BackgroundCheck.run
Search For

Thomas E Cipolla8 Benson Rd, Bethel, CT 06801

Thomas Cipolla Phones & Addresses

8 Benson Rd, Bethel, CT 06801    203-7921742   

Brookfield, CT   

8 Benson Rd, Bethel, CT 06801    203-7880625   

Work

Position: Craftsman/Blue Collar

Education

Degree: Associate degree or higher

Mentions for Thomas E Cipolla

Career records & work history

Lawyers & Attorneys

Thomas Cipolla Photo 1

Thomas Cipolla

Medicine Doctors

Thomas J. Cipolla

Specialties:
Internal Medicine
Work:
Mary P Mattheos MD
350 W Montauk Hwy, Lindenhurst, NY 11757
631-2260388 (phone) 631-2262992 (fax)
Languages:
English, Spanish
Description:
Mr. Cipolla works in Lindenhurst, NY and specializes in Internal Medicine. Mr. Cipolla is affiliated with Good Samaritan Regional Medical Center.

Thomas Cipolla resumes & CV records

Resumes

Thomas Cipolla Photo 26

Middle School Teacher/Coach At Belton Isd

Position:
Middle School Teacher/Coach at Belton ISD
Location:
Temple, Texas
Industry:
Primary/Secondary Education
Work:
Belton ISD since Aug 2011
Middle School Teacher/Coach
USF-I Feb 2010 - Aug 2011
III Corps Commander/DCG-O Commander's Action Group-Operations
1st Cavalry Division Feb 2008 - Feb 2009
G5 Chief of Plans
1st Cavalry Division Jun 2007 - Feb 2008
Executive Officer to the Commanding General
1st Cavalry Division (2BCT) Apr 2006 - Jun 2007
Brigade Operations Officer (S3)
1st Cavalry Division (4-9 CAV) Jul 2005 - Apr 2006
Squadron Operations Officer (S3)
1st Cavalry Division Jun 2004 - Jul 2005
Division Maneuver Planner
Education:
School for Advanced Military Studies 2003 - 2004
MMAS, Advanced Military Studies Program
United States Military Academy at West Point 1987 - 1991
Bachelor's of Science, Leadership (BS&L)
Skills:
Operational Planning, Program Management, Management Consulting, DoD, Army, National Security, Military, Security Clearance, Command, Military Operations, Military Experience, Leadership Development, Leadership, Defense, Government, Intelligence, Public Speaking
Thomas Cipolla Photo 27

Thomas Cipolla

Location:
United States

Publications & IP owners

Us Patents

Portable Computer Stand For Enhanced Cooling

US Patent:
6414842, Jul 2, 2002
Filed:
Apr 5, 2000
Appl. No.:
09/543702
Inventors:
Thomas Mario Cipolla - Katonah NY
George Liang-Tai Chiu - Cross River NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06F 120
US Classification:
361687, 361680
Abstract:
A stand for a portable personal computer including a base including a front side, a back side, a right side, a left side, and a bottom surface. The stand includes at least one stand member interconnectable with the base. The at least one stand member is positionable in a deployed position and a stowed position. In the deployed position the at least one stand member supports at least one portion of the bottom surface of the base at an elevated level with respect to a surface that the portable personal computer is supported by. The at least one stand member engages a surface of the base in the stowed position.

Formed Hinges With Heat Pipes

US Patent:
6507488, Jan 14, 2003
Filed:
Apr 30, 1999
Appl. No.:
09/303379
Inventors:
Thomas Mario Cipolla - Katonah NY
Lawrence Shungwei Mok - Brewster NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06F 120
US Classification:
361687, 361699, 361700, 16510432, 3647081
Abstract:
A computer which possesses a bottom keyboard housing having a rear edge hingedly connected with the lower edge of an openable display assembly, and wherein heat-generating computer electronics contained in the housing has heat removed therefrom through the intermediary of heat pipes which are hingedly connected with at least one heat dissipator located in the display assembly. In essence, the computer incorporates an inexpensive construction of heat pipe hinges employed in the thermal interconnection of the bottom keyboard housing of the portable personal computer containing the keyboard and electronics with the display assembly, wherein the heat pipes are protected from bending stresses prior to assembling the major portions of the portable personal computer, such as the keyboard housing and the display assembly.

Video Camera Integration On A Portable Computer

US Patent:
6587151, Jul 1, 2003
Filed:
Aug 26, 1998
Appl. No.:
09/140572
Inventors:
Thomas Mario Cipolla - Katonah NY
Rama Nand Singh - Bethel CT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H04N 5225
US Classification:
348373, 348552, 348375, 3482071, 34821114, D16202
Abstract:
On a portable computer, a video camera is integrated as a feature by mounting the camera as an assembly made up of a lens and associated pixel electronics in a camera base that is positioned on the perphery of the display in the cover of the portable computer when the cover is open, and the providing of a cavity in the base portion of the portable computer positioned so that the camera assembly enters the cavity when the cover of the portable computer is closed.

Smart Fan Modules And System

US Patent:
6592449, Jul 15, 2003
Filed:
Feb 25, 2002
Appl. No.:
10/083270
Inventors:
Thomas M. Cipolla - Katonah NY
Richard I. Kaufman - Somers NY
Lawrence S. Mok - Brewster NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
F24F 700
US Classification:
454184, 361687, 312236, 415213, 236 491
Abstract:
A fan module including: two or more individual fans, each fan having an air movement means and a motor engaged with the air movement means for accelerating air entering each of the two or more individual fans; a temperature sensor for sensing a temperature associated with the two or more fans and for outputting a first signal corresponding to the temperature; rotational speed sensor for outputting a second signal corresponding to a rotational speed of each of the two or more fans; and a processor for receiving the first and second signals and controlling the two or more individual fans based on the first and second signals.

Cooling Mechanism For An Electronic Device

US Patent:
6752201, Jun 22, 2004
Filed:
Nov 27, 2002
Appl. No.:
10/305879
Inventors:
Thomas M Cipolla - Katonah NY
Tarek J Jamal-Eddine - Brewster NY
Lawrence S Mok - Brewster NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
F28D 1500
US Classification:
165121, 16510433, 16510421
Abstract:
A cooling mechanism having a heat sink, a first conduction device, and a convection device is provided. The first conduction device conducts heat from a heat source to the heat sink. The convection device has a first side, a second side, a peripheral dimension. The heat sink is disposed about the peripheral dimension of the convection device. The convection device draws in air through the first and second sides and forces the air radially outward across the heat sink. A cooling mechanism is also provided wherein the cooling mechanism has a ratio of heat removal in watts to volume in cubic centimeters from about 1:1 to about 3:11 at a sound level of between about 20 and 40 decibels.

Smart Fan Modules And System

US Patent:
6791836, Sep 14, 2004
Filed:
May 14, 2003
Appl. No.:
10/437766
Inventors:
Thomas M. Cipolla - Katonah NY
Richard I. Kaufman - Somers NY
Lawrence S. Mok - Brewster NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06F 120
US Classification:
361687, 361690, 415213, 165 803
Abstract:
A fan module including: two or more individual fans, each fan having an air movement means and a motor engaged with the air movement means for accelerating air entering each of the two or more individual fans; a temperature sensor for sensing a temperature associated with the two or more fans and for outputting a first signal corresponding to the temperature; rotational speed sensor for outputting a second signal corresponding to a rotational speed of each of the two or more fans; and a processor for receiving the first and second signals and controlling the two or more individual fans based on the first and second signals.

Stress Accommodation In Electronic Device Interconnect Technology For Millimeter Contact Locations

US Patent:
6919515, Jul 19, 2005
Filed:
Jan 23, 2001
Appl. No.:
09/768372
Inventors:
Edmund David Blackshear - Wappinger Falls NY, US
Thomas Mario Cipolla - Katonah NY, US
Paul William Coteus - Yorktown Heights NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K001/16
US Classification:
174260, 257737, 257780, 361768
Abstract:
The providing of an array interface of conductive joint members for use in forming interconnections between mating surfaces such as a pad on a surface mount electronic device and contacts on a circuit card where one portion of the conductive joint members are of a relatively elongated or oval outline and are oriented with the longer dimension in one direction to accommodate wiring spacing and another portion oriented in a different direction for accommodating expansion stress. In manufacturing when the relatively elongated shape is oriented with the longer dimension along the wiping motion direction in a screen type forming of the conductive joint members the slurry of material that is to be the conductive joint members fills the openings in the screen more reliably and the areas of the conductive members are more uniform. The invention provides the advantages of an increase in the number of wiring lines, an increase in uniformity of wiped screen deposition conductive joint member formation, ability to employ more than one out of chip and wiring levels in expansion mismatch stress relief, and ability by conductive joint member dimensional alignment to improve reliability and flexibility.

Coined-Sheet-Metal Heatsinks For Closely Packaged Heat-Producing Devices Such As Dual In-Line Memory Modules (Dimms)

US Patent:
7715197, May 11, 2010
Filed:
Jun 5, 2008
Appl. No.:
12/133547
Inventors:
Shurong Tian - Mount Kisco NY, US
Thomas M. Cipolla - Katonah NY, US
Paul W. Coteus - Yorktown Heights NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 7/20
US Classification:
361719, 361704, 361715, 361721, 257718, 257719, 165 803, 165185
Abstract:
A heatsink structure and method for the cooling of closely spaced packaged heat-producing devices, such as dual-in-line memory modules (DIMMs). A folded sheet metal heatsink structure is provided which is constituted of a coined metallic material and which has a large plurality of waffle-shaped ridges extending therefrom constituting additional surface areas which are adapted to enable heat generated by hub chips to pass upwardly and then outwardly through waffle-like ridges and, thus, dissipated to the exterior, thereby imparting an improved degree of cooling to heat-producing components or devices.

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.