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Ryan J Linderman, 524342 Park Blvd, Oakland, CA 94602

Ryan Linderman Phones & Addresses

4342 Park Blvd, Oakland, CA 94602   

Pasadena, CA   

Centennial, CO   

1039 Maxwell Ave, Boulder, CO 80304   

770 Hartford Dr, Boulder, CO 80305    303-5540641   

780 Hartford Dr, Boulder, CO 80303   

Thornton, CO   

3300 E Orchard Rd, Centennial, CO 80121   

Work

Position: Sales Occupations

Education

Degree: Bachelor's degree or higher

Mentions for Ryan J Linderman

Ryan Linderman resumes & CV records

Resumes

Ryan Linderman Photo 31

Principal Engineer, Enphase Energy

Position:
Principal Engineer, CTO Group at Enphase Energy
Location:
San Francisco Bay Area
Industry:
Research
Work:
Enphase Energy - SF Bay Area since Jul 2013
Principal Engineer, CTO Group
SunPower Corporation - SF Bay area Mar 2009 - Jun 2013
Senior Staff Engineer, Advanced Product Development
Energy Innovations Mar 2008 - Mar 2009
Director of Photovoltaic Receiver R&D
IBM Mar 2004 - Mar 2008
Research Staff Member
ETH-Zürich, Switzerland Sep 2002 - Mar 2004
Post Doc
Drop Kick Design Sep 1995 - Aug 2002
Founder / Lead Designer
CU-Boulder, Microelectronics Packaging Center May 1998 - May 2002
Research Assistant
SynchroStatics Corporation Jun 1999 - Mar 2002
Founder
Education:
University of Colorado Boulder 1994 - 2002
Ph.D., Mechanical Engineering, Micro- and Nanotechnology
Interests:
DIY microelectronics, Electric Imp, Arduino, Raspberry Pi
Honor & Awards:
IEEE Semi-Therm 2007 Conference, Best Paper Award
Languages:
German
Certifications:
Single engine land private pilot rating, Federal Aviation Administration, FAA
General Class Amateur Radio License, Federal Communications Commission, FCC
Ryan Linderman Photo 32

Ryan Linderman

Location:
United States

Publications & IP owners

Us Patents

Cooling System For An Electronic Component System Cabinet

US Patent:
7872867, Jan 18, 2011
Filed:
Sep 2, 2008
Appl. No.:
12/202619
Inventors:
Thomas Brunschwiler - Thalwil, CH
Ryan J. Linderman - Pasadena CA, US
Hugo E. Rothuizen - Adliswil, CH
Reto Waelchli - Zuerich, CH
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 7/20
US Classification:
361699, 361724, 174 151, 165 804, 165 805, 16510433, 257714
Abstract:
An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.

Opposing Row Linear Concentrator Architecture

US Patent:
8336539, Dec 25, 2012
Filed:
Aug 3, 2010
Appl. No.:
12/849606
Inventors:
Ryan Linderman - Oakland CA, US
Zachary S. Judkins - Berkeley CA, US
Brian Wares - San Francisco CA, US
Charles Almy - Berkeley CA, US
Assignee:
Sunpower Corporation - San Jose CA
International Classification:
F24J 2/10
G02B 5/10
US Classification:
126696, 359853
Abstract:
A solar concentrator assembly is disclosed. The solar concentrator assembly comprises a first reflective device having a first reflective front side and a first rear side, a second reflective device having a second reflective front side and a second rear side, the second reflective device positioned such that the first reflective front side faces the second rear side, and a support assembly coupled to and supporting the first and second reflective devices, the second reflective device positioned to be vertically offset from the first reflective device.

Integrated Circuit Stack

US Patent:
8363402, Jan 29, 2013
Filed:
Sep 17, 2008
Appl. No.:
12/678298
Inventors:
Thomas J. Brunschwiler - Thalwil, CH
Ryan J. Linderman - Pasadena CA, US
Bruno Michel - Zurich, CH
Hugo E. Rothuizen - Adliswil, CH
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 7/20
US Classification:
361699, 361698, 361718, 361719, 257714, 165 804
Abstract:
The invention relates to an integrated circuit stack () comprising a plurality of integrated circuit layers () and at least one cooling layer () arranged in a space between two circuit layers (). The integrated circuit stack () is cooled using a cooling fluid () pumped through the cooling layer (). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack ().

Interconnect For An Optoelectronic Device

US Patent:
8426974, Apr 23, 2013
Filed:
Sep 29, 2010
Appl. No.:
12/893765
Inventors:
Ryan Linderman - Oakland CA, US
Keith Johnston - Palo Alto CA, US
Thomas Phu - Alameda CA, US
Matthew Dawson - Menlo Park CA, US
Assignee:
SunPower Corporation - San Jose CA
International Classification:
H01L 23/52
US Classification:
257773, 257E23141
Abstract:
Interconnects for optoelectronic devices are described. An interconnect may include a stress relief feature. An interconnect may include an L-shaped feature.

Heat-Regulating Glass Bending Apparatus And Method

US Patent:
8528366, Sep 10, 2013
Filed:
Dec 22, 2011
Appl. No.:
13/335679
Inventors:
Amine Berrada Sounni - Berkeley CA, US
Ryan J. Linderman - Oakland CA, US
Assignee:
SunPower Corporation - San Jose CA
International Classification:
C03B 23/025
US Classification:
65288, 65287
Abstract:
A sag-bending system is disclosed. The sag-bending system comprises a sag-bending glass support mold and a perimeter thermal manager. The support mold comprises a plurality of rib members extending in a first direction, each of the plurality of rib members having a curved upper surface shaped to form the collective upper surface having a position and shape to support a quadrilateral-shaped sag-bent glass sheet into a desired contour, each of the rib members further having a lower surface, and a plurality of support members extending in a second direction between at least two of the plurality of rib members, the second direction traverse to the first direction. The perimeter thermal manager is sized and positioned to surround, to extend at least partially over, and to extend at least partially under the periphery of the support mold.

Optoelectronic Device With Heat Spreader Unit

US Patent:
8530990, Sep 10, 2013
Filed:
Oct 12, 2009
Appl. No.:
12/577616
Inventors:
Ryan Linderman - Oakland CA, US
Matthew Dawson - Menlo Park CA, US
Itai Suez - Hercules CA, US
Assignee:
SunPower Corporation - San Jose CA
International Classification:
H01L 27/146
US Classification:
257433, 257448, 257712, 257713
Abstract:
Optoelectronic devices with heat spreader units are described. An optoelectronic device includes a back-contact optoelectronic cell including a plurality of back-contact metallization regions. One or more heat spreader units are disposed above the plurality of back-contact metallization regions. A heat sink is disposed above the one or more heat spreader units.

Diode And Heat Spreader For Solar Module

US Patent:
8563849, Oct 22, 2013
Filed:
Oct 18, 2010
Appl. No.:
12/906688
Inventors:
Keith Johnston - Palo Alto CA, US
Ryan Linderman - Oakland CA, US
Lewis Abra - San Francisco CA, US
Matthew Dawson - Menlo Park CA, US
Assignee:
SunPower Corporation - San Jose CA
International Classification:
H01L 31/052
US Classification:
136246, 136243, 136256, 257E31001
Abstract:
Arrangements of diodes and heat spreaders for solar modules are described. For example, a solar module may include a backsheet with a low profile, surface-mount diode disposed above the backsheet. A pair of ribbon interconnects is coupled to the low profile, surface-mount diode and may penetrate the backsheet.

Thermal Tracking For Solar Systems

US Patent:
8604404, Dec 10, 2013
Filed:
Jul 1, 2010
Appl. No.:
12/829263
Inventors:
Ryan J. Linderman - Oakland CA, US
Assignee:
SunPower Corporation - San Jose CA
International Classification:
G01C 21/02
H01L 31/042
US Classification:
2502034, 136246
Abstract:
A power generating system is disclosed. The power generating system comprises a solar cell, a support structure coupled to the solar cell and adapted to adjust the position of the solar cell, a first thermal sensor coupled to the solar cell and adapted to detect a first temperature at a first location on the solar cell, a second thermal sensor coupled to the solar cell and adapted to detect a second temperature at a second location on the solar cell, the second location spaced apart from the first location, and a control system. The control system is adapted to receive a first signal from the first thermal sensor and a second signal from the second thermal sensor, compare information conveyed in the first and second signals, and adjust the position of the solar cell by operating the support structure in response to information conveyed in the first and second signals.

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