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Saul Ferguson, 609260 Canterbury Ln, Mentor, OH 44060

Saul Ferguson Phones & Addresses

Mentor, OH   

Albuquerque, NM   

1733 Euclid Rd, Durham, NC 27713    919-5446883   

Tarrytown, NY   

Tucson, AZ   

61 Loh Ave, Tarrytown, NY 10591   

Work

Company: Sba materials - Albuquerque, NM May 2007 Position: Materials development and test engineer/ ferro-electrician

Education

School / High School: Manhattan College May 1997 Specialities: B.S. in Chemical Engineering

Mentions for Saul Ferguson

Saul Ferguson resumes & CV records

Resumes

Saul Ferguson Photo 7

Saul Ferguson - Mentor, OH

Work:
SBA Materials - Albuquerque, NM May 2007 to Dec 2010
Materials Development and Test Engineer/ Ferro-electrician
DuPont Electronic Technologies - Research Triangle Park, NC Jun 1997 to Dec 2006
Senior R&D Technician
Education:
Manhattan College May 1997
B.S. in Chemical Engineering
Purchase May 1993
B.S. in Chemistry/Environmental Science, SUNY
University of the State of New York - New York, NY Sep 1988
A.S. in Electronics

Publications & IP owners

Us Patents

Method Of Making Interlayer Panels

US Patent:
7178229, Feb 20, 2007
Filed:
Nov 20, 2003
Appl. No.:
10/718044
Inventors:
William J. Borland - Chapel Hill NC, US
Saul Ferguson - Albuquerque NM, US
Diptarka Majumdar - Cary NC, US
Matthew C. Snogren - Littleton CO, US
Richard H. Snogren - Ontario, CA
Assignee:
E. I. du Pont de Nemours and Company - Wilmington DE
International Classification:
H05K 3/30
US Classification:
29831, 29825, 29832, 29833, 29841, 29847, 174260, 361763
Abstract:
Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the fiducials.

Innerlayer Panels And Printed Wiring Boards With Embedded Fiducials

US Patent:
7586198, Sep 8, 2009
Filed:
Dec 29, 2005
Appl. No.:
11/321934
Inventors:
William J. Borland - Chapel Hill NC, US
Saul Ferguson - Albuquerque NM, US
Diptarka Majumdar - Cary NC, US
Matthew C. Snogren - Littleton CO, US
Richard H. Snogren - Toronto, CA
Assignee:
E. I. du Pont de Nemours and Company - Wilmington DE
International Classification:
H01L 23/48
H01L 23/52
H01L 29/40
US Classification:
257767, 174260, 174261
Abstract:
Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the fiducials.

Methods For Forming Process Test Capacitors For Testing Embedded Passives During Embedment Into A Printed Wiring Board

US Patent:
7649361, Jan 19, 2010
Filed:
Dec 18, 2006
Appl. No.:
11/612089
Inventors:
William Borland - Chapel Hill NC, US
Saul Ferguson - Albuquerque NM, US
Diptarka Majumdar - Cary NC, US
Daniel I. Amey - Durham NC, US
Assignee:
E.I. du Pont de Nemours and Company - Wilmington DE
International Classification:
G01R 31/18
US Classification:
324548, 324658, 29832, 29 2503
Abstract:
Making process test capacitors simultaneously with circuit capacitors that are to be embedded into a printed wiring board and firing the test capacitors to result in fired-on-foil test capacitors for the purpose of using the test capacitors as test substitutes for the embedded circuit capacitors to predict whether capacitance, dissipation factor or insulation resistance of the circuit capacitors will fall within acceptable specified ranges prior to and after embedment.

Power Core Devices

US Patent:
7701052, Apr 20, 2010
Filed:
Aug 31, 2006
Appl. No.:
11/514094
Inventors:
William J. Borland - Cary NC, US
Saul Ferguson - Durham NC, US
Assignee:
E. I. du Pont de Nemours and Company - Wilmington DE
International Classification:
H01L 23/538
H01L 23/12
H01L 23/053
US Classification:
257700, 257691, 257781, 257E23175
Abstract:
A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is positioned on the outer layer of the power core with both first and second electrodes of the capacitor on the outer layer of the power core so that at least one Vcc (power) terminal and at least one Vss (ground) terminal of a semiconductor device can be directly connected to at least one first and at least one second electrode, respectively.

Electrodes, Inner Layers, Capacitors, Electronic Devices And Methods Of Making Thereof

US Patent:
7741189, Jun 22, 2010
Filed:
Jun 15, 2006
Appl. No.:
11/453496
Inventors:
William J. Borland - Cary NC, US
Saul Ferguson - Durham NC, US
Diptarka Majumdar - Cary NC, US
Richard Ray Traylor - Angier NC, US
Assignee:
E.I. du Pont de Nemours and Company - Wilmington DE
International Classification:
H01L 21/20
US Classification:
438396, 257532
Abstract:
A method of embedding thick-film fired-on-foil capacitors includes entirely covering the dielectric with an encapsulating electrode to avoid cracking in the dielectric due to shrinkage and temperature coefficient of expansion differences between the electrode and dielectric.

Printed Wiring Boards Having Low Inductance Embedded Capacitors And Methods Of Making Same

US Patent:
2004010, Jun 10, 2004
Filed:
Sep 16, 2003
Appl. No.:
10/663551
Inventors:
William Borland - Cary NC, US
Saul Ferguson - Durham NC, US
David McGregor - Cary NC, US
International Classification:
H05K001/16
US Classification:
174/260000, 174/255000, 361/793000
Abstract:
A printed wiring board (PWB) has stacked innerlayer panels comprised of passive circuit elements. The passive elements can include capacitors with electrode terminations located within the footprints of the capacitor electrodes. The capacitor terminations are therefore closely spaced, reducing the capacitors' contributions to loop inductance in the innerlayer. Capacitor terminations within the electrode footprints also reduce the PWB board surface area used in forming the capacitors.

Printed Wiring Boards Having Capacitors And Methods Of Making Thereof

US Patent:
2004023, Nov 25, 2004
Filed:
Feb 4, 2004
Appl. No.:
10/725888
Inventors:
William Borland - Cary NC, US
Saul Ferguson - Durham NC, US
David McGregor - Cary NC, US
International Classification:
H05K001/16
H05K003/30
US Classification:
174/260000, 174/262000, 029/846000, 029/025420
Abstract:
In a printed wiring board, a plurality of stacked innerlayer panels have capacitors connected in parallel by connecting a first electrode of a first panel with a first electrode of a second panel, and similarly connecting second electrodes of the first and second panels. The innerlayer panel having capacitors connected in parallel provides a high capacitance in a small x-y area. An alternate printed wiring board has a capacitor having a first foil electrode, and second and third electrodes located on opposite sides of the first foil electrode. Yet another printed wiring board has capacitors formed as an array of discrete foil electrodes spaced from an array of discrete printed electrodes. Forming discrete interconnected electrodes allows the electrodes to be fired without excessive thermal coefficient of expansion stresses damaging the electrodes.

Thick Film Capacitors, Embedding Thick-Film Capacitors Inside Printed Circuit Boards, And Methods Of Forming Such Capacitors And Printed Circuit Boards

US Patent:
2006000, Jan 5, 2006
Filed:
Jul 1, 2004
Appl. No.:
10/882820
Inventors:
William Borland - Cary NC, US
Saul Ferguson - Durham NC, US
Hena Pyada - Dorado PR, US
International Classification:
H05K 1/18
H01G 7/00
US Classification:
361763000, 174260000, 029025410
Abstract:
A method of embedding thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from coming in contact with and damaging the capacitor layers.

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