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Sachin Deshmukh5170 Shaw Butte Dr, Glendale, AZ 85304

Sachin Deshmukh Phones & Addresses

5170 Shaw Butte Dr, Glendale, AZ 85304    623-3744546   

15050 59Th Ave, Glendale, AZ 85306    602-2965599    602-5887217   

Altamonte Springs, FL   

355 Sunstone Ct, Orange Park, FL 32065    904-2917071   

12974 Mallory Cir, Orlando, FL 32828    407-2072101   

14595 Quail Trail Cir, Orlando, FL 32837    407-8161761   

Hahnville, LA   

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Sachin Deshmukh resumes & CV records

Resumes

Sachin Deshmukh Photo 34

Project Lead At Igate Computer Systems Ltd.

Position:
Project Lead / Project Manager at iGATE Computer systems Ltd.
Location:
Pune, Maharashtra, India
Industry:
Information Technology and Services
Work:
iGATE Computer systems Ltd. - Boulder, CO, US since May 2006
Project Lead / Project Manager Covidien Inc - Boulder colorado 2011 - 2013
Software Engineer Haemonetics Corporation Inc 2009 - 2010
Software Lead EMBIN tech, India Jun 2004 - Mar 2006
Team Leader Seto Technolog Pvt Ltd Jun 2003 - Apr 2004
Team Leader EMCO (P) Ltd Aug 2002 - May 2003
Design Engineer ATCO R &D Ltd Dec 2000 - Jul 2002
Design Engineer
Education:
Shivaji University 1997 - 2000
Batchlor of Engineering, Instrumentation Engineering Govt. Polytechnic, Mumbai 1994 - 1997
Diploma, Instrumentation Engineering
Skills:
Embedded Systems, C, Embedded Software, C++, Software Development, Testing, SDLC, Linux, RTOS, CMMI, Embedded C, Requirements Analysis, Agile Methodologies, Software Project Management, SPI, Device Drivers
Sachin Deshmukh Photo 35

Sachin Deshmukh

Sachin Deshmukh Photo 36

Sachin Deshmukh

Sachin Deshmukh Photo 37

Senior Project Manager At Aurionpro Sena

Position:
Senior Project Manager at aurionPro SENA
Location:
Pune, Maharashtra, India
Industry:
Information Technology and Services
Work:
aurionPro SENA - Pune since Dec 2009
Senior Project Manager
Skills:
SOA, Java Enterprise Edition, Web Applications, Software Design, Software Project Management, Project Management, Service Delivery Management
Sachin Deshmukh Photo 38

Sachin Deshmukh

Location:
United States
Sachin Deshmukh Photo 39

Sachin Deshmukh

Sachin Deshmukh Photo 40

Sachin Deshmukh

Publications & IP owners

Us Patents

Standoff Spacers For Managing Bondline Thickness In Microelectronic Packages

US Patent:
2018035, Dec 6, 2018
Filed:
May 31, 2017
Appl. No.:
15/610327
Inventors:
- Santa Clara CA, US
Hemanth K. Dhavaleswarapu - Chandler AZ, US
John J. Beatty - Chandler AZ, US
Sachin Deshmukh - Chandler AZ, US
Assignee:
INTEL CORPORATION - Santa Clara CA
International Classification:
H01L 23/36
H01L 23/498
H01L 21/48
Abstract:
A microelectronic package may be fabricated to include a microelectronic substrate, a plurality of microelectronic devices attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one of the plurality of microelectronic devices and attached to the microelectronic substrate, and at least one offset spacer attached between the microelectronic substrate and the heat dissipation device to control the bondline thickness between the heat dissipation device and at least one of the plurality of microelectronic devices.

Possible Relatives

Deepali A Deshmukh  Dhananjay B Deshmukh  Abhijit S Deshmukh  Ganesh Deshmukh  Ajay A Deshmukh  Madhavi K Deshmukh  Madhuvanti Deshmukh  Sachin S Singh  Sachin R Patel  Sachin Prasad 

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