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Sunghoon Lee, 50Schenectady, NY

Known as:
Sung Hoon Lee
Related to:
Dylan Lee Michael Lee Renato B Lee

Sunghoon Lee Phones & Addresses

Rexford, NY   

Clifton Park, NY   

Portland, OR   

Hillsboro, OR   

107 Wilson St, Albany, CA 94710    510-5243471   

1071 Monroe St, Albany, CA 94706    510-5243471   

Berkeley, CA   

El Cerrito, CA   

13614 NW Hogan St, Portland, OR 97229   

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Mentions for Sunghoon Lee

Sunghoon Lee resumes & CV records

Resumes

Sunghoon Lee Photo 28

Www.pencilwithflame.com

Location:
Etobicoke, Ontario, Canada
Industry:
Design
Education:
Academy of Art University 2008 - 2011
Sheridan College 2007
Bachelor of Fine Arts Animation
Sunghoon Lee Photo 29

Ph. D At Penn State University

Position:
Ph.D at Penn State University
Location:
University Park, Pennsylvania
Industry:
Research
Work:
Penn State University since Aug 2006
Ph.D Seagate Technology May 2007 - Aug 2007
Summer Intern
Education:
Penn State University 2006 - 2010
Ph. D Candidate, Materials Science and Engineering Korea Advanced Institute of Science and Technology 2004 - 2006
MS, Materials Science and Engineering Hanyang University 1997 - 2004
BA, Materials Science and Engineering

Publications & IP owners

Us Patents

Cmp Pad With Designed Surface Features

US Patent:
7226345, Jun 5, 2007
Filed:
Dec 9, 2005
Appl. No.:
11/297964
Inventors:
David Dornfeld - Berkeley CA, US
Sunghoon Lee - Albany CA, US
Assignee:
The Regents of The University of California - Oakland CA
International Classification:
B24D 13/14
US Classification:
451285, 451 41, 451 56, 451287, 51398
Abstract:
A polishing pad for use with a polishing composition is disclosed. The polishing pad includes a layer having a first material, and polishing structures having a second material, where the plurality of polishing structures form a temporary reservoir region for the polishing composition. The second material is harder than the first material.

Polishing Pad With Protruded Polishing Structures, System For Manufacturing The Same, And Method For Manufacturing The Same

US Patent:
2022041, Dec 29, 2022
Filed:
Apr 29, 2022
Appl. No.:
17/733951
Inventors:
- Rexford NY, US
Sunghoon LEE - Rexford NY, US
International Classification:
B24B 37/26
B24B 37/24
B24D 18/00
Abstract:
A method for fabricating a polishing pad including a plurality of polishing structures includes providing a mold having a top surface and a bottom surface, the mold including a plurality of recesses that correspond to polishing structures formed on the top surface thereof; dispensing a polymer mix on the mold and allowing the polymer mix to fill the plurality of recesses to be formed as the polishing structures; laminating a base film on the top surface of the mold; curing the polymer mix to allow the polymer mix to adhere to the base film and to form the polishing structures on the base film; and demolding the base film and the polishing structures from the mold to obtain a polishing pad sheet. Subsequently, the polishing pad sheet is cut into a plurality of polishing pads.

Possible Relatives

Cynthia E Lee  David Lee  Cyril O Lee  Davida H Lee  Davina N Lee  Davis R Lee  Davon D Lee 

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