Robert R Underwood DeceasedOklahoma City, OK

8111001, Feb 7, 2012

Jul 17, 2007

11/879665

Robert Underwood - Santa Barbara CA, US
Yifeng Wu - Goleta CA, US

Cree, Inc. - Goleta CA

G05F 1/00

315291, 315294, 315247, 315312, 362227, 362800, 257 84

An LED package containing integrated circuitry for matching a power source voltage to the LED operating voltage, LEDs containing such integrated circuitry, systems containing such packages, and methods for matching the source and operating voltages are described. The integrated circuitry typically contains a power converter and a constant current circuit. The LED package may also contain other active or passive components such as pin-outs for integrated or external components, a transformer and rectifier, or a rectifier circuit. External components can include control systems for regulating the LED current level or the properties of light emitted by the LED. Integrating the power supply and current control components into the LED can provide for fabrication of relatively small LEDs using fewer and less device-specific components.

8232739, Jul 31, 2012

Jan 10, 2012

13/347228

Robert Underwood - Santa Barbara CA, US
Yifeng Wu - Goleta CA, US

Cree, Inc. - Goleta CA

G05F 1/00

315291, 315294, 315247, 315312, 362227, 362800, 257 84

An LED package containing integrated circuitry for matching a power source voltage to the LED operating voltage, LEDs containing such integrated circuitry, systems containing such packages, and methods for matching the source and operating voltages are described. The integrated circuitry typically contains a power converter and a constant current circuit. The LED package may also contain other active or passive components such as pin-outs for integrated or external components, a transformer and rectifier, or a rectifier circuit. External components can include control systems for regulating the LED current level or the properties of light emitted by the LED. Integrating the power supply and current control components into the LED can provide for fabrication of relatively small LEDs using fewer and less device-specific components.

8563339, Oct 22, 2013

Jun 21, 2006

11/473089

Eric J. Tarsa - Goleta CA, US
Michael Leung - Ventura CA, US
Bernd Keller - Santa Barbara CA, US
Robert Underwood - Santa Barbara CA, US
Mark Youmans - Santa Barbara CA, US

Cree, Inc. - Goleta CA

H01L 21/00
H01L 21/326
H01L 21/479
H01L 21/20
H01L 21/36
H01L 21/31
H01L 21/469

438 29, 438 33, 438 34, 438 35, 438465, 438466, 438478, 438765

One close loop system and method for electrophoretic deposition (EPD) of phosphor material on light emitting diodes (LEDs). The system comprises a deposition chamber sealed from ambient air. A mixture of phosphor material and solution is provided to the chamber with the mixture also being sealed from ambient air. A carrier holds a batch of LEDs in the chamber with the mixture contacting the areas of the LEDs for phosphor deposition. A voltage supply applies a voltage to the LEDs and the mixture to cause the phosphor material to deposit on the LEDs at the mixture contacting areas.

8569970, Oct 29, 2013

Jun 25, 2012

13/532451

Robert Underwood - Santa Barbara CA, US
Yifeng Wu - Goleta CA, US

Cree, Inc. - Goleta CA

G05F 1/00

315291, 315294, 315219, 315247, 315312, 362240, 362227, 362800

An LED package containing integrated circuitry for matching a power source voltage to the LED operating voltage, LEDs containing such integrated circuitry, systems containing such packages, and methods for matching the source and operating voltages are described. The integrated circuitry typically contains a power converter and a constant current circuit. The LED package may also contain other active or passive components such as pin-outs for integrated or external components, a transformer and rectifier, or a rectifier circuit. External components can include control systems for regulating the LED current level or the properties of light emitted by the LED. Integrating the power supply and current control components into the LED can provide for fabrication of relatively small LEDs using fewer and less device-specific components.

2014005, Feb 27, 2014

Aug 21, 2012

13/590982

Bernd P. Keller - Santa Barbara CA, US
Robert D. Underwood - Santa Barbara CA, US

H05B 37/02
F21V 5/04
F21V 9/00
F21V 21/00

315 85, 36224902, 362244, 362231, 315185 R

An integrated circuit component can include an integrated circuit package and a plurality of terminals provided on the exterior of the integrated circuit package. The terminals are configured to provide electrical connectivity to an interior of the integrated circuit package and a plurality of light emitting diode (LED) segments that includes an LED string in the interior of the package, coupled to the plurality of terminals.

5697581, Dec 16, 1997

Aug 31, 1995

8/521674

John L. Conroy - Ontario CA
Anthony R. Walton - Ontario CA
Robert B. Underwood - Ontario CA
Harold W. Fowler - Diamond Bar CA
Gerald E. Koppe - Cucamonga CA

Lockheed Martin Corporation - Bethesda MD

B64D 112

2441373

A system and method for aerial cargo delivery is disclosed that uses a linkless towplate having an eccentric cam and a pin. The cargo flexible tension member is isolated from the force of a deployed drogue parachute by a frictional holding force generated by the eccentric cam and the pin. A system and method for aerial cargo delivery is also disclosed that uses a towplate with a link assembly. The towplate has two cylinders that hold the cargo flexible tension member and the drogue parachute flexible tension member.

5816535, Oct 6, 1998

Apr 10, 1996

8/631193

Robert B. Underwood - Ontario CA
Anthony R. Walton - Ontario CA
Harold W. Fowler - Diamond Bar CA
Dwayne R. Wedlaw - Winnetka CA

Lockheed Martin Corporation - Palmdale CA

B64D 112
B64D 1764

2441373

The invention is a control system for the emergency jettison of a cargo container extraction parachute from a cargo container within an aircraft, the aircraft having a plurality of cargo containers onboard that are ejectable in sequence. In detail, the system includes a load transfer coupling coupled to each extraction parachute for releasing the extraction chute from the cargo container upon receipt of electrical power. A first circuit is coupled to the load transfer coupling, the first circuit for providing the electrical power to the load transfer coupling of the next ejectable cargo container upon receiving an actuation signal to release the extraction parachute. A second circuit is used to sense when each of the plurality of cargo containers has been ejected from the aircraft and to provide the cargo container ejection signal to the first circuit upon the cargo container being ejected from the aircraft. The actuation signal is provided to the first circuit if the ejection signal is not received within a specific time after initiation of the cargo ejection sequence. A third circuit is used to manually provide the actuation signal to the first circuit providing immediate jettison of the extraction parachute.

2018022, Aug 9, 2018

Feb 2, 2018

15/887096

- Durham NC, US
Yuvaraj Dora - Goleta CA, US
Ronald W. Bessems - Santa Barbara CA, US
John Roberts - Durham NC, US
Robert D. Underwood - Santa Barbara CA, US

G06T 7/246

A method includes the steps of obtaining a frame from an image sensor, the frame comprising a number of pixel values, detecting a change in a first subset of the pixel values, detecting a change in the second subset of the pixel values near the first subset of the pixel values, and determining an occupancy state based on a relationship between the change in the first subset of the pixel values and the second subset of the pixel values. The occupancy state may be determined to be occupied when the change in the first subset of the pixel values is in a first direction and the change in the second subset of the pixel values is in a second direction opposite the first direction.