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Ryan J Schuh, 39852 Bridle Creek Ln, Jordan, MN 55352

Known as:
Ryan Chuh
Related to:
Edward Anthony Kusmider 70

Ryan Schuh Phones & Addresses

852 Bridle Creek Ln, Jordan, MN 55352    734-6571120   

Saint Peter, MN   

Cascade, WI   

Ypsilanti, MI   

Ann Arbor, MI   

Dekalb, IL   

Oshkosh, WI   

Work

Company: Macdermid - New Hudson, MI Mar 2012 Position: Research chemist

Education

School / High School: Northern Illinois University- DeKalb, IL 2009 Specialities: MSeD in Ex Phys

Skills

Protein Chemistry • Statistics • Laboratory Research • Mathematics • Biochemistry • Inductively Coupled Plasma (ICP) • Computer Literate • HPLC • Gas Chromatography • Internet Research • Western Blotting • Microarray Analysis • Protein Assays • IR spectroscopy • Northern Blotting • Imaging • PCR • Western Blotting • HPLC • GC • SOP • Ion Chromatography (IC) and Imaging
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Mentions for Ryan J Schuh

Resumes & CV records

Resumes

Ryan Schuh Photo 25

Photographer

Industry:
Photography
Work:
Photography | Film
Photographer
Ryan Schuh Photo 26

Ryan Schuh

Ryan Schuh Photo 27

Ryan Nicole Schuh

Ryan Schuh Photo 28

Ryan Schuh - Ann Arbor, MI

Work:
MacDermid - New Hudson, MI Mar 2012 to Dec 2013
Research Chemist VVF Ltd./Dial Soap - Aurora, IL Jan 2010 to Jun 2011
Chemist Science Outreach UWO - Oshkosh, WI Aug 2007 to Aug 2009
Teachers Assistant
Education:
Northern Illinois University - DeKalb, IL 2009 to 2013
MSeD in Ex Phys University of Wisconsin-Oshkosh - Oshkosh, WI 2003 to 2009
B.S. in Exercise Science; minored in Chemistry
Skills:
Protein Chemistry, Statistics, Laboratory Research, Mathematics, Biochemistry,Inductively Coupled Plasma (ICP), Computer Literate, HPLC, Gas Chromatography, Internet Research, Western Blotting, Microarray Analysis, Protein Assays, IR spectroscopy, Northern Blotting, Imaging, PCR, Western Blotting, HPLC, GC, SOP, Ion Chromatography (IC) and Imaging

Publications & IP owners

Us Patents

Aqueous Electroless Nickel Plating Bath And Method Of Using The Same

US Patent:
2015034, Dec 3, 2015
Filed:
Jun 2, 2014
Appl. No.:
14/293216
Inventors:
- Waterbury CT, US
NICOLE J. MICYUS - South Lyon MI, US
RYAN SCHUH - Saint Peter MN, US
Assignee:
MacDermid Acumen, Inc. - Waterbury CT
International Classification:
C23C 18/36
C23C 18/16
Abstract:
An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.

Possible Relatives

David L Schuh  Daniel Schuh  Aaron C Schuh  Denise M Schuh  Danielle N Schuh  Dennis P Schuh  Diane Schuh  Ryan A Johnson  Ryan Stamps  Ryan F Stander 

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