Todd M Flynn, 5510612 Roy Butler Dr, Austin, TX 78717

6300234, Oct 9, 2001

Jun 26, 2000

9/602099

Todd M. Flynn - Pflugerville TX
Christopher W. Argento - Cedar Park TX
Larry J. Larsen - Bastrop TX

Motorola, Inc. - Schaumburg IL

H01L 2144

438612

The present invention includes a process for forming an electrical device. In one embodiment, the process includes applying a solid patternable film over a substrate and forming a conductive material over the substrate while the solid patternable film overlies the substrate, wherein the conductive material extends at least partially within an opening in the patternable film. In another embodiment, the process includes applying a patterned film over a substrate having a pad and exposing the patterned film and the substrate to energy. The patterned film includes a first region that includes a conductor and a second region that does not have a conductor. The energy of the exposure forms an electrical connection between the conductor and the pad. In yet another embodiment, the process includes mechanically applying a film over a semiconductor device substrate, patterning the film to define a first opening to expose a conductive region within the semiconductor device substrate, forming a first conductive layer within the first opening, and forming a second conductive layer over the first conductive layer.

5904547, May 18, 1999

Dec 26, 1996

8/780119

Todd Flynn - Pflugerville TX

Motorola, Inc. - Schaumburg IL

H01L21/301

438460

An integrated apparatus (10) has a dicing station (14) and a rinsing/heated drying station (16). In one embodiment, the rinsing/heated drying station (16) has a heater, such as an infrared lamp (36), or uses a heated gas. The integrating apparatus (10) helps to decrease the time between dicing and heated drying, which reduces the likelihood of corrosion of C4 bumps (64).

2015016, Jun 18, 2015

Dec 12, 2013

14/104602

Todd M. Flynn - Austin TX, US
Christopher W. Argento - Dripping Springs TX, US
Steven A. Faillaci - Austin TX, US
Thomas H. Lee - Austin TX, US

G01R 31/26
G01R 1/067
G01R 1/04
G01R 31/28

An electronic component test device capable of testing electronic components in a plurality of test configurations. The device includes a probe head for providing a plurality of probe contact structures to an electronic component to be tested. The device includes an interconnect board coupled to the probe head. The interconnect board includes a plurality of conductive terminals, each of a first subset of the plurality of conductive terminals is coupled to one of a group of electrical signal lines for coupling to different types of external signals. The interconnect board includes a plurality of conductive lines. Each conductive line is coupled between a corresponding one of a plurality of conductive terminals in a second subset of the plurality of conductive terminals and a terminal for coupling to one of the plurality of probe contact structures. Each conductive terminal of the second subset is couplable by an interconnector of a plurality of interconnectors to a conductive terminal of multiple conductive terminals of the first subset based on a test configuration of the device.