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Steve S Chiang, 585307 Brookside Ct, Pleasanton, CA 94588

Known as:
Steve Song Yueh Chiang Steve F Chiang Steven Song Yueh Chiang Steve Song Yueh Chen Steven S Chiang Steve S Chang
Related to:
Janice Hsu Chen 55

Steve Chiang Phones & Addresses

5307 Brookside Ct, Pleasanton, CA 94588    925-8999156   

41765 Covington Dr, Fremont, CA 94539    408-7997638   

44317 Arapaho Ave, Fremont, CA 94539    510-6563637    510-6564347   

San Jose, CA   

Moraga, CA   

Alameda, CA   

El Dorado, CA   

Ithaca, NY   

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Steve Chiang resumes & CV records

Resumes

Steve Chiang Photo 37

Student At University Of San Francisco

Location:
San Francisco Bay Area
Industry:
Financial Services
Steve Chiang Photo 38

Steve Chiang

Location:
Pleasanton, CA
Work:
Uci
Education:
Uc Irvine 2001 - 2005
Steve Chiang Photo 39

Steve Chiang

Location:
San Francisco, CA
Industry:
Retail
Steve Chiang Photo 40

Steve Chiang

Steve Chiang Photo 41

Senior Visual Designer At Cisco Systems

Position:
Senior Visual Designer at Cisco Systems
Location:
San Francisco Bay Area
Industry:
Semiconductors
Work:
Cisco Systems since Jan 2010
Senior Visual Designer Infinera Jan 2009 - Jan 2010
Senior Web Designer Transmeta Corporation Apr 2001 - Jan 2009
Senior Web Designer Grayboxx.com Jun 2007 - Apr 2008
Web Designer Atstream Networks Apr 2000 - Feb 2001
Senior Web Designer Audiohighway.com Sep 1999 - Apr 2000
Senior Web Designer Myers Internet, Inc May 1999 - Sep 1999
Web Designer Handa-Lopez, Inc. Jun 1997 - Apr 1999
Web Designer Computer Curriculum Corporation Nov 1996 - May 1997
Graphic Artist
Education:
Masters Institute of Technology 1998 - 2000
BS, Multimedia Communication & Presentations
Skills:
Photoshop, Illustrator, Flash Animation, Flash Builder, HTML, CSS3, Cinema 4D, After Effects, Graphic Design, Web Design, Visual Design, Prototype, Motion Graphics, Dreamweaver, 3D Modeling, Experience Design

Publications & IP owners

Us Patents

Antifuse Structure Suitable For Vlsi Application

US Patent:
6603187, Aug 5, 2003
Filed:
Feb 23, 2000
Appl. No.:
09/513249
Inventors:
Guobiao Zhang - ElGerrito CA
Chenming Hu - Alamo CA
Steve S. Chiang - Saratoga CA
Assignee:
Actel Corporation - Sunnyvale CA
International Classification:
H01L 2900
US Classification:
257530, 257751, 257761, 257763
Abstract:
The present invention relates to a high performance, high reliability antifuse using conductive electrodes. According to first and second embodiments, the problem of switch-off in conductor-to-conductor antifuses is solved by utilizing conductive electrode materials having a relatively lower thermal conductivity than prior art electrode materials and by utilizing relatively thin electrodes, thus increasing their thermal resistance. According to a third embodiment, a relatively thin barrier layer is placed between one or both of the low thermal conductivity electrodes and the antifuse material to prevent reaction between the conductive electrodes and the antifuse material, or the materials used in manufacturing. According to a fourth embodiment, low thermal conductivity conductors are used for both electrodes in the conductor-to-conductor antifuse to achieve enhanced reliability and freedom from switch-off. According to a fifth embodiment, switch-off is cured in conductor-to-conductor antifuses without compromising low on-state resistance of the antifuse.

Methods For Depositing, Releasing And Packaging Micro-Electromechanical Devices On Wafer Substrates

US Patent:
6995034, Feb 7, 2006
Filed:
Aug 30, 2004
Appl. No.:
10/930342
Inventors:
Satyadev R. Patel - Sunnyvale CA, US
Andrew G. Huibers - Palo Alto CA, US
Steve S. Chiang - Saratoga CA, US
Assignee:
Reflectivity, INC - Sunnyvale CA
International Classification:
H01L 21/00
US Classification:
438 64, 438 67, 438 68, 438107, 438110, 438458
Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

Methods For Depositing, Releasing And Packaging Micro-Electromechanical Devices On Wafer Substrates

US Patent:
6995040, Feb 7, 2006
Filed:
Mar 29, 2005
Appl. No.:
11/093943
Inventors:
Satyadev R. Patel - Sunnyvale CA, US
Andrew G. Huibers - Palo Alto CA, US
Steve S. Chiang - Saratoga CA, US
Assignee:
Reflectivity, Inc - Sunnyvale CA
International Classification:
H01L 21/44
US Classification:
438107, 438118
Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

Methods For Depositing, Releasing And Packaging Micro-Electromechanical Devices On Wafer Substrates

US Patent:
7198982, Apr 3, 2007
Filed:
Mar 29, 2005
Appl. No.:
11/093550
Inventors:
Satyadev R. Patel - Sunnyvale CA, US
Andrew G. Huibers - Palo Alto CA, US
Steve S. Chiang - Saratoga CA, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 21/06
H01L 21/00
US Classification:
438107, 438 27, 438 50, 257E21238
Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

Methods For Depositing, Releasing And Packaging Micro-Electromechanical Devices On Wafer Substrates

US Patent:
7286278, Oct 23, 2007
Filed:
Apr 7, 2005
Appl. No.:
11/102204
Inventors:
Satyadev R. Patel - Sunnyvale CA, US
Andrew G. Huibers - Palo Alto CA, US
Steve S. Chiang - Saratoga CA, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
G02B 26/00
G02B 5/08
G03B 21/00
G03B 21/28
H01L 21/00
US Classification:
359290, 359291, 359850, 359295, 359298, 353 31, 353 50, 353 97, 438107
Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

Methods For Depositing, Releasing And Packaging Micro-Electromechanical Devices On Wafer Substrates

US Patent:
7307775, Dec 11, 2007
Filed:
Jun 11, 2002
Appl. No.:
10/167361
Inventors:
Andrew G. Huibers - Palo Alto CA, US
Steve Chiang - Saratoga CA, US
Robert M. Duboc - Menlo Park CA, US
Thomas J. Grobelny - Snohomish WA, US
Hung Nan Chen - Kaohsiung, TW
Dietrich Dehlinger - Sebastopol CA, US
Peter W. Richards - Palo Alto CA, US
Hongqin Shi - San Jose CA, US
Anthony Sun - San Jose CA, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
G02B 26/00
US Classification:
359291, 359290, 359292, 359298
Abstract:
A projection system, a spatial light modulator, and a method for forming a MEMS device is disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micromirror array. The two substrates can be bonded at the wafer level after depositing a getter material andlor solid or liquid lubricant on one or both of the wafers. The wafers can be bonded together hermetically if desired, and the pressure between the two substrates can be below atmosphere.

Methods For Depositing, Releasing And Packaging Micro-Electromechanical Devices On Wafer Substrates

US Patent:
7449358, Nov 11, 2008
Filed:
Mar 29, 2005
Appl. No.:
11/093927
Inventors:
Satyadev R. Patel - Sunnyvale CA, US
Andrew G. Huibers - Palo Alto CA, US
Steve S. Chiang - Saratoga CA, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 21/00
US Classification:
438 58, 438 68, 438108, 438113, 438118, 438458
Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

Methods For Depositing, Releasing And Packaging Micro-Electromechanical Devices On Wafer Substrates

US Patent:
7573111, Aug 11, 2009
Filed:
Apr 7, 2005
Appl. No.:
11/101939
Inventors:
Satyadev R. Patel - Sunnyvale CA, US
Andrew G. Huibers - Palo Alto CA, US
Steve S. Chiang - Saratoga CA, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 29/00
US Classification:
257414, 257E21001
Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

Possible Relatives

David F Chiang  Dean S Chiang  Daniel M Chiang  Della L Chiang  Danny L Chiang  Doris Chiang  Eddie T Chiang  Steve E Johnson  Steve J Standley  Steve C White 

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