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Ruben A Pesina, 582733 Evergreen Ave, Chicago, IL 60622

Ruben Pesina Phones & Addresses

2733 Evergreen Ave, Chicago, IL 60622    773-8626882   

2733 W Evergreen Ave APT 1, Chicago, IL 60622    773-8862226   

Dallas, TX   

Wood Dale, IL   

2733 W Evergreen Ave, Chicago, IL 60622    773-3497057   

Work

Position: Precision Production Occupations

Education

Degree: Associate degree or higher

Emails

Mentions for Ruben A Pesina

Ruben Pesina resumes & CV records

Resumes

Ruben Pesina Photo 17

Project Manager, Materials Management At Tnb Card Services, A Fifth Third Processing Solutions Company

Location:
Dallas/Fort Worth Area
Industry:
Banking
Ruben Pesina Photo 18

Quality Assurance

Location:
Dallas, TX
Industry:
Semiconductors
Work:
Texas Instruments
Quality Assurance
Texas Instruments Mar 2004 - May 2010
Process Engineer
Novellus Systems 1995 - 2004
Process Engineer
Education:
Texas A&M University 1990 - 1995
Skills:
Semiconductors, Semiconductor Industry, Quality Assurance, Thin Films, Spc, Materials, Failure Analysis, Cvd, Silicon, Design of Experiments, Pvd, Ic
Ruben Pesina Photo 19

Floor Technician

Location:
Dallas, TX
Work:

Floor Technician
Ruben Pesina Photo 20

Ruben Pesina

Publications & IP owners

Us Patents

Thin Edge Carrier Ring

US Patent:
2011029, Dec 8, 2011
Filed:
Jun 6, 2011
Appl. No.:
13/153939
Inventors:
Jian SONG - Plano TX, US
Ruben Anthony PESINA - Murphy TX, US
Kamal AVALA - Plano TX, US
Assignee:
TEXAS INSTRUMENTS INCORPORATED - Dallas TX
International Classification:
C23C 16/50
US Classification:
118723 R
Abstract:
A PECVD deposition chamber with a circular pedestal with a recessed portion in the outer top surface of the pedestal. A PECVD deposition chamber with a circular wafer carrier ring with a recessed portion in the outer top surface of the wafer carrier ring.

Method For Processing A Semiconductor Wafer Using A Thin Edge Carrier Ring

US Patent:
2016012, May 5, 2016
Filed:
Jan 8, 2016
Appl. No.:
14/990999
Inventors:
- Dallas TX, US
Ruben Anthony Pesina - Murphy TX, US
Kamal Avala - Plano TX, US
International Classification:
H01L 21/02
B08B 9/08
B08B 7/00
H01L 21/677
Abstract:
A method for processing a semiconductor wafer in a PECVD deposition chamber with a circular pedestal and a recessed portion formed around the outer top surface of the pedestal. The method may include using a circular wafer carrier ring with a recessed portion.

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