having a length, a height, an inside edge, an outside edge and a thickness, wherein the thickness of the subject coil is measured as the distance between the inside edge and the outside edge and wherein at least part of the thickness of the subject coil is reduced by at least 20% as compared to a reference coil. A coil assembly is also described herein for utilization in a vapor deposition system that includes at least one subject coil having a length, a height, an inside edge, an outside edge, and a thickness, wherein the thickness of the subject coil is measured as the distance between the inside edge and the outside edge and wherein at least part of the height of at least part of the subject coil is reduced by at least 20% as compared to the height of a reference coil.

2006027, Dec 14, 2006

Jun 13, 2005

11/150900

Eal Lee - Milpitas CA, US
Robert Prater - Los Altos CA, US
Nicole Truong - Milpitas CA, US
Jaeyeon Kim - Liberty Lake WA, US

C23C 14/32
C23C 14/00

204192100, 204298160

A DC magnetron sputtering system is described that comprises an anodic shield; a cathodic target that comprises at least one sidewall; a plasma ignition arc; and a catch-ring coupled to and located around the shield. Another DC magnetron sputtering system is described that comprises an anodic shield; a cathodic target comprising at least one recess, cavity or a combination thereof and at least one protrusion; and a plasma ignition arc, whereby the arc is located at the point of least resistance between the anodic shield and the at least one recess, cavity or a combination thereof, the at least one protrusion or a combination thereof. Yet another DC magnetron sputtering system is described herein that comprises an anodic shield comprising at least one protrusion; a cathodic target comprising at least one recess, cavity or a combination thereof; and a plasma ignition arc, whereby the arc is located at the point of least resistance between the at least one protrusion coupled to the anodic shield and the at least one protrusion, recess or cavity. Methods are also provided whereby the gas turbulence effect is mitigated, such methods including providing an anodic shield; providing a cathodic target comprising at least one recess, cavity or a combination thereof and at least one protrusion; and initiating a plasma ignition arc, whereby the arc is located at the point of least resistance between the anodic shield and the at least one recess, cavity or a combination thereof, the at least one protrusion or a combination thereof. Additional methods include providing an anodic shield; providing a cathodic target that comprises at least one sidewall; providing a catch-ring coupled to and around the shield; and initiating a plasma ignition arc.

2008027, Nov 6, 2008

Apr 21, 2005

11/911954

Eal H. Lee - Millpitas CA, US
Nicola Truong - Milipes CA, US
Robert Prater - Los Altos CA, US
Morales Diana - Veradala WA, US

B32B 15/00
C22C 5/04
B32B 9/00
C23C 14/34

428639, 420462, 20429813, 428660, 428662, 428663, 428665

An alloy for use in vapor deposition or atomic layer deposition is described herein that includes ruthenium and at least one element from group IV, V or VI of the Periodic Chart of the Elements or a combination thereof. In addition, a layered material is described herein that comprises at least one layer that includes a ruthenium-based material or ruthenium-based alloy and at least one layer that includes at least one element from group IV, V or VI of the Periodic Chart of the Elements or a combination thereof.