Stephen L Christianson, 759631 116Th Ter, Overland Park, KS 66210

2022035, Nov 3, 2022

Jul 18, 2022

17/866775

- Santa Clara CA, US
Konika Ganguly - Portland OR, US
George Vergis - Portland OR, US
Stephen Christianson - Tigard OR, US
Xiaopeng Dong - Portland OR, US

Intel Corporation - Santa Clara CA

H05K 1/11
H05K 1/18
H05K 1/14

An example of an apparatus may comprise a first set of compression contact pads formed on a first side of a circuit board, a second set of compression contact pads formed on a second side of the circuit board opposite to the first side of the circuit board, where the first set of compression contact pads are respectively electrically connected to the second set of compression pads. An example of the circuit board may include a memory board. An example stackable memory module may include memory devices mounted to both sides of the memory board. Other examples are disclosed and claimed.

2022021, Jul 7, 2022

Mar 22, 2022

17/700972

- Santa Clara CA, US
Konika Ganguly - Portland OR, US
George Vergis - Portland OR, US
Stephen Christianson - Tigard OR, US
Xiaopeng Dong - Hillsboro OR, US
Landon Hanks - Milwaukie OR, US

Intel Corporation - Santa Clara CA

H05K 1/14
H05K 1/11
H05K 1/18

An embodiment of an electronic apparatus comprises a circuit board, one or more memory devices affixed to a top side of the circuit board, and one or more board-to-board connectors affixed to a bottom side of the circuit board to provide an external connection to signals of the one or more memory devices, where the one or more board-to-board connectors are located inward from outermost edges of the circuit board and where a first footprint defined by an outermost boundary of the one or more board-to-board connectors is substantially a same size as or smaller than a second footprint defined by an outermost boundary of the one or more memory devices. Other embodiments are disclosed and claimed.

2021037, Dec 2, 2021

Mar 26, 2021

17/214766

- Santa Clara CA, US
Stephen P. Christianson - Tigard OR, US
Esteban Torres Pineda - Liberia, CR

Intel Corporation - Santa Clara CA

H01Q 1/22
H04B 5/00
H01Q 1/38

In one embodiment, an apparatus includes first and second via structures in a substrate. Each via structure defines a coupling element that extends from the via structure toward the other via structure such that the coupling elements capacitively couple with one another in an area between the first and second via structures.