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Susan A Radford, 76121 Wildwood Ln, Thonotosassa, FL 33592

Known as:
Susan Arlene Radford Susan Redford
Related to:
Daniel T Radford 73

Susan Radford Phones & Addresses

Thonotosassa, FL   

Albuquerque, NM   

Syracuse, NY   

3825 Mountain View Ave, Longmont, CO 80503    303-6512783   

Clare, IA   

Sarasota, FL   

3825 Mountain View Ave, Longmont, CO 80503   

Work

Position: Food Preparation and Serving Related Occupations

Education

Degree: Bachelor's degree or higher
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Susan Radford resumes & CV records

Resumes

Susan Radford Photo 35

Susan Radford

Susan Radford Photo 36

Susan Radford

Susan Radford Photo 37

Susan Radford

Skills:
Microsoft Office, Microsoft Word, Powerpoint, Research, Customer Service
Susan Radford Photo 38

Susan Radford

Susan Radford Photo 39

Susan Radford

Location:
United States

Publications & IP owners

Us Patents

Hybrid Bga And Qfp Chip Package Assembly And Process For Same

US Patent:
2001002, Sep 20, 2001
Filed:
May 22, 2001
Appl. No.:
09/863943
Inventors:
Susan Radford - Fort Collins CO, US
Gerald D'Amato - Loveland CO, US
International Classification:
H01L021/44
H01L021/48
H01L023/48
H01L029/40
H01L023/28
US Classification:
257/738000, 257/787000, 257/797000, 257/773000, 257/782000, 257/786000, 438/613000, 438/618000, 438/666000, 438/112000, 438/124000, 438/127000, 438/401000
Abstract:
The present invention provides a hybrid chip package that utilizes a high-speed BGA structure and a plurality of flexible and reliable QFP leads. More specifically, the QFP leads are attached to a peripheral region of a substrate to surround the attached BGA structure and replace solder bumps of a conventional BGA structure that would typically flack or crack during operational cycles to create an electrical open between the conventional BGA package and the attached printed circuit board.

Hybrid Bga And Qfp Chip Package Assembly And Process For Same

US Patent:
6261869, Jul 17, 2001
Filed:
Jul 30, 1999
Appl. No.:
9/365037
Inventors:
Susan K. Radford - Fort Collins CO
Gerald J. D'Amato - Loveland CO
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H01L 2124
US Classification:
438123
Abstract:
The present invention provides a hybrid chip package that utilizes a high-speed BGA structure and a plurality of flexible and reliable QFP leads. More specifically, the QFP leads are attached to a peripheral region of a substrate to surround the attached BGA structure and replace solder bumps of a conventional BGA structure that would typically flack or crack during operational cycles to create an electrical open between the conventional BGA package and the attached printed circuit board.

Possible Relatives

David E Radford  Cyrus S Radford  Dean R Radford  Deanna M Radford  Dana C Radford  Daniel T Radford  Aaron W Radford  Susan Johnson  Susan K Standish  Susan M Standley 

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