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Wai Lin Lee, 63Brooklyn, NY

Wai Lee Phones & Addresses

Brooklyn, NY   

Oakland, CA   

New York, NY   

Richmond, CA   

Mentions for Wai Lin Lee

Career records & work history

Lawyers & Attorneys

Wai Lee Photo 1

Wai Lee - Lawyer

Office:
Chiu, Szeto & Cheng
Specialties:
Civil Litigation, Arbitration, Mediation
ISLN:
919742220
Admitted:
1998
Wai Lee Photo 2

Wai Lee - Lawyer

Office:
Eddie Lee & Co.
ISLN:
919751413
Admitted:
2000
Wai Lee Photo 3

Wai Lee - Lawyer

Office:
Cham & Co.
Specialties:
Conveyancing
ISLN:
919732023
Admitted:
1988

Medicine Doctors

Wai Lee Photo 4

Dr. Wai K Lee, Oakland CA - MD (Doctor of Medicine)

Specialties:
Family Medicine
Address:
KAISER PERMANENTE
280 W Macarthur Blvd, Oakland, CA 94611
925-6822400 (Phone)
Certifications:
Family Practice, 2011
Awards:
Healthgrades Honor Roll
Languages:
English
Education:
Medical School
Drexel University College of Medicine
Graduated: 2007
Wai Lee Photo 5

Wai Ping P Lee, San Francisco CA - MSW (Master of Social Work)

Specialties:
Social Work
Clinical Social Work
Address:
3626 Balboa St, San Francisco, CA 94121
415-6685955 (Phone)
Languages:
English
Wai Lee Photo 6

Wai May Lee, New York NY - PT (Physical therapy)

Specialties:
Physical Therapy
Address:
24 5Th Ave Suite 1112, New York, NY 10011
212-2282052 (Fax)
Languages:
English

Wai L. Lee

Specialties:
Rheumatology
Work:
Providence Medical GroupProvidence Medical Group Arthritis Center
5050 NE Hoyt St STE 155, Portland, OR 97213
503-2156819 (phone) 503-2156492 (fax)
Site
Education:
Medical School
Washington University School of Medicine
Graduated: 1995
Procedures:
Arthrocentesis
Conditions:
Ankylosing Spondylitis (AS), Osteoarthritis, Rotator Cuff Syndrome and Allied Disorders, Systemic Lupus Erythematosus, Allergic Rhinitis, Bronchial Asthma, Chronic Sinusitis, Gout, Lateral Epicondylitis, Osteoporosis, Plantar Fascitis, Psoriasis, Raynaud's Disease, Rheumatoid Arthritis
Languages:
English, Spanish
Description:
Dr. Lee graduated from the Washington University School of Medicine in 1995. He works in Portland, OR and specializes in Rheumatology. Dr. Lee is affiliated with Providence Portland Medical Center.

Wai Lee

Specialties:
Colon & Rectal Surgery
Work:
ALSA Medical Group
205 E Riv Park Cir STE 460, Fresno, CA 93720
559-2604500 (phone) 559-2604501 (fax)
Education:
Medical School
University of Virginia School of Medicine
Graduated: 1979
Procedures:
Colonoscopy, Destruction of Lesions on the Anus, Hemorrhoid Procedures, Proctosigmoidoscopy, Sigmoidoscopy
Conditions:
Anal Fissure, Anal or Rectal Abscess, Benign Polyps of the Colon, Celiac Disease, Cholelethiasis or Cholecystitis, Constipation, Diverticulitis, Diverticulosis, Gastritis and Duodenitis, Gastroesophageal Reflux Disease (GERD), Gastrointestinal Hemorrhage, Hemorrhoids, Inflammatory Bowel Disease (IBD), Intestinal Obstruction, Irritable Bowel Syndrome (IBS), Malignant Neoplasm of Colon, Rectal, Abdomen, Small Intestines, or Colon Cancer
Languages:
English, Spanish
Description:
Dr. Lee graduated from the University of Virginia School of Medicine in 1979. He works in Fresno, CA and specializes in Colon & Rectal Surgery. Dr. Lee is affiliated with Fresno Heart & Surgical Hospital.

Wai H. Lee

Specialties:
Cardiovascular Disease
Work:
Beacon Medical GroupElkhart Cardiology
303 S Nappanee St STE B, Elkhart, IN 46514
574-2963466 (phone) 574-2963332 (fax)
Site
Education:
Medical School
University of Rochester School of Medicine and Dentistry
Graduated: 1979
Procedures:
Cardiac Stress Test, Cardioversion, Echocardiogram, Angioplasty, Cardiac Catheterization, Continuous EKG, Electrocardiogram (EKG or ECG), Pacemaker and Defibrillator Procedures
Conditions:
Angina Pectoris, Aortic Valvular Disease, Cardiomyopathy, Acute Myocardial Infarction (AMI), Atrial Fibrillation and Atrial Flutter, Cardiac Arrhythmia, Carditis, Conduction Disorders, Congenital Anomalies of the Heart, Endocarditis, Heart Failure, Ischemic Heart Disease, Mitral Regurgitation, Mitral Stenosis, Mitral Valvular Disease, Paroxysmal Supreventricular Tachycardia (PSVT), Pericardidtis, Valvular Heart Disease
Languages:
English
Description:
Dr. Lee graduated from the University of Rochester School of Medicine and Dentistry in 1979. He works in Elkhart, IN and specializes in Cardiovascular Disease. Dr. Lee is affiliated with Memorial Hospital Of South Bend.

Wai Kwan I. Lee

Specialties:
Obstetrics & Gynecology
Work:
Lutherans Brooklyn Chinese Family Health Center
5008 7 Ave FL 1, Brooklyn, NY 11220
718-2101030 (phone) 718-8710969 (fax)
Education:
Medical School
Albert Einstein College of Medicine at Yeshiva University
Graduated: 1985
Procedures:
Cesarean Section (C-Section), D & C Dilation and Curettage, Hysterectomy, Nutrition Therapy, Tubal Surgery, Vaccine Administration, Vaginal Delivery
Conditions:
Abnormal Vaginal Bleeding, Complicating Pregnancy or Childbirth, Conditions of Pregnancy and Delivery, Breast Disorders, Diabetes Mellitus Complicating Pregnancy or Birth, Female Infertility, Genital HPV, Menopausal and Postmenopausal Disorders, Pregnancy-Induced Hypertension, Spontaneous Abortion, Uncomplicated or Low Risk Pregnancy and Delivery, Uterine Leiomyoma
Languages:
Chinese, English
Description:
Dr. Lee graduated from the Albert Einstein College of Medicine at Yeshiva University in 1985. She works in Brooklyn, NY and specializes in Obstetrics & Gynecology. Dr. Lee is affiliated with Lutheran Medical Center.

Wai Kin R. Lee

Specialties:
Nephrology
Work:
Kaiser Permanente Medical GroupKaiser Permanente South San Francisco Medical Center
1200 El Camino Real, South San Francisco, CA 94080
650-7422000 (phone) 650-7422606 (fax)
Site
Education:
Medical School
Univ of Hong Kong, Fac of Med, Hong Kong
Graduated: 1986
Procedures:
Dialysis Procedures
Conditions:
Acute Renal Failure, Bronchial Asthma, Chronic Renal Disease, Diabetes Mellitus (DM), Septicemia
Languages:
English
Description:
Dr. Lee graduated from the Univ of Hong Kong, Fac of Med, Hong Kong in 1986. He works in South San Francisco, CA and specializes in Nephrology. Dr. Lee is affiliated with Kaiser Permanente Medical Center and UCSF Medical Center Parnassus.

Wai Lee resumes & CV records

Resumes

Wai Lee Photo 50

Wai Lee - Allen, TX

Work:
HealthBridge In-Home Care 2013 to 2000
Business Development
Bamboo Garden COUNTER - Corpus Christi, TX 2011 to 2013
Sole Proprietor/Director of Operations
Core Industries DBA Star Trac - Irvine, CA 2010 to 2011
Territory Manager
The Art Institute - Santa Ana, CA 2007 to 2009
Assistant Director of Admissions - Austin & Santa Ana
iKey Industrial Peripherals - Austin, TX 2007 to 2007
Sales Representative
Dell Inc - Round Rock, TX 2006 to 2007
Inside Sales Rep
Professional Orthopedic & Sports Physical Therapy - New York, NY 2003 to 2005
Athletic Trainer
Athalon Physical Therapy, Office - New York, NY 2002 to 2003
manager/PT aide
University of Texas Sports Medicine - Austin, TX 2000 to 2002
Student Athletic Trainer
Education:
The University of Texas at Austin - Austin, TX 1998 to 2002
B.S. in Kinesiology

Publications & IP owners

Us Patents

Ethylenediaminetetraacetic Acid Or Its Ammonium Salt Semiconductor Process Residue Removal Process

US Patent:
6367486, Apr 9, 2002
Filed:
Aug 10, 2000
Appl. No.:
09/635650
Inventors:
Wai Mun Lee - Fremont CA
Zhefei Jessie Chen - Fremont CA
Assignee:
EKC Technology, Inc. - Hayward CA
International Classification:
B08B 304
US Classification:
134 13, 510175, 510176, 510245, 510255, 510264, 510266, 510499, 134 39, 134 40
Abstract:
An ethylenediaminetetraacetic acid or a mono-, di-, tri- or tetraammonium salt thereof residue cleaning composition removes photoresist and other residue from integrated circuit substrates. The balance of the composition is desirably made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the ethylenediaminetetraacetic acid or a mono-, di-, tri- or tetraammonium salt thereof in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Alkanolamine Semiconductor Process Residue Removal Process

US Patent:
6399551, Jun 4, 2002
Filed:
Nov 22, 1999
Appl. No.:
09/444548
Inventors:
Wai Mun Lee - Fremont CA
Assignee:
EKC Technology, Inc. - Hayward CA
International Classification:
C11D 732
US Classification:
510175, 510176, 510178, 510245, 510255, 510264, 510271, 510499, 510477, 510488, 134 12, 134 13, 134 39
Abstract:
A two carbon atom linkage alkanolamine compound composition comprises the two carbon atom linkage alkanolamine compound, gallic acid or catechol, and optionally, an aqueous hydroxylamine solution. The balance of the composition is made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the two carbon atom linkage alkanolamine compound in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Post Etch Cleaning Composition And Process For Dual Damascene System

US Patent:
6417112, Jul 9, 2002
Filed:
Jun 30, 1999
Appl. No.:
09/343532
Inventors:
Catherine M. Peyne - Hayward CA
David J. Maloney - Livermore CA
Shihying Lee - Fremont CA
Wai Mun Lee - Fremont CA
Leslie W. Arkless - Glasgow, GB
Assignee:
EKC Technology, Inc. - Hayward CA
International Classification:
H01L 21302
US Classification:
438754, 438963, 134 1
Abstract:
A new cleaning chemistry based on a choline compound, such as choline hydroxide, is provided in order to address the problem of dual damascene fabrication. An etch stop inorganic layer at the bottom of a dual damascene structure protects the underlying interconnect of copper and allows a better cleaning. A two step etch process utilizing the etch stop layer is used to achieve the requirements of UISI manufacturing in a dual damascene structure.

Ethyenediaminetetraacetic Acid Or Its Ammonium Salt Semiconductor Process Residue Removal Composition And Process

US Patent:
6492311, Dec 10, 2002
Filed:
Apr 4, 1997
Appl. No.:
08/833382
Inventors:
Wai Mun Lee - Fremont CA
Zhefei Jessie Chen - Fremont CA
Assignee:
EKC Technology, Inc. - Hayward CA
International Classification:
C11D 732
US Classification:
510176, 510175, 510245, 510255, 510477, 510488, 510499
Abstract:
An ethylenediaminetetraacetic acid or a mono- di- tri- or tetraammonium salt thereof residue cleaning composition removes photoresist and other residue from integrated circuit substrates. The balance of the composition is desirably made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the ethylenediaminetetraacetic acid or a mono- di- tri- or tetraammonium salt thereof in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Alkanolamine Semiconductor Process Residue Removal Composition And Process

US Patent:
6564812, May 20, 2003
Filed:
Jun 4, 2002
Appl. No.:
10/160035
Inventors:
Wai Mun Lee - Fremont CA
Assignee:
EKC Technology, Inc. - Hayward CA
International Classification:
B08B 304
US Classification:
134 13, 134 39, 510175, 510176, 510178, 510245, 510255, 510264, 510271, 510499, 510477, 510488
Abstract:
A two carbon atom linkage alkanolamine compound composition comprises the two carbon atom linkage alkanolamine compound, gallic acid or catechol, and optionally, an aqueous hydroxylamine solution. The balance of the composition is made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the two carbon atom linkage alkanolamine compound in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Method Of Making Electronic Materials

US Patent:
6566276, May 20, 2003
Filed:
Jun 6, 2001
Appl. No.:
09/875115
Inventors:
David J. Maloney - Pleasanton CA
Wai M. Lee - Fremont CA
Michael A. Fury - San Francisco CA
Ross H. Hill - Coquitlam, CA
Assignee:
EKC Technology, Inc. - Hayward CA
International Classification:
H01L 2131
US Classification:
438758, 430311, 430312
Abstract:
The present invention involves fabrication of a hard mask. An embodiment involves the conversion of a precursor into a top-surface imaging layer during a direct patterning step. Another embodiment of the present invention is a method of forming an etched pattern in a substrate. A further embodiment of the present invention is a method of forming an implanted region in a substrate. Preferred precursors are formed from a metal complex comprising at least one ligand selected from the group consisting of acac, carboxylato, alkoxy, azide, carbonyl, nitrato, amine, halide, nitro, and mixtures thereof and at least one metal selected from the group consisting of Li, Al, Si, Ti, V, Cr, Mn, Fe, Ni, Co, Cu, Zn, Sr, Y, Zr, Nb, Mo, Ru, Rh, Pd, Ag, In, Sn, Ba, La, Pr, Sm, Eu, Hf, Ta, W, Re, Os, Ir, Pt, Au, Pb, Th, U, Sb, As, Ce, Mg, and mixtures thereof.

Method Of And Apparatus For Substrate Pre-Treatment

US Patent:
6696363, Feb 24, 2004
Filed:
Jun 6, 2001
Appl. No.:
09/874330
Inventors:
Wai M. Lee - Fremont CA
David J. Maloney - Pleasanton CA
Paul J. Roman - Pleasanton CA
Michael A. Fury - San Francisco CA
Ross H. Hill - Coquitlam, CA
Clifford Henderson - Conyers GA
Sean Barstow - Atlanta GA
Assignee:
EKC Technology, Inc. - Hayward CA
International Classification:
H01L 2144
US Classification:
438681, 430312, 427100
Abstract:
The present invention relates generally to a method and apparatus for converting a precursor material, preferably organometallic, to a film, preferably metal-containing, that is adherent to at least a portion of a substrate. Both method and apparatus include a pre-conversion step or section, and a step or section for substantial conversion of a portion of material from the pre-conversion step or section into the form of a predetermined pattern, wherein this substantial conversion results in a metal-containing patterned layer on the substrate.

Compositions For Cleaning Organic And Plasma Etched Residues For Semiconductor Devices

US Patent:
6777380, Aug 17, 2004
Filed:
Jul 10, 2001
Appl. No.:
09/903064
Inventors:
Robert J. Small - Dublin CA
Bakul P. Patel - Pleasanton CA
Wai Mun Lee - Fremont CA
Douglas Holmes - Bridge of Weir, GB
Jerome Daviot - Glasgow, GB
Chris Reid - Glasgow, GB
Assignee:
EKC Technology, Inc. - Hayward CA
International Classification:
G03C 500
US Classification:
510176, 510175, 510245, 430329, 134 13, 252 791
Abstract:
A composition for the stripping of photoresist and the cleaning of residues from substrates, and for silicon oxide etch, comprising from about 0. 01 percent by weight to about 10 percent by weight of one or more fluoride compounds, from about 10 percent by weight to about 95% by weight of a sulfoxide or sulfone solvent, and from about 20 percent by weight to about 50 percent by weight water. The composition may contain corrosion inhibitors, chelating agents, co-solvents, basic amine compounds, surfactants, acids and bases.

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