Scott A Garner, 412972 Rainbow Rd, Dover, PA 17315

6437437, Aug 20, 2002

Jan 3, 2001

09/753893

Jon Zuo - Lancaster PA
Scott D. Garner - Lititz PA

Thermal Corp. - Stanton DE

H01L 2310

257710, 257704

A semiconductor package is provided that includes a substrate having a top surface, a cover, and at least one semiconductor device attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate such that the semiconductor device resides within the space. The cover has an interior surface comprising a plurality of micro-channels. A wick is positioned in confronting relation to the plurality of micro-channels and the semiconductor device, with a two-phase vaporizable liquid disposed within the space.

6615912, Sep 9, 2003

Jun 20, 2001

09/885472

Scott D. Garner - Lititz PA

Thermal Corp. - Stanton DE

F28D 1500

16510426, 16510433, 165274

The present invention provides a loop thermosiphon including an evaporator and a condenser interconnected in flow communication by a vapor conduit and a condensate conduit. A wick is disposed in a portion of the evaporator and a portion of the at least one condensate conduit adjacent to the evaporator to facilitate capillary action to cycle a coolant fluid through the loop thermosiphon. Advantageously, a porous valve is lodged within the condensate conduit so that a first pressure on a condenser side of the porous valve is greater than a second pressure on an evaporator side of the porous valve. In this way, a portion of the liquid coolant fluid disposed within the loop thermosiphon is forced through the porous valve and a remaining portion is forced through the at least one condenser. In one embodiment, the porous valve comprises a plug of sintered material that is lodged within the condensate conduit so as to provide a seepage of coolant fluid during periods of low thermal energy transfer to the evaporator so as to avoid drying out of the system.

6657121, Dec 2, 2003

Jun 26, 2002

10/180166

Scott D. Garner - Lititz PA

Thermal Corp. - Stanton DE

H05K 720

174 163, 361700, 62119

A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e. g. , a second loop thermosyphon, convection fin, or cold plate.

6675887, Jan 13, 2004

Mar 26, 2002

10/106277

Scott D. Garner - Lititz PA
G. Yale Eastman - Lancaster PA

Thermal Corp. - Stanton DE

F28F 2700

165274, 16510414, 16510427

A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.

6717813, Apr 6, 2004

Apr 14, 2003

10/413601

Scott Garner - Lititz PA

Thermal Corp. - Stanton DE

H05K 720

361700

A heat sink for integrated circuits is limited substantially to heat transfer fins on one or more heat pipe tubes, the tube(s) functioning as a base for the heat sink. The heat pipe tube has a flattened oval cross section and can snap-fit in openings through the fins. The tube is exposed on one side of the heat sink for contact with the heat generating circuit. The fins can be flat or irregular and can have a collar engaging the heat pipe tube. In one example, the heat pipe tube runs perpendicular to vertical fins along the bottom of a standing fin stack. In another embodiment two U-shaped heat pipe tubes carry a layered stack, the bottom of the U-shapes being presented under the lowermost in the stack. A clamp urges the heat sink against the heat source.

6938680, Sep 6, 2005

Jul 14, 2003

10/618965

Scott D. Garner - Lititz PA, US
James E. Lindemuth - Lititz PA, US
Jerome E. Toth - Hatboro PA, US
John H. Rosenfeld - Lancaster PA, US
Kenneth G. Minnerly - Lititz PA, US

Thermal Corp. - Stanton DE

F28D015/00

16510426, 16510433, 165 804, 361700, 257715

A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular enclosure is sealed at one end by a base having a grooved sintered wick disposed on at least a portion of its internally facing surface. The grooved, sintered wick comprises a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between said at least two adjacent lands that comprises less than about six average particle diameters.

6945317, Sep 20, 2005

Apr 24, 2003

10/422878

Scott D. Garner - Lititz PA, US
James E. Lindemuth - Litiz PA, US
Jerome E. Toth - Hatboro PA, US
John H. Rosenfeld - Lancaster PA, US
Kenneth G. Minnerly - Lititz PA, US

Thermal Corp. - Stanton DE

F28D015/00

16510426, 29890032

A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.

6972365, Dec 6, 2005

Sep 9, 2003

10/658828

Scott D. Garner - Lititz PA, US

Thermal Corp. - Wilmington DE

H05K007/20

174 163, 361700, 62119

A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e. g. , a second loop thermosyphon, convection fin, or cold plate.