Thomas K Bliven DeceasedPhoenix, AZ
Thomas Bliven Phones & Addresses
Phoenix, AZ
Scottsdale, AZ
Camp Pendleton, CA
Mentions for Thomas K Bliven
Publications & IP owners
Us Patents
Structural Frame - Window Pane Assembly
US Patent:
4010585, Mar 8, 1977
Filed:
Nov 5, 1973
Appl. No.:
5/412739
Inventors:
Thomas G. Bliven - Scottsdale AZ
International Classification:
E06B 362
E06B 322
E04F 1906
E06B 322
E04F 1906
US Classification:
52308
Abstract:
A structural frame - window pane assembly includes a single-piece frame member shaped and dimensioned to receive and enclose the periphery of the window pane, and a window pane retained within the frame by a pair of spaced inwardly projecting resiliently deformable flanges formed integrally on the inner periphery of the frame member to receive and sealingly engage the edges of the pane. An elongate slot is provided in the frame through which the pane is inserted.
Gateless Injection Mold For Encapsulating Semiconductor Devices
US Patent:
4003544, Jan 18, 1977
Filed:
Mar 24, 1975
Appl. No.:
5/561203
Inventors:
Thomas G. Bliven - Scottsdale AZ
John R. Hugill - Phoenix AZ
John R. Hugill - Phoenix AZ
Assignee:
Motorola, Inc. - Chicago IL
International Classification:
B29C 600
US Classification:
249 95
Abstract:
In the step of plastic encapsulation of a semiconductive device, the inner ends of a group of leads comprising part of a lead frame, the semiconductive chip and the connections between the chip and the inner ends of the leads, are put into a cavity of a mold and fluid encapsulating material is forced into the cavity to surround the elements that are in the cavity with encapsulating material. A lead frame, which may be supplied in strip form, is provided, a part of which is so formed as to act as a gate for the admission of fluid encapsulating material into the mold cavity.
Combination Strip Frame For Semiconductive Device And Gate For Molding
US Patent:
3950140, Apr 13, 1976
Filed:
Feb 18, 1975
Appl. No.:
5/550436
Inventors:
Thomas G. Bliven - Scottsdale AZ
John R. Hugill - Phoenix AZ
John R. Hugill - Phoenix AZ
Assignee:
Motorola, Inc. - Phoenix AZ
International Classification:
B32B 1500
US Classification:
291935
Abstract:
In the step of plastic encapsulation of a semiconductive device, the inner ends of a group of leads comprising part of a lead frame, the semiconductive chip and the connections between the chip and the inner ends of the leads, are put into a cavity of a mold and fluid encapsulating material is forced into the cavity to surround the elements that are in the cavity with encapsulating material. A lead frame, which may be supplied in strip form, is provided, a part of which is so formed as to act as a gate for the admission of fluid encapsulating material into the mold cavity.
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