Stephen E Sox, 59460 Oliveta Pl, La Canada, CA 91011

7888176, Feb 15, 2011

Sep 10, 2009

12/557205

Tse E. Wong - Los Alamitos CA, US
Samuel D. Tonomura - Rancho Palos Verdes CA, US
Stephen E. Sox - La Canada CA, US
Timothy E. Dearden - Torrance CA, US
Clifton Quan - Arcadia CA, US
Polwin C. Chan - Monterey Park CA, US
Mark S. Hauhe - Hermosa Beach CA, US

Raytheon Company - Waltham MA

H01L 21/00

438108, 438113, 438116, 438123, 257E21503, 257E23069, 257E23144, 257E23153

In one or more embodiments, a method of producing a stacked integrated circuit assembly includes providing a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC may be disposed between the substrate and the SFIC. The method includes making at least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

2008017, Jul 31, 2008

Jan 25, 2007

11/698602

Tse E. Wong - Los Alamitos CA, US
Samuel D. Tonomura - Rancho Palos Verdes CA, US
Stephen E. Sox - La Canada CA, US
Timothy E. Dearden - Torrance CA, US
Clifton Quan - Arcadia CA, US
Polwin C. Chan - Monterey Park CA, US
Mark S. Hauhe - Hermosa Beach CA, US

H01L 23/538
H01L 27/14
H01L 21/70

257778, 257428, 438460, 438 68, 257E23169, 257E27122, 257E21532

A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC is disposed between the substrate and the SFIC. The stacked integrated circuit assembly includes least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

2009026, Oct 29, 2009

Apr 29, 2008

12/150568

Ethan S. Heinrich - San Pedro CA, US
Alberto F. Viscarra - Torrance CA, US
Jennifer G. Wensel - Redondo Beach CA, US
Stephen E. Sox - La Canada CA, US

F16B 33/00
F16B 43/00

411369, 4113711

A fastener assembly including an elongate fastener adapted to extend through a chamber having a longitudinal axis, a first end and a second end; a first seal disposed at least partially at the first end of the fastener to prevent leakage of fluid from the chamber; and a second seal disposed at least partially at the second end of the fastener to prevent leakage of fluid from the chamber. In a specific embodiment, the first and second seals are conical seals and a third seal is provided by a gasket. The invention also provides a method for securing a fluid filled chamber to a surface comprising the steps of: placing an insert onto the surface such that a first end of the insert abuts the surface; placing the chamber onto the surface whereby the insert extends through an opening therethrough; threading a first end of a threaded fastener through the insert into the surface thereby closing a first lower seal arrangement; and securing the chamber to the surface by sealing the chamber with a nut thereby closing a second seal arrangement with respect to the chamber.

2018012, May 3, 2018

Oct 31, 2016

15/339208

- Waltham MA, US
Samuel D. Tonomura - Rancho Palos Verdes CA, US
Stephen E. Sox - La Canada CA, US

H01L 25/065
H01L 23/31
H01L 23/367
H01L 29/161
H01L 29/20

A hybrid micro-circuit device has multiple layers overlying a printed circuit board (PCB), including a first semiconductor chip component that is electrically connected to the PCB, and a second semiconductor chip component that is electrically connected to first semiconductor chip component. A molding compound surrounds the stack of components that includes the semiconductor chip components. This molding compound may include pillars that are higher than the height of the stacked components. The pillars of molded material may be configured to receive most of the stress from other components over the stacked components. The pillars of molded material may also help define a recess between the stack components and the other components that overlie the stacked components, where a thermal interface material (TIM) may be located. Further, there may be an air gap between parts of the semiconductor chip components.