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Walter A Wolk, 67140 Middle River Rd, Danbury, CT 06811

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Copper-Based Metal Polishing Compositions And Polishing Processes

US Patent:
2007021, Sep 20, 2007
Filed:
Jul 19, 2006
Appl. No.:
11/488682
Inventors:
Jonathan J. Wolk - Bethel CT, US
Walter A. Wolk - Bethel CT, US
Assignee:
Nissan Chemical Industries, Ltd. - Tokyo
International Classification:
C09K 13/00
H01L 21/461
B44C 1/22
H01L 21/302
C03C 15/00
US Classification:
438692, 252 791, 216 88, 216 89
Abstract:
A copper-based metal polishing composition includes abrasive particles, a borate, an oxidizing agent, and water. A process for polishing a semiconductor substrate includes positioning the semiconductor substrate; polishing the positioned semiconductor substrate with a first polishing composition including abrasive particles, an ammonium borate, an oxidizing agent, and water, and having a pH of from 6.5 to 9; and further polishing the polished semiconductor substrate with a second polishing composition including abrasive particles, a potassium borate, an oxidizing agent, and water, and having a pH of from 7 to 10.

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