Scott Allen Southwick, 61277 W Canyon Crest Rd, Alpine, UT 84004

6350180, Feb 26, 2002

May 15, 2001

09/858286

Scott A. Southwick - Boise ID

Micron Technology, Inc. - Boise ID

B24B 100

451 41, 451 6, 451 8, 451 9, 451 59, 451296, 451303, 451287

Methods for predicting polishing characteristics of polishing pads in mechanical or chemical-mechanical planarization of microelectronic substrate assemblies, and methods and machines for planarizing microelectronic substrate assemblies. One embodiment of a method in accordance with the invention includes ascertaining a surface parameter of a bearing surface of at least one raised feature projecting from a base portion of a raised feature polishing pad. The raised feature, for example, can be a pyramidal structure having a first cross-sectional area at the base portion of the pad and a second cross-sectional area at the bearing surface. The first cross-sectional area is generally greater than the second cross-sectional area. To ascertain the surface parameter of the bearing surface, one particular embodiment of the invention involves determining an indication of the surface area of the bearing surface. The surface area of the bearing surface can be estimated by illuminating the bearing surface with a light source and detecting an intensity of the light reflected from the bearing surface.

6358127, Mar 19, 2002

Jun 28, 2000

09/607507

David W. Carlson - Windham ME
Scott A. Southwick - Boise ID
Scott E. Moore - Meridian ID

Micron Technology, Inc. - Boise ID

B24B 2902

451 67, 451 41, 451 57

A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders.

6361400, Mar 26, 2002

May 15, 2001

09/858291

Scott A. Southwick - Boise ID

Micron Technology, Inc. - Boise ID

B24B 4900

451 6, 451 8, 451 9, 451 41, 451 59, 451287, 451288, 451296, 451303

Methods for predicting polishing characteristics of polishing pads in mechanical or chemical-mechanical planarization of microelectronic substrate assemblies, and methods and machines for planarizing microelectronic substrate assemblies. One embodiment of a method in accordance with the invention includes ascertaining a surface parameter of a bearing surface of at least one raised feature projecting from a base portion of a raised feature polishing pad. The raised feature, for example, can be a pyramidal structure having a first cross-sectional area at the base portion of the pad and a second cross-sectional area at the bearing surface. The first cross-sectional area is generally greater than the second cross-sectional area. To ascertain the surface parameter of the bearing surface, one particular embodiment of the invention involves determining an indication of the surface area of the bearing surface. The surface area of the bearing surface can be estimated by illuminating the bearing surface with a light source and detecting an intensity of the light reflected from the bearing surface.

6368193, Apr 9, 2002

Oct 10, 2000

09/686361

David W. Carlson - Windham ME
Scott A Southwick - Boise ID
Scott E. Moore - Meridian ID

Micron Technology, Inc. - Boise ID

B24B 2902

451 66, 451168, 451173, 451307

A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders.

6394883, May 28, 2002

Jun 28, 2000

09/607515

David W. Carlson - Windham ME
Scott A. Southwick - Boise ID
Scott E. Moore - Meridian ID

Micron Technology, Inc. - Boise ID

B24B 2902

451 66, 451168, 451173, 451307, 451539, 451461

A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or, finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders.

6749489, Jun 15, 2004

Apr 11, 2002

10/121825

David W. Carlson - Windham ME
Scott A. Southwick - Boise ID
Scott E. Moore - Meridian ID

Micron Technology, Inc. - Boise ID

B24B 100

451 66, 457 67, 457168, 457173, 457307, 457539, 457461

A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders.

6769967, Aug 3, 2004

May 24, 2000

09/578265

Scott A. Southwick - Boise ID

Micron Technology, Inc. - Boise ID

B24B 5300

451 56, 451 41, 451 54, 451287, 451443, 451444

An apparatus and method for refurbishing fixed-abrasive polishing pads. In one embodiment, a refurbishing device has an arm positionable over the planarizing surface of the polishing pad, a refurbishing element attached to one end of the arm, and an actuator connected to the other end of the arm. The refurbishing element has a non-abrasive contact medium engageable with the planarizing surface of the polishing pad that does not abrade or otherwise damage raised features on the fixed-abrasive pad under desired conditioning down forces. The actuator moves the arm downwardly and upwardly with respect to the planarizing surface to engage and disengage the non-abrasive contact medium with the planarizing surface of the polishing pad. The refurbishing device may also have a conditioning solution dispenser positionable proximate to the planarizing surface of the polishing pad to dispense a liquid conditioning solution onto the planarizing surface. The conditioning solution is selected from a liquid that reacts or otherwise interacts with the particular waste matter material to allow the non-abrasive contact medium to remove waste matter material from the polishing pad.

6817928, Nov 16, 2004

Aug 29, 2001

09/944798

David W. Carlson - Windham ME
Scott A. Southwick - Boise ID
Scott E. Moore - Meridian ID

Micron Technology, Inc. - Boise ID

B24B 2902

451 41, 451 67, 451 57

A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders.