Terry L Munson, 633103 Whitehouse Dr, Kokomo, IN 46902

2006001, Jan 19, 2006

May 27, 2005

11/140432

Lawrence Kay - Los Angeles CA, US
Terry Munson - Kokomo IN, US
Erik Severin - Pasadena CA, US

B23K 35/34

148023000

A solder paste comprises a lead-free solder powder, a flux and an active additive in the flux. The active additive comprises a material that scavenges metal oxide from molten solder, is a stable liquid at reflow soldering temperature, and has the ability to assimilate oxide of at least one metal in the solder. A preferred active additive is dimer acid present in the range of from 0.5 to 2.5% percent by weight of the paste. Sound joint are obtained when the paste is used in a reflow soldering process wherein the peak reflow temperature is preferably less than 245 C.

2011018, Aug 4, 2011

Feb 4, 2010

12/700019

Steven Cook - Vega TX, US
Pierce Pillon - Amarillo TX, US
Kevin Pawlowski - Amarillo TX, US
Richard M. Hoffman - Bolton MA, US
Terry Munson - Kokomo IN, US

ILLINOIS TOOL WORKS INC. - Glenview IL

B08B 3/08

134 2218

A method of cleaning a pharmaceutical cell that can be carried out onsite in a pharmacy. In particular, the method can be used to clean a pharmaceutical super cell. The method includes placing the cell in a resealable container; adding a wash solution to the resealable container; sealing the resealable container; shaking the sealed container; pouring the wash solution out of the resealable container; and rinsing the cell by repeating the preceding steps using a rinse solution in place of the wash solution. The wash solution may include soap, alcohol, and/or a surfactant. The rinse solution may include deionized water and/or isopropyl alcohol, for example.

5783938, Jul 21, 1998

Feb 24, 1997

8/804795

Terry L. Munson - Kokomo IN
Douglas O. Pauls - Sheridan IN

Contamination Studies Laboratories, Inc. - Kokomo IN

G01N 104
G01R 2710

324 712

An apparatus and test method for determining the cleanliness (based on corrosivity) of a specific area on an electronic circuit assembly, such as the area between holes or pads on a single side of an assembly. The apparatus includes: (1) an extraction cell for providing an extraction fluid to an electronic circuit assembly ("ECA") area to be measured; (2) an extraction fluid for extracting residue from the ECA area to be measured; (3) a test cell with two or more electrodes and a voltage source for providing a voltage to the electrodes; and (4) a timer for measuring the time between the application of the voltage and an electrical short between the electrodes. The method includes: (1) positioning an extraction cell over an electronic circuit assembly area to be measured; (2) dispensing an extraction fluid into the extraction cell; (3) contacting the ECA area to be measured with the extraction fluid for a time sufficient to extract residue from the ECA area; (4) transferring the extraction fluid to a test cell made of two or more electrodes; (5) applying a voltage to the electrodes; and (6) measuring the time between the application of the voltage and an electrical short between the electrodes.

2018008, Mar 29, 2018

Nov 10, 2017

15/809039

- Kokomo IN, US
Terry L. Munson - Kokomo IN, US

G01R 31/28
G01R 1/04

A method for protecting an assembled circuit board by providing a layer of rosin micro-spheres directly on the components to be protected, heating the micro-spheres to a temperature of about 65 C. for a time sufficient to cause the micro-spheres to flow and the rosin to crosslink, and then allowing the board to cool until the rosin returns to its solid state. The rosin micro-spheres may be put onto the board and components by first loading the microspheres onto a transfer tape and then positioning the transfer tape, microspheres down, over the components to be protected. After the rosin is heated the tape may be removed. The method is effective for protecting assembled boards against airborne S to prevent creep corrosion of the copper metallization, and for protecting against Sn to prevent the formation of tin whiskers in tin-plated or soldered lead-free assemblies.

2016009, Apr 7, 2016

Oct 6, 2015

14/875790

- Kokomo IN, US
Terry L. Munson - Kokomo IN, US

C09D 5/08
C08K 5/05
H05K 3/28
C09D 193/04

A method for protecting an electronic circuit board by covering the board with a composition comprising rosin and a carrier and allowing the composition to dry. The coating may be provided by spraying over all or selected parts of an assembled board, or as an underfill by microdispensing under one or more components.The rosin-containing composition may include 20% to 95% rosin and 5% to 80% of a carrier, although 30% to 80% rosin and 20% to 70% carrier, or even 30% to 50% rosin and 50% to 70% carrier, may be more preferred.The carrier may be an alcohol, such as isopropyl alcohol, and should be free of flux activators.

2014026, Sep 18, 2014

Mar 17, 2014

14/215494

- Kokomo IN, US
Terry L. Munson - Kokomo IN, US

G01N 27/30

204400

A test cell for analyzing residue on the surface of a microelectronic component includes a cleaning tip with an opening at one end for passing cleaning fluid into the chamber and for passing used cleaning fluid out of the chamber, and an opening at the other end to access a test area in which cleaning fluid may contact the surface of a component to be tested. A third opening for venting the cleaning tip chamber to the atmosphere may also be provided. A common cleaning/aspiration passageway communicates with the cleaning tip chamber through the first opening. A cleaning passageway provides fresh cleaning fluid to the cleaning/aspiration passageway. An aspiration passageway removes used cleaning fluid from the cleaning/aspiration passageway. An analysis chamber in fluid communication with the aspiration passageway has electrodes effective for qualitatively and/or quantitatively measuring residue removed from the microelectronic surface by the cleaning fluid.

2014015, Jun 5, 2014

Dec 4, 2013

14/096095

- Kokomo IN, US
Terry L. Munson - Kokomo IN, US

G01R 31/28

32475001

A device for monitoring a working environment in which electronic circuit boards are present includes: a) test circuit boards with pairs of traces and circuitry for determining the electrical resistance between the traces, the test boards being positioned in a pathway effective for directing air across the test traces; b) control elements for controlling the flow of air through the pathway and for controlling power applied to the test board traces; c) data storage for storing data relating to acceptable electrical resistance between test traces; d) circuitry for comparing measured electrical resistance between two test traces to a stored value for the acceptable electrical resistance between two test traces; and e) an output for communicating the results of the comparison between the measured electrical resistance between two test traces and the stored value for the acceptable electrical resistance between two test traces.