Wayne R Storr, 74Honolulu, HI

6219238, Apr 17, 2001

May 10, 1999

9/307890

Frank E. Andros - Binghampton NY
Michael A. Gaynes - Vestal NY
Hussain Shaukatullah - Tucson AZ
Wayne R. Storr - New Milford PA

International Business Machines Corporation - Armonk NY

H05K 720

361704

A structure for removably attaching a heat sink to an electronic package. At least one heat sink engaging member engages a surface of the heat sink opposite a surface of the heat sink engaging the electronic package. At least two heat sink retaining clips extend from opposite sides of the at least one heat sink engaging member. Each retaining clip includes a first arm for extending past a side of the heat sink and a portion of the electronic package and a second arm extending from the first member for engaging the electronic package.

6150716, Nov 21, 2000

Jan 15, 1997

8/783775

Stephen Wesley MacQuarrie - Vestal NY
Wayne Russell Storr - New Milford PA
James Warren Wilson - Vestal NY

International Business Machines Corporation - Armonk NY

H01L 2334

257709

A package for mounting an integrated circuit chip to a circuit board or the like is provided. The package includes a chip carrier which has a metal substrate including first and second opposed faces. A dielectric coating is provided on at least one of the faces, which preferably is less than about 20 microns in thickness, and preferably has a dielectric constant from about 3. 5 to about 4. Electrical circuitry is disposed on the dielectric coating, said circuitry including chip mounting pads, connection pads and circuit traces connecting the chip mounting pads to the connection pads. An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon. In any case, the IC chip is electrically connected to the chip mounting pads either by the solder ball or wire bond connections. Electrical leads extend from the connection pads on the chip carrier and are connected to corresponding pads on a circuit board or the like to provide I/O signals for the IC chip.

6131278, Oct 17, 2000

Oct 25, 1999

9/426577

Stephen W. MacQuarrie - Vestal NY
Wayne R. Storr - New Milford PA
James W. Wilson - Vestal NY

International Business Machines Corporation - Armonk NY

H05K 334

29840

A package for mounting an integrated circuit chip to a circuit board or the like is provided. The package includes a chip carrier which has a metal substrate including first and second opposed faces. A dielectric coating is provided on at least one of the faces, which preferably is less than about 20 microns in thickness, and preferably has a dielectric constant from about 3. 5 to about 4. Electrical circuitry is disposed on the dielectric coating, said circuitry including chip mounting pads, connection pads and circuit traces connecting the chip mounting pads to the connection pads. An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon. In any case, the IC chip is electrically connected to the chip mounting pads either by the solder ball or wire bond connections. Electrical leads extend from the connection pads on the chip carrier and are connected to corresponding pads on a circuit board or the like to provide I/O signals for the IC chip.