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Timothy E Dean, 441635 W Pratt Blvd UNIT 2S, Chicago, IL 60626

Known as:
Tim E Dean
Related to:
Luke Leffler Christine T Herrmann 24

Timothy Dean Phones & Addresses

Algonquin, IL   

Lafayette, IN   

Chicago, IL   

Park Ridge, IL   

Algonquin, IL   

1330 Manhatas Trl, Algonquin, IL 60102    847-3465365   

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Company: Dean & Pope, P.C. Address:
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Lawyers & Attorneys

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Timothy Dean - Lawyer

Office:
Dean & Pope, P.C.
Specialties:
Auto Negligence, Defective and Dangerous Products, Construction & Development, Construction & Development, Premises Liability
ISLN:
907963194
Admitted:
1977
University:
Wayne State University, B.A., 1971
Law School:
University of Detroit, J.D., 1977

License Records

Timothy B Dean

Phone:
868-6248663
Licenses:
License #: 56670 - Expired
Category: Health Care
Effective Date: Feb 15, 2013
Expiration Date: Jan 31, 2003
Type: Radiologic Technology

Timothy Dean resumes & CV records

Resumes

Timothy Dean Photo 41

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Labor Consultant
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Timothy Dean

Publications & IP owners

Us Patents

Peelable Circuit Board Foil

US Patent:
6872468, Mar 29, 2005
Filed:
Oct 9, 2003
Appl. No.:
10/682557
Inventors:
Timothy B. Dean - Elk Grove Village IL, US
Gregory J. Dunn - Arlington Heights IL, US
Remy J. Chelini - Crystal Lake IL, US
Claudia V. Gamboa - Chicago IL, US
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
B21C037/02
US Classification:
428615, 428629, 428632, 428640, 428670, 428671, 428697, 428702
Abstract:
In one embodiment, a peelable circuit board foil () has a metal support layer () and a conductive metal foil layer () bonded by an inorganic release material (). The conductive metal foil layer has a an exposed surface () that is coated with a high temperature anti-oxidant barrier () and has a roughness less than 0. 05 microns RMS. In a second embodiment, the peelable printed circuit foil () has a crystallized dielectric oxide layer () disposed on the exposed surface of the conductive metal foil layer and an electrode layer () disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil () that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

Peelable Circuit Board Foil

US Patent:
7241510, Jul 10, 2007
Filed:
May 27, 2005
Appl. No.:
11/139056
Inventors:
Gregory J. Dunn - Arlington Heights IL, US
Remy J. Chelini - Crystal Lake IL, US
Timothy B. Dean - Elk Grove Village IL, US
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
B32B 15/00
US Classification:
428615, 428629, 428632, 428640, 428670, 428671, 428697, 428702, 428704
Abstract:
In one embodiment, a peelable circuit board foil () has a metal support layer () and a conductive metal foil layer () bonded by an inorganic high temperature release structure () that comprises a co-deposited layer () and a metal oxide layer (). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil () has a crystallized dielectric oxide layer () disposed on the metal foil layer and an electrode layer () disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil () that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

Overmolded Electronic Assembly And Overmoldable Interface Component

US Patent:
7390978, Jun 24, 2008
Filed:
Dec 23, 2004
Appl. No.:
11/021429
Inventors:
Timothy B. Dean - Elk Grove Village IL, US
Daniel T. Rooney - Schaumburg IL, US
Jeffrey M. Petsinger - Wayne IL, US
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 23/28
US Classification:
174521, 361737
Abstract:
An overmolded electronic assembly () is fabricated from one or more overmoldable interface components () that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.

Process To Reform A Plastic Packaged Integrated Circuit Die

US Patent:
7434310, Oct 14, 2008
Filed:
Jun 5, 2006
Appl. No.:
11/422233
Inventors:
Timothy B. Dean - Elk Grove Village IL, US
Bruce C. Deemer - Elk Grove Village IL, US
Daniel T. Rooney - Schaumburg IL, US
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H05K 3/02
US Classification:
29847, 294011, 29843, 174528, 257666, 438123, 438459
Abstract:
A process for reforming a plastic packaged integrated circuit die () includes grinding away () a bottom side () of a plastic package () and portions of a set of leads () that are in the plane of the grinding until a bottom surface () of an inner portion () of the set of leads is exposed at a peripheral region () of the inner portion, cutting () approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting () the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.

Possible Relatives

Cynthia K Dean  David Dean  Dawn M Dean  Deanne Dean  Debbie C Dean  Dallas Dean  Dallin D Dean  Timothy Johnson  Timothy C Standfield  Timothy Standish 

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