Scott P Overmann, 514108 Rolling Knolls Dr, Allen, TX 75002

7736026, Jun 15, 2010

Jul 1, 2002

10/186851

Bryan R. Teichgraeber - Frisco TX, US
Frank J. Poradish - Plano TX, US
Scott Patrick Overmann - Plano TX, US
Steven P. Krycho - Richardson TX, US

Texas Instruments Incorporated - Dallas TX

F21V 11/00

362294, 362345, 362373

To improve the cooling efficiency and ensure uniform cooling of all portions of the inside back surface of the reflector, a deflector () has been developed. The air deflector () typically encircles the lamp () allowing air () to flow between the deflector () and the lamp (). This air () cools the lamp (). Air () passing between the deflector () and the reflector () is deflected outward to cool the inside surface of the reflector near the lamp (). Because the deflector () is small and is located directly behind the lamp (), it does not block any of the useful light generated by the lamp (). The light striking the deflector () from the lamp (), if not for the deflector (), would have passed through the opening in the reflector () and would have been lost. The deflector () typically has a number of vanes around the perimeter of a cylindrical body portion. The vanes are bent outward at an angle sufficient to force part of the cooling air to flow across the inside back surface of the reflector.

7898724, Mar 1, 2011

Nov 5, 2008

12/264996

Jane Qian Liu - Plano TX, US
Frank Armstrong - Wylie TX, US
Edward Carl Fisher - Lucas TX, US
Scott Patrick Overmann - Allen TX, US
Leatrice Lea Gallman Adams - Plano TX, US

Texas Instruments Incorporated - Dallas TX

G02B 26/00
H01L 23/48

359291, 257735

A packaged electronic device includes a substrate with an upper surface interrupted by a well formed in the substrate. The well has a substrate bottom surface and a substrate sidewall. An electronic device is located in the well over the substrate bottom surface and has a device top surface and a device sidewall. A trench is bounded by the substrate bottom surface, the substrate sidewall and the device sidewall. An encapsulant at least partially fills the trench and contacts the substrate sidewall and the device sidewall. The encapsulant has a first elevation on the substrate sidewall with respect to the substrate bottom surface and a second elevation on the substrate device sidewall with respect to the substrate bottom surface that is at least about 35% greater than the first elevation.

8493289, Jul 23, 2013

Nov 5, 2007

11/935078

Scott Patrick Overmann - Allen TX, US
Daniel J. Morgan - Denton TX, US

Texas Instruments Incorporated - Dallas TX

G09G 3/00

345 32, 345204, 345205

Scanning mirror based display system and method. A method comprises sampling a scanned light provided by a scanning mirror, converting the sampled scanned light into an electrical signal, analyzing the electrical signal to determine a position of the scanned light, and controlling the light source or the scanning mirror based on the analyzed electrical signal. The electrical signal based on the sampled scanned light may be used to ensure proper operation of the scanning mirror display system, such as determining failure of the scanning mirror, proper rendering of colors, determining whether the scanned light is following a desired scan path at a desired scan rate, and so forth.

2003008, May 8, 2003

Sep 12, 2002

10/242156

Scott Overmann - Wylie TX, US
John McKinley - Plano TX, US
Clarence Martin - Ardmore OK, US
Jacky Grimmett - Carrollton TX, US
John O'Connor - Ft. Worth TX, US

H01K001/62

315/032000

A method and mechanism for cooling a display device having an extremely bright light focused on its surface and is mounted inside a closed chassis, by conducting heat from the device directly to the chassis walls where the heat is then transferred to the lower temperature air of the ambient surroundings. The mechanism uses an adjustable mechanical linkage to close the gap and make a good thermal contact between the projection device package or heat sink stud and the chassis wall This approach reduces the requirements for large heat sinks and noisy cooling fans found in many conventional projection systems.

2009013, May 28, 2009

Nov 26, 2007

11/945090

Scott P. Overmann - Allen TX, US
Amit A. Kulkarni - Highland Village TX, US
Daniel J. Morgan - Denton TX, US

H04M 1/00

4555751

According to one embodiment of the disclosure, a wireless telephone generally includes a housing and a heat spreading member. The housing encases a plurality of electrical components of a wireless telephone. The heat spreading member is in thermal communication with at least two distally located portion for reducing a thermal gradient over the surface of the housing.

2010003, Feb 11, 2010

Aug 11, 2008

12/189470

Scott Patrick Overmann - Allen TX, US
Steve Smith - Allen TX, US

Texas Instruments Incorporated - Dallas TX

G03B 21/16
F28F 7/00

353 61, 165 803

Provided in one embodiment is a heatsink. The heatsink may include a rib having first and second opposing surfaces. The heatsink may further include a first set of fins extending from the first surface, and a second set of fins extending from the second surface. The heatsink may further include one or more mounts configured to secure one or more solid state illumination sources to the rib.

2020019, Jun 18, 2020

Dec 12, 2018

16/218468

- Dallas TX, US
Scott Patrick Overmann - Parker TX, US
Sean Christopher O'Brien - Dallas TX, US

H05K 7/20
B60K 35/00
G02B 27/01
G02F 1/1333

In described examples, an image-generating panel is arranged for modulating a projection beam to include a modulated optical image. A cooling device is arranged to transfer heat received from the image-generating panel to a heat sink. The cooling device is arranged to receive the projection beam on a first side and to transmit the projection beam from a second side. The heat received from the image-generating panel can include heat generated by the image-generating panel in response to incidental sunlight.