Thomas J Spinelli, 87121 Rafkind Rd, Bloomingdale, NJ 07403

4729739, Mar 8, 1988

Sep 15, 1986

6/907953

James A. Coffee - Bellingham MA
Thomas S. Spinelli - Attleboro MA
Harold M. Yevak - Shrewsbury MA
Debra J. Provazza - Seekonk MA
Peter A. Foley - Dighton MA

Texas Instruments Incorporated - Dallas TX

H01R 2372

439 71

A connector for mounting and electrically connecting a chip carrier unit in an electrical circuit has a plurality of electrical contacts secured in openings in the bottom of an electrically insulating body to permit cantilever spring deflection of the contacts in accommodating a chip carrier unit within the connector between the contacts. The contacts comprise wire members of round cross section each having an opposite end bent to be slidable along a narrow line of engagement with an inclined ramp surface on an adjacent side wall of the connector body. Each contact has a bowed portion intermediate the contact ends which is bowed away from the adjacent ramp surface to slidably engage terminals on the chip carrier unit as the unit is inserted into the connector. Engagement with the chip carrier terminals permits selected flattening of the bowed portions of the contacts and sliding of the opposite contact ends on the adjacent side wall ramp surfaces to provide simple beam spring deflection of the contacts in combination with the cantilever spring deflection, thereby to provide a force for resiliently engaging the chip carrier terminals.

4385202, May 24, 1983

Sep 25, 1980

6/191039

Thomas S. Spinelli - Attleboro MA
William G. Manns - Dallas TX
Donald F. Weirauch - Dallas TX

Texas Instruments Incorporated - Dallas TX

H05K 109

174 685

An electronic circuit interconnection system permitting high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i. c. devices with wire-bonded interconnects or the like has economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i. c. devices to maintain bond integrity between the i. c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i. c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together.

4472762, Sep 18, 1984

Nov 1, 1982

6/438137

Thomas S. Spinelli - Attleboro MA
William G. Manns - Dallas TX
Donald F. Weirauch - Dallas TX

Texas Instruments Incorporated - Dallas TX

H05K 109

361386

An electronic circuit interconnection system provides high density mounting on ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i. c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i. c. devices to maintain bond integrity between the i. c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i. c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together.

4706812, Nov 17, 1987

Dec 13, 1982

6/449082

Thomas S. Spinelli - Attleboro MA
Edward J. Deras - Sutton MA

Texas Instruments Incorporated - Dallas TX

B65D 7500
B65D 8530

206332

A package for shipping and dispensing articles such as integrated circuit mounting sockets or the like comprises an extruded, open-ended plastic tube having a reentrant rib formed along one tube side so that the interior tube chamber accommodates the bifurcated lateral outlines of such i. c. sockets in side-by-side serial relation to each other inside the tube with the socket bodies resting on the rib and with the socket terminals suspended and protected on either side of the rib. Segments of the tube material extending around part of the tube periphery near each end of the tube are separated from the tube material along the two opposite sides of each segment and are integrally attached to the tube material at the two opposite ends of the segments, the segments having plastic materials in the end portions of the segments deformed beyond the elastic limit of the tube materials so that the segments are reliably positioned to extend across the tube chamber with one of the sides of each segment disposed to intercept socket bodies inside the chamber and with the widths of the segments oriented to be generally parallel to the tube axis for positively blocking dispensing of sockets from open ends of the tube, the segments each being adapted to be selectively moved out of the tube chamber with a tool for permitting reliable and free dispensing of sockets from an open tube end.

4546406, Oct 8, 1985

May 7, 1984

6/602792

Thomas S. Spinelli - Attleboro MA
William G. Manns - Dallas TX
Donald F. Weirauch - Dallas TX

Texas Instruments Incorporated - Dallas TX

H05K 103

361386

An electronic circuit interconnection system provides high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i. c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i. c. devices to maintain bond integrity between the i. c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i. c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together.

2021035, Nov 11, 2021

May 17, 2021

17/322516

Hamid Pishdadian - Warick RI, US
Thomas A. Spinelli - Staten Island NY, US
Akram A. Khalis - Staten Island NY, US

North American Manufacturing Enterprises d/b/a MHTLighting - Staten Island NY

H05B 45/46
H05B 45/10
H05B 45/20

A system and method for controlling a multiplicity of luminaries connected to a single wire pair. The luminaries contain minimum circuitry to allow dimming and color tuning by pulses on the wire pair without the need for a separate control wire or control communication bus or network. A single luminary can be color tuned to many different colors as well as dimmed and turned on and off. A driver module drives the wire pair and receives commands over a network The driver module contains a pulse generation circuit that generates and applies pulses to the two-wire output. The amplitude of some the pulses control color of the luminary by selecting different LEDs in the luminary to light, while other pulses control brightness.

2020028, Sep 10, 2020

Feb 25, 2020

16/799992

Hamid Pishdadian - Warick RI, US
Thomas A. Spinelli - Staten Island NY, US
Akram A. Khalis - Staten Island NY, US

North American Manufacturing Enterprises d/b/a MHTLighting - Staten Island NY

H05B 45/46
H05B 45/10
H05B 45/20

A system and method for controlling a multiplicity of luminaries connected to a single wire pair. The luminaries contain minimum circuitry to allow dimming and color tuning by pulses on the wire pair without the need for a separate control wire or control communication bus or network. A single luminary can be color tuned to many different colors as well as dimmed and turned on and off. A driver module drives the wire pair and receives commands over a network The driver module contains a pulse generation circuit that generates and applies pulses to the two-wire output. The amplitude of some the pulses control color of the luminary by selecting different LEDs in the luminary to light, while other pulses control brightness.

2020005, Feb 20, 2020

Aug 14, 2018

16/103544

Hamid Pishdadian, JR. - Warick RI, US
Thomas A. Spinelli - Staten Island NY, US
Akram A. Khalis - Staten Island NY, US

North American Manufacturing Enterprises d/b/a MHTLighting - Staten Island NY

H05B 33/08

A system and method for controlling a multiplicity of luminaries connected to a single wire pair. The luminaries contain minimum circuitry to allow dimming and color tuning by pulses on the wire pair without the need for a separate control wire or control communication bus or network. A single luminary can be color tuned to many different colors as well as dimmed and turned on and off. A driver module drives the wire pair and receives commands over a network The driver module contains a pulse generation circuit that generates and applies pulses to the two-wire output. The amplitude of some the pulses control color of the luminary by selecting different LEDs in the luminary to light, while other pulses control brightness.